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1. 发明授权

US09063302B2 Optical connector and optical device having the same 有权
标题翻译：光连接器和具有该光连接器的光学装置
公开(公告)号：US09063302B2
公开(公告)日：2015-06-23
申请号：US13443843
申请日：2012-04-10
申请人： Do Won Kim , Gyungock Kim
发明人： Do Won Kim , Gyungock Kim
IPC分类号： G02B6/36 , G02B6/38 , G02B6/42 , G02B6/12
CPC分类号： G02B6/3897 , G02B6/423 , G02B6/4249 , G02B6/4292 , G02B2006/12107
摘要： Provided are an optical connector capable of improving optical alignment efficiency and an optical device having the same. The connector may include a body having a top surface and a bottom surface facing each other, through holes penetrating the body to connect the top and bottom surfaces, and alignment keys provided on at least side surface of the body to be parallel to the through holes.
摘要翻译：提供能够提高光取向效率的光连接器和具有该光连接器的光学装置。连接器可以包括具有顶表面和底表面彼此面对的主体，穿过穿过主体以连接顶表面和底表面的孔以及设置在主体的至少侧表面上以与通孔平行的对准键。

2. 发明授权

US09025920B2 Optical coupling devices and silicon photonics chips having the same 有权
标题翻译：具有相同光耦合器件和硅光子芯片
公开(公告)号：US09025920B2
公开(公告)日：2015-05-05
申请号：US13620560
申请日：2012-09-14
申请人： Do Won Kim , Gyungock Kim
发明人： Do Won Kim , Gyungock Kim
IPC分类号： G02B6/26 , G02B6/42 , G02B6/30 , G02B6/122
CPC分类号： G02B6/305 , G02B6/1228 , G02B2006/12061
摘要： Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.
摘要翻译：提供了具有其的光耦合器件和硅光子芯片。光耦合装置可以包括具有第一区域和第二区域的下层，设置在下层上的第一芯层，第一芯层分别包括设置在第一和第二区域上的第一和第二波导，包层覆盖第一波导，以及插入在包层和下层之间以覆盖第二波导的第二芯层。第二波导的宽度随着距离第一区域的距离增加而减小，并且垂直厚度大于第一波导的垂直厚度。

3. 发明申请

US20110058764A1 ELECTRO-OPTIC MODULATING DEVICE 有权
标题翻译：电光调制装置
公开(公告)号：US20110058764A1
公开(公告)日：2011-03-10
申请号：US12872881
申请日：2010-08-31
申请人： Gyungock KIM , Jeong Woo Park , Jongbum You , Sang Gi Kim , Sanghoon Kim , In Gyoo Kim , Jiho Joo , Duk Jun Kim , Dongwoo Suh , Sahnggi Park , Ki Seok Jang , Junghyung Pyo , Kap-Joong Kim , Do Won Kim , Dae Seo Park
发明人： Gyungock KIM , Jeong Woo Park , Jongbum You , Sang Gi Kim , Sanghoon Kim , In Gyoo Kim , Jiho Joo , Duk Jun Kim , Dongwoo Suh , Sahnggi Park , Ki Seok Jang , Junghyung Pyo , Kap-Joong Kim , Do Won Kim , Dae Seo Park
IPC分类号： G02F1/035
CPC分类号： G02F1/025 , G02F2201/063
摘要： Provided is an electro-optic modulating device. The electro-optic modulating device includes an optical waveguide with a vertical structure and sidewalls of the vertical structure are used to configure a junction.
摘要翻译：提供了一种电光调制装置。电光调制装置包括具有垂直结构的光波导，垂直结构的侧壁用于构造接合部。

4. 发明申请

US20120121218A1 PHOTONICS CHIP AND OPTICAL APPARATUS INCLUDING THE SAME 有权
标题翻译：光电芯片和光学设备，包括它们
公开(公告)号：US20120121218A1
公开(公告)日：2012-05-17
申请号：US13190403
申请日：2011-07-25
申请人： Do Won Kim , Gyungock Kim , JunYeong Lee
发明人： Do Won Kim , Gyungock Kim , JunYeong Lee
IPC分类号： G02B6/12
CPC分类号： G02B6/4292 , G02B6/3644 , G02B6/3652 , G02B6/3885
摘要： Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.
摘要翻译：提供了一种光子学芯片和包括其的光学装置。芯片可以包括基板，光波导，光耦合器和多个对准单元。光波导形成在基板上。光耦合器形成在光波导处。对准单元对准在衬底上固定耦合到光耦合器的至少一个光纤的光连接器。

5. 发明授权

US08761553B2 Optical network structures for multi-core central processor unit 有权
标题翻译：多核中央处理器单元的光网络结构
公开(公告)号：US08761553B2
公开(公告)日：2014-06-24
申请号：US13302371
申请日：2011-11-22
申请人： Sahnggi Park , Gyungock Kim , In Gyoo Kim , Jeong Woo Park , Sang Hoon Kim , Do Won Kim
发明人： Sahnggi Park , Gyungock Kim , In Gyoo Kim , Jeong Woo Park , Sang Hoon Kim , Do Won Kim
IPC分类号： G02B6/26 , G02B6/12
CPC分类号： H04J14/028 , G02B6/12007 , H01S5/026 , H01S5/1032 , H01S5/4087 , H04J14/02 , H04J14/0201
摘要： Provided is an optical network structure. To configure an optical network structure between hundreds or more of cores in a CPU, intersection between waveguides does not occur, and thus, the optical network structure enables two-way communication between all the cores without an optical switch disposed in an intersection point. The present invention enables a single chip optical network using a silicon photonics optical element, and a CPU chip configured with hundreds or thousands of cores can be developed.
摘要翻译：提供了一种光网络结构。为了在CPU中配置数百个或更多个核心之间的光网络结构，不会发生波导之间的交叉，因此，光网络结构在所有核心之间实现双向通信，而光交换机不设置在交叉点。本发明使得能够使用硅光子学光学元件的单芯片光网络，并且可以开发配置有数百或数千个核的CPU芯片。

6. 发明授权

US08548281B2 Electro-optic modulating device 有权
标题翻译：电光调制装置
公开(公告)号：US08548281B2
公开(公告)日：2013-10-01
申请号：US12872881
申请日：2010-08-31
申请人： Gyungock Kim , Jeong Woo Park , Jongbum You , Sang Gi Kim , Sanghoon Kim , In Gyoo Kim , Jiho Joo , Duk Jun Kim , Dongwoo Suh , Sahnggi Park , Ki Seok Jang , Junghyung Pyo , Kap-Joong Kim , Do Won Kim , Dae Seo Park
发明人： Gyungock Kim , Jeong Woo Park , Jongbum You , Sang Gi Kim , Sanghoon Kim , In Gyoo Kim , Jiho Joo , Duk Jun Kim , Dongwoo Suh , Sahnggi Park , Ki Seok Jang , Junghyung Pyo , Kap-Joong Kim , Do Won Kim , Dae Seo Park
IPC分类号： G02F1/025
CPC分类号： G02F1/025 , G02F2201/063
摘要： Provided is an electro-optic modulating device. The electro-optic modulating device includes an optical waveguide with a vertical structure and sidewalls of the vertical structure are used to configure a junction.
摘要翻译：提供了一种电光调制装置。电光调制装置包括具有垂直结构的光波导，垂直结构的侧壁用于构造接合部。

7. 发明授权

US08615149B2 Photonics chip with efficient optical alignment and bonding and optical apparatus including the same 有权
标题翻译：光子芯片具有高效的光学对准和粘合以及包括其的光学设备
公开(公告)号：US08615149B2
公开(公告)日：2013-12-24
申请号：US13190403
申请日：2011-07-25
申请人： Do Won Kim , Gyungock Kim , JunYeong Lee
发明人： Do Won Kim , Gyungock Kim , JunYeong Lee
IPC分类号： G02B6/00 , G02B6/12 , G02B6/36 , H01R43/16
CPC分类号： G02B6/4292 , G02B6/3644 , G02B6/3652 , G02B6/3885
摘要： Provided are a photonics chip and an optical apparatus including the same. The chip may include a substrate, an optical waveguide, an optical coupler, and a plurality of alignment units. The optical waveguide is formed on the substrate. The optical coupler is formed at the optical waveguide. The alignment units align an optical connector which fixes at least one optical fiber coupled to the optical coupler, on the substrate.
摘要翻译：提供了一种光子学芯片和包括其的光学装置。芯片可以包括基板，光波导，光耦合器和多个对准单元。光波导形成在基板上。光耦合器形成在光波导处。对准单元对准在衬底上固定耦合到光耦合器的至少一个光纤的光连接器。

8. 发明申请

US20130156370A1 OPTICAL COUPLING DEVICES AND SILICON PHOTONICS CHIPS HAVING THE SAME 有权
标题翻译：光耦合器件和具有相同功能的硅光电子器件
公开(公告)号：US20130156370A1
公开(公告)日：2013-06-20
申请号：US13620560
申请日：2012-09-14
申请人： Do Won Kim , Gyungock Kim
发明人： Do Won Kim , Gyungock Kim
IPC分类号： G02B6/12 , G02B6/26
CPC分类号： G02B6/305 , G02B6/1228 , G02B2006/12061
摘要： Provided are optical coupling devices and silicon photonics chips having the same. the optical coupling device may include a lower layer having a first region and a second region, a first core layer disposed on the lower layer, the first core layer including first and second waveguides disposed on the first and second regions, respectively, a clad layer covering the first waveguide, and a second core layer interposed between the clad layer and the lower layer to cover the second waveguide. The second waveguide has a width decreasing with increasing distance from the first region and a vertical thickness greater than that of the first waveguide.
摘要翻译：提供了具有其的光耦合器件和硅光子芯片。光耦合装置可以包括具有第一区域和第二区域的下层，设置在下层上的第一芯层，第一芯层分别包括设置在第一和第二区域上的第一和第二波导，包层覆盖第一波导，以及插入在包层和下层之间以覆盖第二波导的第二芯层。第二波导的宽度随着距离第一区域的距离增加而减小，并且垂直厚度大于第一波导的垂直厚度。

9. 发明申请

US20090214158A1 Optical Printed Circuit Board and An Optical Module Connected to the Optical Printed Circuit Board 审中-公开
标题翻译：光学印刷电路板和连接到光学印刷电路板的光学模块
公开(公告)号：US20090214158A1
公开(公告)日：2009-08-27
申请号：US12346305
申请日：2008-12-30
申请人： Tae Woo Lee , Hyo Hoon Park , Do Won Kim
发明人： Tae Woo Lee , Hyo Hoon Park , Do Won Kim
IPC分类号： G02B6/12 , G02B6/38 , B23P11/00
CPC分类号： G02B6/43 , G02B6/3608 , G02B6/3885 , G02B6/3897 , H05K1/0274 , Y10T29/49826
摘要： An optical printed circuit board having an optical waveguide of at least one channel formed therein is provided. The optical waveguide of the at least one channel is stacked in the optical printed circuit board, and has both ends exposed on a surface of the optical printed circuit board and a predetermined length. An optical module is provided which can be optically aligned with the optical printed circuit board or another optical component through guide pins inserted into guide holes.
摘要翻译：提供了具有形成在其中的至少一个通道的光波导的光学印刷电路板。将至少一个通道的光波导堆叠在光学印刷电路板中，并且其两端都露出在光学印刷电路板的表面上并具有预定的长度。提供了一种光学模块，其可以通过插入引导孔的引导销与光学印刷电路板或另一个光学部件光学对准。

10. 发明申请

US20100232741A1 Optical interconnection system using optical waveguide-integrated optical printed circuit board 失效
标题翻译：光互连系统采用光波导集成光电印刷电路板
公开(公告)号：US20100232741A1
公开(公告)日：2010-09-16
申请号：US12227995
申请日：2008-09-22
申请人： Do Won Kim , Tae Woo Lee , Hyo Hoon Park
发明人： Do Won Kim , Tae Woo Lee , Hyo Hoon Park
IPC分类号： G02B6/12 , G02B6/43
CPC分类号： G02B6/43 , G02B6/4214 , H05K1/0274
摘要： An optical interconnection system is provided. The optical interconnection system includes an optical printed circuit board (PCB) that includes transmitter-unit and receiver-unit optical interconnection blocks for bending an optical path by a predetermined angle, an one-unit optical waveguide including an optical waveguide which is inserted into each of the optical interconnection blocks so as to connect optical paths of the transmitter-unit and receiver-unit optical interconnection blocks, and a PCB having the one-unit optical waveguide integrated therein; a light emitting element that is formed in-line with the optical waveguide on an upper surface of the transmitter-unit optical interconnection block exposed to an upper surface of the optical PCB; a driver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light emitting element and the optical PCB; a light receiving element that is formed in-line with the optical waveguide on an upper surface of the receiver-unit optical interconnection block exposed to the upper surface of the optical PCB; and a receiver integrated circuit that is formed on the upper surface of the optical PCB and electrically connected to the light receiving element and the optical PCB. The upper surfaces of the respective optical interconnection blocks are substantially aligned with the upper surface of the PCB
摘要翻译：提供光互连系统。光互连系统包括光学印刷电路板（PCB），其包括用于将光路弯曲预定角度的发射器单元和接收器单元光学互连块，包括插入每个光路中的光波导的单个单元光波导以连接发射机单元和接收机单元光学互连块的光路，以及将其中集成有单一单元光波导的PCB连接在一起; 在与所述光学PCB的上表面露出的所述发射单元光互连块的上表面上与所述光波导成一行的发光元件; 驱动器集成电路，其形成在所述光学PCB的上表面上并电连接到所述发光元件和所述光学PCB; 光接收元件，其在与所述光学PCB的上表面接触的所述接收器单元光互连块的上表面上与所述光波导成一直线; 以及形成在光学PCB的上表面并电连接到光接收元件和光学PCB的接收器集成电路。各个光互连块的上表面基本上与PCB的上表面对齐

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