专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07859278B2 Probe holder for a probe for testing semiconductor components 有权
标题翻译：用于测试半导体元件的探头的探头支架
公开(公告)号：US07859278B2
公开(公告)日：2010-12-28
申请号：US11674205
申请日：2007-02-13
申请人： Dietmar Runge , Stojan Kanev , Claus Dietrich
发明人： Dietmar Runge , Stojan Kanev , Claus Dietrich
IPC分类号： G01R1/04
CPC分类号： G01R1/07342
摘要： A probe holder in which the probe needle has a slight horizontal offset under the action of a vertical force comprises a probe holder for a probe needle, wherein the holder is adapted, for fastening and electrical contact-connection, on a carrier device of a test apparatus and has a holder arm having a needle holder at the free end thereof to fasten the probe needle, and a fastening arm for connecting the holder arm to the carrier device. The holder arm and fastening arm are connected to one another by a parallel guide whereby horizontal offset of the needle tip on account of external forces can be reduced or even prevented making it easier for the probe needle to carry out a vertical yielding movement, with almost no rotation of the probe needle about a horizontal axis.
摘要翻译：其中探针在垂直力作用下具有轻微水平偏移的探针支架包括用于探针的探针支架，其中该支架用于紧固和电接触连接在测试的载体装置上装置，并且具有在其自由端具有针保持器的保持臂，用于固定探针，以及用于将保持臂连接到承载装置的紧固臂。保持臂和紧固臂通过平行的引导件彼此连接，由此可以减少或甚至防止针尖由于外力引起的水平偏移，从而使探针更容易进行垂直屈服运动，几乎可以探头针绕水平轴不旋转。

2. 发明授权

US08368413B2 Method for testing electronic components of a repetitive pattern under defined thermal conditions 有权
标题翻译：在确定的热条件下测试重复图案的电子部件的方法
公开(公告)号：US08368413B2
公开(公告)日：2013-02-05
申请号：US13119916
申请日：2009-09-01
申请人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
发明人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
IPC分类号： G01R31/00
CPC分类号： G01R31/319 , G01R1/07392 , G01R31/2891
摘要： The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the probes (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.
摘要翻译：本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件（1）的方法，其包括用于保持部件（1）的卡盘（10）和用于保持个人的特殊保持装置（15）探针（12）。为了测试，将组件（1）调节到限定的温度，探针（12）和第一电子部件（1）通过至少一个定位装置相对于彼此定位，所述接触垫（3）电子部件（1）随后被探针（12）接触，使得可以测试部件（1），然后可以重复定位和接触以测试重复图案的另一部件（1）。为了缩短在变化的温度下进行测量的测试时间，同时通过使用单个探针确保部件的可靠接触，组件（1）通过第一定位步骤定位和接触，第一定位步骤共同影响首先执行的所有探头（12）在中间位置，其结果是部件（1）位于探针尖端（13）下方的限定距离处，每个单独的探针尖端（13）的位置随后通过单独的操纵器被校正到相应的接触垫（3）与特定探针尖端（13）接触，使得每个探针尖端（13）位于接触垫（3）上方，并且探针尖端（13）进一步随后与通过前进运动，组件（1）的接触垫（3）。

3. 发明申请

US20130027070A1 METHOD AND DEVICE FOR CONTACTING A ROW OF CONTACT AREAS WITH PROBE TIPS 有权
标题翻译：用于与接触区域接触的方法和设备与探测器提示
公开(公告)号：US20130027070A1
公开(公告)日：2013-01-31
申请号：US13640432
申请日：2010-04-13
申请人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
发明人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
IPC分类号： G01R1/067
CPC分类号： G01R31/2891
摘要： The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle α in a range of 0 to 180°.
摘要翻译：本发明总体上涉及用于使接触区域（22）与测试仪中的探针尖端（18）接触的方法和装置。布置在基板（6）上的接触区域（22）和探针尖端（18）相对于彼此定位，然后通过前进运动彼此接触。为了检测每个探针尖端（18）的牢固接触，从至少两个观察方向（34）观察探针尖端（18）和接触区域（22）之间的接触，其中包括观察角 α在0〜180度的范围内。

4. 发明授权

US07057408B2 Method and prober for contacting a contact area with a contact tip 有权
标题翻译：用于将接触区域与接触尖端接触的方法和探测器
公开(公告)号：US07057408B2
公开(公告)日：2006-06-06
申请号：US10879622
申请日：2004-06-29
申请人： Stefan Schneidewind , Claus Dietrich , Jörg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jürgen Fleischer
发明人： Stefan Schneidewind , Claus Dietrich , Jörg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jürgen Fleischer
IPC分类号： G01R31/02
CPC分类号： G01R31/2886
摘要： A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
摘要翻译：接触区域与探针中的接触针尖（接触尖端）接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的接触小尺寸接触垫时的接触面和接触面积。探测器基本上包括具有移动装置的基架，该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。接触尖端的接触最初需要半导体晶片的水平定位，使得接触面和接触尖端彼此之间并且彼此间隔一定距离，随后沿接触尖端的方向垂直移动，直到接触尖端与接触区域的接触被建立。该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的，为此目的，观察装置以这样的方式布置，使得观察轴以间隔在自由晶片表面上方。

5. 发明申请

US20050007135A1 Method and prober for contacting a contact area with a contact tip 有权
标题翻译：用于将接触区域与接触尖端接触的方法和探测器
公开(公告)号：US20050007135A1
公开(公告)日：2005-01-13
申请号：US10879622
申请日：2004-06-29
申请人： Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jurgen Fleischer
发明人： Stefan Schneidewind , Claus Dietrich , Jorg Kiesewetter , Stojan Kanev , Stefan Kreissig , Frank Fehrmann , Hans-Jurgen Fleischer
IPC分类号： G01R31/28 , G01R31/02
CPC分类号： G01R31/2886
摘要： A method of contacting a contact area with the tip of a contact needle (contact tip) in a prober and the arrangement of such a prober, is based on the object of ensuring reliable contacting and direct observation of the establishment of the contact between the contact tip and the contact area when contacting contact pads of small dimensions. The prober substantially includes a base frame with a movement device including a clamping fixture for receiving a semiconductor wafer and also contact needles, which are arranged opposite the free surface of the semiconductor wafer. The contacting of the contact tips initially requires a horizontal positioning of the semiconductor wafer, so that the contact area and the contact tip are one above the other and at a distance from each other, and subsequently moving vertically in the direction of the contact tip, until a contact of the contact tips with the contact area is established. The object is achieved by the vertical movement of the semiconductor wafer until the end position is reached being directly observed in a horizontal direction of observation and, for this purpose, an observation device is arranged in such a way that the observation axis runs in the spacing above the free wafer surface.
摘要翻译：接触区域与探针中的接触针尖（接触尖端）接触的方法以及这种探测器的布置的方法基于确保可靠接触和直接观察触点之间的接触的建立的目的接触小尺寸接触垫时的接触面和接触面积。探测器基本上包括具有移动装置的基架，该移动装置包括用于接收半导体晶片的夹持夹具以及与半导体晶片的自由表面相对布置的接触针。接触尖端的接触最初需要半导体晶片的水平定位，使得接触面和接触尖端彼此之间并且彼此间隔一定距离，随后沿接触尖端的方向垂直移动，直到接触尖端与接触区域的接触被建立。该目的是通过半导体晶片的垂直移动直到达到最终位置在水平观察方向上直接观察为目的，为此目的，观察装置以这样的方式布置，使得观察轴以间隔在自由晶片表面上方。

6. 发明申请

US20110221461A1 METHOD FOR TESTING ELECTRONIC COMPONENTS OF A REPETITIVE PATTERN UNDER DEFINED THERMAL CONDITIONS 有权
标题翻译：根据定义的热条件测试重复图案的电子元件的方法
公开(公告)号：US20110221461A1
公开(公告)日：2011-09-15
申请号：US13119916
申请日：2009-09-01
申请人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
发明人： Stojan Kanev , Frank Fehrmann , Jens Fiedler , Claus Dietrich , Jörg Kiesewetter
IPC分类号： G01R31/00
CPC分类号： G01R31/319 , G01R1/07392 , G01R31/2891
摘要： The invention relates to a method for testing several electronic components (1) of a repetitive pattern under defined thermal conditions in a prober, which comprises a chuck (10) for holding the components (1) and special holding devices (15) for holding individual probes (12). For testing, the components (1) are adjusted to a defined temperature, the (12) and a first electronic component (1) are positioned relative to each other by means of at least one positioning device, contact pads (3) of the electronic component (1) are subsequently contacted by the probes (12) so that the component (1) can be tested and then the positioning and the contacting can be repeated for testing another component (1) of the repetitive pattern. In order to shorten the test time for measurements at changing temperatures while ensuring reliable contacting of the components by using individual probes, a component (1) is positioned and contacted by a first positioning step which jointly affects all probes (12) first being carried out in an intermediate position, in the result of which the component (1) lies at a defined distance under the probe tips (13), the position of each individual probe tip (13) being subsequently corrected by means of separate manipulators to the position of the corresponding contact pad (3) to be contacted with the particular probe tip (13) so that each probe tip (13) lies above a contact pad (3), and the probe tips (13) further subsequently being brought into contact with the contact pads (3) of the component (1) by means of an advancing movement.
摘要翻译：本发明涉及一种用于在探测器中在限定的热条件下测试多个重复图案的电子部件（1）的方法，其包括用于保持部件（1）的卡盘（10）和用于保持个人的特殊保持装置（15）探针（12）。为了测试，组件（1）被调节到限定的温度，（12）和第一电子部件（1）通过至少一个定位装置相对于彼此定位，电子的接触垫（3）组件（1）随后被探针（12）接触，使得可以测试组件（1），然后重复定位和接触以测试重复图案的另一组件（1）。为了缩短在变化的温度下进行测量的测试时间，同时通过使用单个探针确保部件的可靠接触，组件（1）通过第一定位步骤定位和接触，第一定位步骤共同影响首先执行的所有探头（12）在中间位置，其结果是部件（1）位于探针尖端（13）下方的限定距离处，每个单独的探针尖端（13）的位置随后通过单独的操纵器被校正到相应的接触垫（3）与特定探针尖端（13）接触，使得每个探针尖端（13）位于接触垫（3）上方，并且探针尖端（13）进一步随后与通过前进运动，组件（1）的接触垫（3）。

7. 发明授权

US09110131B2 Method and device for contacting a row of contact areas with probe tips 有权
标题翻译：用于将一排接触区域与探针接头接触的方法和装置
公开(公告)号：US09110131B2
公开(公告)日：2015-08-18
申请号：US13640432
申请日：2010-04-13
申请人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
发明人： Claus Dietrich , Stojan Kanev , Frank Fehrmann , Botho Hirschfeld
IPC分类号： G01R1/067 , G01R31/28
CPC分类号： G01R31/2891
摘要： The invention generally relates to a method and device for contacting contact areas (22) with probe tips (18) in a tester. The contact areas (22), which are arranged on a substrate (6), and the probe tips (18) are positioned relative to each other and then brought in contact with each other by an advancing motion. In order to detect a secure contact for each of the probe tips (18), the contacting between the probe tips (18) and the contact areas (22) is observed from at least two observation directions (34), which include an observation angle α in a range of 0 to 180°.
摘要翻译：本发明总体上涉及用于使接触区域（22）与测试仪中的探针尖端（18）接触的方法和装置。布置在基板（6）上的接触区域（22）和探针尖端（18）相对于彼此定位，然后通过前进运动彼此接触。为了检测每个探针尖端（18）的牢固接触，从至少两个观察方向（34）观察探针尖端（18）和接触区域（22）之间的接触，其中包括观察角 α在0〜180度的范围内。

8. 发明授权

US07579854B2 Probe station and method for measurements of semiconductor devices under defined atmosphere 有权
标题翻译：探测台和测量在确定的气氛下的半导体器件的方法
公开(公告)号：US07579854B2
公开(公告)日：2009-08-25
申请号：US11943975
申请日：2007-11-21
申请人： Jörg Kiesewetter , Stefan Kreissig , Stojan Kanev , Claus Dietrich
发明人： Jörg Kiesewetter , Stefan Kreissig , Stojan Kanev , Claus Dietrich
IPC分类号： G01R31/02
CPC分类号： G01R31/2881
摘要： A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.
摘要翻译：描述了适用于在大气条件下偏离环境条件的半导体衬底的测试的探测器。探测器包括用于安装半导体衬底的卡盘和用于安装用于半导体衬底的电接触的测试尖端的探针保持器。半导体衬底和测试尖端布置在相对于周围大气密封的壳体内。壳体包括与密封件连接的两个壳体部件。密封件可以用两种不同的压力充气，并且在较高压力下可变形较小。为了测试半导体衬底，半导体衬底相对于测试尖端的粗略定位发生在大气条件下，然后在密封件的较高压力下产生密封件的较低可变形性之前用密封壳体和可变形密封件进行精细定位，半导体衬底被测试头接触并进行测试。

9. 发明申请

US20080143365A1 PROBE STATION AND METHOD FOR MEASUREMENTS OF SEMICONDUCTOR DEVICES UNDER DEFINED ATMOSPHERE 有权
标题翻译：探测台和定义大气半导体器件测量方法
公开(公告)号：US20080143365A1
公开(公告)日：2008-06-19
申请号：US11943975
申请日：2007-11-21
申请人： Jorg Kiesewetter , Stefan Kreissig , Stojan Kanev , Claus Dietrich
发明人： Jorg Kiesewetter , Stefan Kreissig , Stojan Kanev , Claus Dietrich
IPC分类号： G01R31/26
CPC分类号： G01R31/2881
摘要： A prober is described that is suitable for testing of semiconductor substrates under atmospheric conditions that deviate from ambient conditions. The prober includes a chuck for mounting of a semiconductor substrate and a probe holder for mounting of test tips for electrical contacting of the semiconductor substrate. The semiconductor substrate and test tips are arranged within a housing sealed relative to the surrounding atmosphere. The housing comprises two housing parts joined with a seal. The seal can be inflated with two different pressures and is less deformable at higher pressure. For testing of the semiconductor substrate, coarse positioning of the semiconductor substrate relative to the test tips occurs under atmospheric conditions and then fine positioning with the sealed housing and deformable seal before the lower deformability of the seal is produced at higher pressure in the seal and the semiconductor substrate is contacted by the test tips and tested.
摘要翻译：描述了适用于在大气条件下偏离环境条件的半导体衬底的测试的探测器。探测器包括用于安装半导体衬底的卡盘和用于安装用于半导体衬底的电接触的测试尖端的探针保持器。半导体衬底和测试尖端布置在相对于周围大气密封的壳体内。壳体包括与密封件连接的两个壳体部件。密封件可以用两种不同的压力充气，并且在较高压力下可变形较小。为了测试半导体衬底，半导体衬底相对于测试尖端的粗略定位发生在大气条件下，然后在密封件的较高压力下产生密封件的较低可变形性之前用密封壳体和可变形密封件进行精细定位，半导体衬底被测试头接触并进行测试。

10. 发明授权

US08344744B2 Probe station for on-wafer-measurement under EMI-shielding 有权
标题翻译：探测台用于EMI屏蔽下的晶圆测量
公开(公告)号：US08344744B2
公开(公告)日：2013-01-01
申请号：US12818442
申请日：2010-06-18
申请人： Axel Schmidt , Botho Hirschfeld , Stojan Kanev , Andrej Rumiantsev , Michael Teich
发明人： Axel Schmidt , Botho Hirschfeld , Stojan Kanev , Andrej Rumiantsev , Michael Teich
IPC分类号： G01R31/00
CPC分类号： G01R31/2886 , G01R1/18
摘要： An arrangement is provided for testing DUTs with a chuck that has a support surface for supporting of a DUT as well as for supplying the support surface with a defined potential, or for connecting the DUT. The arrangement further includes a positioning device for positioning the chuck as well as an electromagnetic shielding housing enclosing at least the chuck. Inside the housing and adjacent to the chuck, a signal preamplifier is arranged whose signal port facing the chuck is electrically connected with the support surface, wherein the signal preamplifier is moveable together with the chuck by the positioning device in a way that it holds its position constant relative to the chuck during positioning. The signal preamplifier is connected to a measurement unit outside of the housing via a measurement cable.
摘要翻译：提供了一种用于使用具有用于支撑DUT的支撑表面以及用于向支撑表面提供限定电位或用于连接DUT的卡盘来测试DUT的布置。该装置还包括用于定位卡盘的定位装置以及至少包围卡盘的电磁屏蔽壳体。在壳体内部和卡盘附近，布置了一个信号前置放大器，其信号端口面向卡盘与支撑表面电连接，其中信号前置放大器可以通过定位装置与卡盘一起移动，使其保持其位置在定位期间相对于卡盘是恒定的。信号前置放大器通过测量电缆连接到壳体外部的测量单元。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式