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1. 发明授权

US09536799B2 Hot-melt type curable silicone composition for compression molding or laminating 有权
标题翻译：用于压缩成型或层压的热熔型可固化硅氧烷组合物
公开(公告)号：US09536799B2
公开(公告)日：2017-01-03
申请号：US14654084
申请日：2013-12-20
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Shin Yoshida , Makoto Yoshitake , Haruna Yamazaki , Masaaki Amako , Steven Swier , Toshiki Nakata
IPC分类号： H01L23/29 , B32B9/04 , H01L21/56 , C08K3/34 , C08K3/36 , C08K3/22 , B32B27/28 , B32B27/08 , B32B7/02 , C09D183/10 , C08G77/50 , C09J183/10 , H01L33/56 , B32B3/30 , H01L33/50 , H01L23/00
CPC分类号： H01L23/296 , B32B3/30 , B32B7/02 , B32B27/08 , B32B27/283 , B32B2250/24 , B32B2264/104 , B32B2307/418 , B32B2307/536 , B32B2457/14 , C08G77/50 , C08K3/22 , C08K3/34 , C08K3/36 , C08K2003/2241 , C08K2201/00 , C09D183/10 , C09J183/10 , H01L21/56 , H01L24/73 , H01L24/97 , H01L33/502 , H01L33/56 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/181 , Y10T428/24612 , Y10T428/24942 , Y10T428/24983 , Y10T428/31663 , H01L2924/00012 , H01L2924/00 , H01L2224/85
摘要： The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.
摘要翻译：本发明涉及一种用于压缩成型或层压的热熔性可固化硅氧烷组合物和包含该组合物的至少一层的层压板，以及使用它们的半导体器件及其制造方法。根据本发明，可以有效地制造设置有半球形透镜或圆顶形密封件的半导体器件。在本发明中，容易控制密封件的形状，并且密封件不含任何气泡。在本发明中，除了密封之外，还容易控制半导体器件的涂层的厚度。

2. 发明授权

US09045641B2 Curable silicone composition, cured product thereof, and optical semiconductor device 有权
标题翻译：可固化硅酮组合物，其固化产物和光学半导体装置
公开(公告)号：US09045641B2
公开(公告)日：2015-06-02
申请号：US14375977
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： H01L33/00 , C08K5/549 , C08L83/14 , C08G77/04 , C08L83/04 , H01L33/60 , H01L33/62 , C08K3/22 , C08K3/36 , C08G77/12 , C08G77/20 , C08G77/38 , H01L33/56 , C08G77/00
CPC分类号： C08L83/14 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/70 , C08G77/80 , C08K3/22 , C08K3/36 , C08L83/04 , C08L2205/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole %; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中，该成分中所有与硅原子键合的有机基团中的苯基含量为20〜70摩尔％（E）由平均单元式表示的有机聚硅氧烷; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

3. 发明授权

US10731008B2 Photocurable silicone composition and cured product thereof 有权
公开(公告)号：US10731008B2
公开(公告)日：2020-08-04
申请号：US16082669
申请日：2017-03-07
申请人： Dow Silicones Corporation , Dow Corning Toray Co., Ltd.
发明人： Ju Young Yook , Makoto Yoshitake
IPC分类号： C09D183/04 , C08G77/20 , C08K5/101 , C08K5/13 , C08K5/37 , C08K5/5313 , C08L83/04
摘要： A photocurable silicone composition comprises: (A) an organopolysiloxane represented by the average composition formula: R1aR2bSiO(4-a-b)/2 where R1 is an alkenyl group having from 2 to 12 carbons, R2 is an alkyl group having from 1 to 12 carbons, an aryl group having from 6 to 12 carbons, or an aralkyl group having from 7 to 12 carbons; provided that, at least 30 mol % of R2 are the aryl groups or the aralkyl groups; and “a” and “b” are positive numbers satisfying: 1≤(a+b)≤2.5 and 0.001≤a/(a+b)≤0.2; (B) an organic compound having at least two ether bonds and at least one aliphatic carbon-carbon double bond in a molecule; (C) a compound having at least two thiol groups in a molecule; (D) a photoradical initiator having a phosphorus atom; and (E) a hindered phenol compound.

4. 发明授权

US10604653B2 Active energy ray curable hot melt silicone composition, cured product thereof, and method of producing film 有权
公开(公告)号：US10604653B2
公开(公告)日：2020-03-31
申请号：US15769335
申请日：2016-10-12
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryota Dogen , Haruna Yamazaki , Shin Yoshida , Makoto Yoshitake
IPC分类号： C08L83/08 , C09J183/04 , C08G81/00 , B29C43/30 , C08G75/045 , C08K5/00 , C08L83/00 , B29C35/08 , C08J5/18 , C08G77/20 , C08G77/28 , C08G77/16 , B29K83/00 , B29K105/00
摘要： Disclosed is an active energy ray curable hot melt silicone composition that is non-flowable at 25° C. and has a viscosity of 1,000 Pa·s or less at 100° C. The active energy ray curable hot melt silicone composition comprises: (A) a mixture of (A1) an organopolysiloxane having an aliphatic unsaturated bond-containing organic group and (A2) an organopolysiloxane optionally having an aliphatic unsaturated bond-containing organic group, (B) a compound having at least two mercapto groups in a molecule, and (C) a photoradical initiator. A cured product and a method of making a film are also disclosed.

5. 发明申请

US20150315427A1 HOT-MELT TYPE CURABLE SILICONE COMPOSITION FOR COMPRESSION MOLDING OR LAMINATING 有权
标题翻译：热熔型可固化硅酮组合物用于压缩成型或层压
公开(公告)号：US20150315427A1
公开(公告)日：2015-11-05
申请号：US14654084
申请日：2013-12-20
申请人： DOW CORNING CORPORATION , DOW CORNING TORAY CO., LTD.
发明人： Shin Yoshida , Makoto Yoshitake , Haruna Yamazaki , Masaaki Amako , Steven Swier , Toshiki Nakata
IPC分类号： C09J143/04 , H01L21/56 , C08K3/34 , B32B3/30 , C08K3/22 , B32B27/28 , B32B27/08 , B32B7/02 , H01L23/10 , C08K3/36
CPC分类号： H01L23/296 , B32B3/30 , B32B7/02 , B32B27/08 , B32B27/283 , B32B2250/24 , B32B2264/104 , B32B2307/418 , B32B2307/536 , B32B2457/14 , C08G77/50 , C08K3/22 , C08K3/34 , C08K3/36 , C08K2003/2241 , C08K2201/00 , C09D183/10 , C09J183/10 , H01L21/56 , H01L24/73 , H01L24/97 , H01L33/502 , H01L33/56 , H01L2224/32225 , H01L2224/48227 , H01L2224/73265 , H01L2224/97 , H01L2924/12041 , H01L2924/181 , Y10T428/24612 , Y10T428/24942 , Y10T428/24983 , Y10T428/31663 , H01L2924/00012 , H01L2924/00 , H01L2224/85
摘要： The present invention relates to a hot-meltable curable silicone composition for compression molding or laminating and a laminate provided with at least one layer comprising the composition, as well as a semiconductor device using these and a method of manufacturing the same. In accordance with the present invention, it is possible to efficiently manufacture a semiconductor device provided with a hemi-spheroidal lens- or dome-shaped seal. In the present invention, it is easy to control the shape of the seal, and the seal does not contain any bubbles. In the present invention, it is also easy to control the thickness of the coating layer of the semiconductor device apart from the seal.
摘要翻译：本发明涉及一种用于压缩成型或层压的热熔性可固化硅氧烷组合物和包含该组合物的至少一层的层压板，以及使用它们的半导体器件及其制造方法。根据本发明，可以有效地制造设置有半球形透镜或圆顶形密封件的半导体器件。在本发明中，容易控制密封件的形状，并且密封件不含任何气泡。在本发明中，除了密封之外，还容易控制半导体器件的涂层的厚度。

6. 发明申请

US20150235872A1 Curable Silicone Composition, Method For Producing Semiconductor Device, And Semiconductor Device 审中-公开
标题翻译：可固化的硅酮组合物，用于制造半导体器件的方法和半导体器件
公开(公告)号：US20150235872A1
公开(公告)日：2015-08-20
申请号：US14426890
申请日：2013-09-06
申请人： DOW CORNING TORAY CO., LTD.
发明人： Hiroaki Yoshida , Yusuke Miyamoto , Makoto Yoshitake , Shin Yoshida
IPC分类号： H01L21/56 , H01L21/78 , B29C43/18 , B29C43/00 , B29C43/20 , H01L23/29 , C09J143/04
CPC分类号： H01L21/565 , B29C43/003 , B29C43/18 , B29C43/203 , B29C2043/182 , B29K2083/00 , B29K2995/007 , B29L2009/005 , B29L2031/34 , C08G77/12 , C08G77/20 , C08K5/56 , C08L83/00 , C08L83/04 , C09J143/04 , H01L21/78 , H01L23/296 , H01L24/97 , H01L33/56 , H01L2224/48227 , H01L2224/97 , H01L2924/12041 , H01L2924/12042 , H01L2924/181 , H01L2933/005 , H01L2224/85 , H01L2924/00
摘要： The present invention relates to a curable silicone composition comprising: (A) an organopolysiloxane composed of: (A-1) a linear organopolysiloxane having at least two silicon-bonded alkenyl groups in a molecule, and (A-2) a resin-like organopolysiloxane including 1.5 to 5.0% by weight alkenyl groups; (B) an organopolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule; (C) a linear dialkyl polysiloxane having a viscosity at 25° C. of 2 to 10 mm2/s and having alkenyl groups capping both molecular chain terminals; and (D) a hydrosilylation reaction catalyst. The curable silicone composition forms a cured product having low surface tackiness and a low coefficient of friction.
摘要翻译：本发明涉及一种可固化有机硅组合物，其包含：（A）由以下组分组成的有机聚硅氧烷：（A-1）分子中具有至少两个与硅键合的烯基的直链有机聚硅氧烷和（A-2）树脂状含有1.5〜5.0重量％链烯基的有机聚硅氧烷; （B）分子中具有至少两个与硅键合的氢原子的有机聚硅氧烷; （C）在25℃下的粘度为2〜10mm 2 / s且具有封端两个分子链末端的链烯基的直链二烷基聚硅氧烷; 和（D）氢化硅烷化反应催化剂。可固化硅酮组合物形成具有低表面粘性和低摩擦系数的固化产物。

7. 发明授权

US09048406B2 Curable silicone composition, cured product thereof, and optical semiconductor device 有权
标题翻译：可固化硅酮组合物，其固化产物和光学半导体装置
公开(公告)号：US09048406B2
公开(公告)日：2015-06-02
申请号：US14375989
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： Ryosuke Yamazaki , Makoto Yoshitake
IPC分类号： H01L33/60 , C08K5/549 , C08L83/04 , C08G77/04 , C08G77/12 , C08G77/20 , C08G77/00
CPC分类号： H01L33/60 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/80 , C08K3/22 , C08K5/549 , C08K5/56 , C08K2003/2237 , C08L83/00 , C08L83/04 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is at least 20 mole %; (E) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is less than 20 mole %; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中该组分中所有与硅原子键合的有机基团中的苯基含量为至少20摩尔％。（E）在分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中该组分中所有与硅原子键合的有机基团中的苯基含量小于20摩尔％; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

8. 发明申请

US20150001569A1 Curable Silicone Composition, Cured Product Thereof, And Optical Semiconductor Device 有权
标题翻译：可固化硅酮组合物，其固化产物和光半导体器件
公开(公告)号：US20150001569A1
公开(公告)日：2015-01-01
申请号：US14375977
申请日：2013-02-01
申请人： Dow Corning Toray Co., Ltd.
发明人： Makoto Yoshitake , Ryosuke Yamazaki
IPC分类号： C08L83/14 , H01L33/62 , H01L33/60
CPC分类号： C08L83/14 , C08G77/045 , C08G77/12 , C08G77/20 , C08G77/38 , C08G77/70 , C08G77/80 , C08K3/22 , C08K3/36 , C08L83/04 , C08L2205/02 , H01L33/56 , H01L33/60 , H01L33/62 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/00
摘要： A curable silicone composition comprises: (A) an organopolysiloxane represented by an average unit formula; (B) an organopolysiloxane having 10 or less silicon atoms, wherein 30 to 60 mole % of all silicon atom-bonded organic groups are alkenyl groups having from 2 to 6 carbons; (C) an organopolysiloxane represented by a general formula; (D) an organopolysiloxane having at least 2 silicon atom-bonded hydrogen atoms in a molecule, wherein the content of phenyl groups in all silicon atom-bonded organic groups in this component is 20 to 70 mole %; (E) an organopolysiloxane represented by an average unit formula; (F) a hydrosilylation reaction catalyst; (G) a white pigment; and (H) an inorganic filler other than a white pigment, has excellent formability for forming a cured product that has little discoloration and lowering of mechanical strength by heat and light, has high light reflectance, has excellent dimensional stability, and is capable of good attachment by a sealing agent used for an optical semiconductor device.
摘要翻译：可固化的有机硅组合物包括：（A）由平均单元式表示的有机聚硅氧烷; （B）具有10个或更少硅原子的有机聚硅氧烷，其中所有硅原子键合的有机基团的30至60摩尔％为具有2至6个碳原子的烯基; （C）由通式表示的有机聚硅氧烷; （D）分子中具有至少2个硅原子键合的氢原子的有机聚硅氧烷，其中，该成分中所有与硅原子键合的有机基团中的苯基含量为20〜70摩尔％（E）由平均单元式表示的有机聚硅氧烷; （F）氢化硅烷化反应催化剂; （G）白色颜料; 和（H）除了白色颜料以外的无机填料，具有优异的成型性，能够形成通过热和光几乎不变色和降低机械强度的固化产物，具有高的光反射率，具有优异的尺寸稳定性，并且能够良好用于光学半导体器件的密封剂附着。

9. 发明授权

US09853193B2 Imprinting process of hot-melt type curable silicone composition for optical devices 有权
公开(公告)号：US09853193B2
公开(公告)日：2017-12-26
申请号：US15316071
申请日：2015-06-04
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Masaaki Amako , Steven Swier , Haruna Yamazaki , Shin Yoshida , Makoto Yoshitake
IPC分类号： H01L33/54 , G03F7/00 , C08G77/44 , C08J5/18 , H01L31/0203 , H01L31/18 , H01L33/00 , H01L33/56
CPC分类号： H01L33/54 , C08G77/44 , C08J5/18 , C08J2383/10 , G03F7/0002 , H01L31/0203 , H01L31/18 , H01L33/00 , H01L33/56 , H01L2224/48091 , H01L2924/1815 , H01L2933/005 , H01L2924/00014
摘要： The present disclosure relates to a method of making an optical assembly. An optical device is secured in a fixture, the optical device having an optical surface, wherein a silicone film is positioned with respect to the optical surface, the silicone film having a distal surface relative to the optical surface. The method includes, among other features, imprinting the distal surface of the silicone film to create a surface imprint in the distal surface of the silicone film.

10. 发明授权

US09751988B2 Reactive silicone composition, hotmelt material made therefrom, and curable hotmelt composition 有权
公开(公告)号：US09751988B2
公开(公告)日：2017-09-05
申请号：US15115923
申请日：2015-02-16
申请人： Dow Corning Corporation , Dow Corning Toray Co., Ltd.
发明人： Gunn Jo , Haruna Yamazaki , Ju Young Yook , Makoto Yoshitake
IPC分类号： C08G77/38 , H01L23/29 , C08G77/20 , C08L83/04 , C08G77/08
CPC分类号： C08G77/38 , C08G77/08 , C08G77/12 , C08G77/16 , C08G77/20 , C08G77/70 , C08G2170/20 , C08K3/22 , C08K5/56 , C08K2201/00 , C08L83/00 , C08L83/04 , C09J183/04 , H01L23/296
摘要： This invention relates to a reactive silicone composition for forming a hotmelt material, comprising: (A) an organopolysiloxane resin represented by the specific average unit formula; (B) an organopolysiloxane resin free of alkenyl group and represented by the specific average unit formula; (C) a diorganopolysiloxane represented by the specific average formula; (D) an organohydrogenpolysiloxane having two silicon-bonded hydrogen atoms in a molecule; (E) an organohydrogenpolysiloxane having at least three silicon-bonded hydrogen atoms in a molecule; and (F) a hydrosilylation catalyst. The reactive silicone composition can be reacted to form a hotmelt material having excellent shelf life stability, instant adhesion performance by hotmelt process.

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