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1. 发明申请

US20180208816A1 Hot Melt Silicone and Curable Hot Melt Composition 审中-公开
公开(公告)号：US20180208816A1
公开(公告)日：2018-07-26
申请号：US15320513
申请日：2015-06-16
申请人： Dow Corning Toray Co., Ltd.
发明人： Haruna Yamazaki , Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： C09J183/04 , C08L83/04 , C08G77/12 , C08G77/16 , C08K5/56 , C08K5/5419 , C08K3/22
CPC分类号： C09J183/04 , C08G77/12 , C08G77/16 , C08G77/18 , C08G77/20 , C08G77/80 , C08K3/22 , C08K5/5419 , C08K5/56 , C08L83/00 , C08L83/04 , C09D183/04 , C09J11/00
摘要： A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.

2. 发明授权

US09536799B2 Hot-melt type curable silicone composition for compression molding or laminating 有权
标题翻译：用于压缩成型或层压的热熔型可固化硅氧烷组合物
公开(公告)号：US09536799B2
公开(公告)日：2017-01-03
申请号：US14654084
申请日：2013-12-20
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Shin Yoshida , Makoto Yoshitake , Haruna Yamazaki , Masaaki Amako , Steven Swier , Toshiki Nakata
IPC分类号： H01L23/29 , B32B9/04 , H01L21/56 , C08K3/34 , C08K3/36 , C08K3/22 , B32B27/28 , B32B27/08 , B32B7/02 , C09D183/10 , C08G77/50 , C09J183/10 , H01L33/56 , B32B3/30 , H01L33/50 , H01L23/00
CPC分类号： H01L23/296 , B32B3/30 , B32B7/02 , B32B27/08 , B32B27/283 , B32B2250/24 , B32B2264/104 , B32B2307/418 , B32B2307/536 , B32B2457/14 , C08G77/50 , C08K3/22 , C08K3/34 , C08K3/36 , C08K2003/2241 , C08K2201/00 , C09D183/10 , C09J183/10 , H01L21/56 , H01L24/73 , H01L24/97 , H01L33/502 , H01L33/56 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/181 , Y10T428/24612 , Y10T428/24942 , Y10T428/24983 , Y10T428/31663 , H01L2924/00012 , H01L2924/00 , H01L2224/85
摘要： The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.
摘要翻译：本发明涉及一种用于压缩成型或层压的热熔性可固化硅氧烷组合物和包含该组合物的至少一层的层压板，以及使用它们的半导体器件及其制造方法。根据本发明，可以有效地制造设置有半球形透镜或圆顶形密封件的半导体器件。在本发明中，容易控制密封件的形状，并且密封件不含任何气泡。在本发明中，除了密封之外，还容易控制半导体器件的涂层的厚度。

3. 发明授权

US10208164B2 Curable silicone composition, curable hot-melt silicone, and optical device 有权
公开(公告)号：US10208164B2
公开(公告)日：2019-02-19
申请号：US15506834
申请日：2015-08-26
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryota Dogen , Haruna Yamazaki , Makoto Yoshitake
IPC分类号： C08G77/04 , H01L23/29 , H01L23/31 , H01L33/52 , H01L33/56 , C09D183/04 , C08G77/12 , C08G77/16 , C08G77/20 , C08L83/04 , C08G77/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by a specific average unit formula; optionally, (B) an organopolysiloxane represented by a specific average unit formula; (C) an organohydrogenpolysiloxane represented by a specific average composition formula; and (D) a hydrosilylation catalyst. A curable hot-melt silicone is obtained by subjecting the curable silicone composition to a hydrosilylation reaction to a degree that does not form a cured product. The curable hot-melt silicone is non-flowable at 25° C. and has a melt viscosity at 100° C. of 5000 Pa·s or less. The curable silicone composition provides a cured product having excellent heat resistance and light resistance after being cured. The curable hot-melt silicone is non-flowable at room temperature, has low surface stickiness, and is readily melted by heating.

4. 发明授权

US10167418B2 Hot melt silicone and curable hot melt composition 有权
公开(公告)号：US10167418B2
公开(公告)日：2019-01-01
申请号：US15320513
申请日：2015-06-16
申请人： Dow Corning Toray Co., Ltd.
发明人： Haruna Yamazaki , Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： C09J183/04 , C09J11/00 , C08G77/12 , C08G77/16 , C08K3/22 , C08K5/5419 , C08K5/56 , C08L83/04 , C09D183/04 , C08L83/00 , C08G77/18 , C08G77/20 , C08G77/00
摘要： A hot melt silicone that is non-flowable at 25° C. and that has a melt viscosity at 100° C. of 5,000 Pa·s or less, the hot melt silicone being formed by subjecting (A) an alkenyl group-containing organopolysiloxane in which 10 mol % or greater of all of silicon atom-bonded organic groups is a phenyl group, and (B) an organopolysiloxane having at least two silicon atom-bonded hydrogen atoms in a molecule to hydrosilylation reaction in the presence of (C) a hydrosilylation reaction catalyst; and a curable hot melt composition comprising: (I) the hot melt silicone; (II) an organopolysiloxane which has at least two silicon atom-bonded hydrogen atoms in a molecule and in which the amount of silicon atom-bonded hydrogen atom is 0.5 mass % or greater; and (III) a hydrosilylation reaction catalyst. The hot melt silicone is non-flowable at 25° C., has a low surface stickiness, and easily melts by heating. Furthermore, this curable hot melt composition has both hot melt properties and curability.

5. 发明授权

US10604653B2 Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film 有权
公开(公告)号：US10604653B2
公开(公告)日：2020-03-31
申请号：US15769335
申请日：2016-10-12
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryota Dogen , Haruna Yamazaki , Shin Yoshida , Makoto Yoshitake
IPC分类号： C08L83/08 , C09J183/04 , C08G81/00 , B29C43/30 , C08G75/045 , C08K5/00 , C08L83/00 , B29C35/08 , C08J5/18 , C08G77/20 , C08G77/28 , C08G77/16 , B29K83/00 , B29K105/00
摘要： Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

6. 发明申请

US20150315427A1 HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING 有权
标题翻译：热熔型可固化硅酮组合物用于压缩成型或层压
公开(公告)号：US20150315427A1
公开(公告)日：2015-11-05
申请号：US14654084
申请日：2013-12-20
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD.
发明人： Shin Yoshida , Makoto Yoshitake , Haruna Yamazaki , Masaaki Amako , Steven Swier , Toshiki Nakata
IPC分类号： C09J143/04 , H01L21/56 , C08K3/34 , B32B3/30 , C08K3/22 , B32B27/28 , B32B27/08 , B32B7/02 , H01L23/10 , C08K3/36
CPC分类号： H01L23/296 , B32B3/30 , B32B7/02 , B32B27/08 , B32B27/283 , B32B2250/24 , B32B2264/104 , B32B2307/418 , B32B2307/536 , B32B2457/14 , C08G77/50 , C08K3/22 , C08K3/34 , C08K3/36 , C08K2003/2241 , C08K2201/00 , C09D183/10 , C09J183/10 , H01L21/56 , H01L24/73 , H01L24/97 , H01L33/502 , H01L33/56 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/181 , Y10T428/24612 , Y10T428/24942 , Y10T428/24983 , Y10T428/31663 , H01L2924/00012 , H01L2924/00 , H01L2224/85
摘要： The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.
摘要翻译：本发明涉及一种用于压缩成型或层压的热熔性可固化硅氧烷组合物和包含该组合物的至少一层的层压板，以及使用它们的半导体器件及其制造方法。根据本发明，可以有效地制造设置有半球形透镜或圆顶形密封件的半导体器件。在本发明中，容易控制密封件的形状，并且密封件不含任何气泡。在本发明中，除了密封之外，还容易控制半导体器件的涂层的厚度。

7. 发明授权

US09853193B2 Imprinting process of hot-melt type curable silicone composition for optical devices 有权
公开(公告)号：US09853193B2
公开(公告)日：2017-12-26
申请号：US15316071
申请日：2015-06-04
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Masaaki Amako , Steven Swier , Haruna Yamazaki , Shin Yoshida , Makoto Yoshitake
IPC分类号： H01L33/54 , G03F7/00 , C08G77/44 , C08J5/18 , H01L31/0203 , H01L31/18 , H01L33/00 , H01L33/56
CPC分类号： H01L33/54 , C08G77/44 , C08J5/18 , C08J2383/10 , G03F7/0002 , H01L31/0203 , H01L31/18 , H01L33/00 , H01L33/56 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2924/00014
摘要： The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.

8. 发明授权

US09751988B2 Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition 有权
公开(公告)号：US09751988B2
公开(公告)日：2017-09-05
申请号：US15115923
申请日：2015-02-16
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Gunn Jo , Haruna Yamazaki , Ju Young Yook , Makoto Yoshitake
IPC分类号： C08G77/38 , H01L23/29 , C08G77/20 , C08L83/04 , C08G77/08
CPC分类号： C08G77/38 , C08G77/08 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G2170/20 , C08K3/22 , C08K5/56 , C08K2201/00 , C08L83/00 , C08L83/04 , C09J183/04 , H01L23/296
摘要： This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

9. 发明申请

US20170092822A1 IMPRINTING PROCESS OF HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR OPTICAL DEVICES 有权
公开(公告)号：US20170092822A1
公开(公告)日：2017-03-30
申请号：US15316071
申请日：2015-06-04
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Masaaki Amako , Steven Swier , Haruna Yamazaki , Shin Yoshida , Makoto Yoshitake
IPC分类号： H01L33/54 , H01L33/56 , C08G77/44 , H01L31/0203 , H01L31/18 , C08J5/18 , G03F7/00 , H01L33/00
CPC分类号： H01L33/54 , C08G77/44 , C08J5/18 , C08J2383/10 , G03F7/0002 , H01L31/0203 , H01L31/18 , H01L33/00 , H01L33/56 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2924/00014
摘要： The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.

10. 发明申请

US20150183960A1 Reactive Silicone Composition, Reactive Thermoplastic Article, Cured Product, And Optical Semiconductor Device 审中-公开
标题翻译：活性硅酮组合物，活性热塑性制品，固化产品和光学半导体器件
公开(公告)号：US20150183960A1
公开(公告)日：2015-07-02
申请号：US14407093
申请日：2013-06-18
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Haruna Yamazaki , Makoto Yoshitake
IPC分类号： C08K7/18 , H01L33/60 , C08K3/22 , C08K7/14 , C08K3/36
CPC分类号： C08K7/18 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K3/36 , C08K7/14 , C08K2003/2241 , C08L83/04 , H01L33/486 , H01L33/60 , H01L2924/0002 , H01L2933/0033 , H01L2924/00
摘要： The present invention relates to a reactive silicone composition comprising: (A) an alkenyl group-containing organopolysiloxane represented by the average unit formula; (B) an alkenyl group-containing organopolysiloxane represented by the general formula; (C) a silicon atom-bonded hydrogen atom-containing organopolysiloxane represented by the general formula; (D) a hydrosilylation reaction catalyst; (E) a white pigment; and (F) non-spherical silica, spherical silica or glass fibers, a reactive thermoplastic article obtained by the composition to reaction under specified conditions, a cured product obtained by heating the article, and an optical semiconductor device having the cured product. The reactive silicone composition is a solid at an ordinary temperature and gives a reactive thermoplastic article that is fluidized at elevated temperatures. The reactive thermoplastic article is once fluidized upon heating and then gives a cured product. The cured product exhibits little reduction in mechanical strength or discoloration caused by heat or light and has high light reflectance. And the optical semiconductor device exhibits high luminous efficiency and causes little thermal degradation or photodegradation of a light reflection material.
摘要翻译：本发明涉及一种反应性有机硅组合物，其包含：（A）由平均单元式表示的含烯基的有机基聚硅氧烷; （B）由通式表示的含烯基的有机聚硅氧烷; （C）由通式表示的与硅原子键合的含氢原子的有机聚硅氧烷; （D）氢化硅烷化反应催化剂; （E）白色颜料; 和（F）非球形二氧化硅，球形二氧化硅或玻璃纤维，通过组合物在特定条件下反应获得的反应性热塑性制品，通过加热制品获得的固化产物和具有固化产物的光学半导体装置。反应性硅氧烷组合物在常温下为固体，得到在升高的温度下流化的活性热塑性制品。反应性热塑性制品在加热后一度流化，然后得到固化产物。固化产物的机械强度或由热或光引起的变色几乎不降低并且具有高的光反射率。并且光学半导体器件表现出高的发光效率，并且导致光反射材料的热降解或光降解很少。

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