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1. 发明授权

US09199840B2 Sensor protective coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US09199840B2
公开(公告)日：2015-12-01
申请号：US14069633
申请日：2013-11-01
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： H01L21/00 , G01L9/00 , B81C1/00 , B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer.
摘要翻译：制造传感器装置的方法包括在晶片上形成多个传感器结构，用聚合物层覆盖多个传感器结构，并且在每个传感器结构保持被聚合物层覆盖的同时将晶片切割成多个模具。

2. 发明申请

US20080073760A1 Capacitor assembly with shielded connections and method for forming the same 失效
标题翻译：具有屏蔽连接的电容器组件及其形成方法
公开(公告)号：US20080073760A1
公开(公告)日：2008-03-27
申请号：US11526971
申请日：2006-09-25
申请人： Andrew C. McNeil , Dubravka Bilic , Stephen R. Hooper
发明人： Andrew C. McNeil , Dubravka Bilic , Stephen R. Hooper
IPC分类号： H01L23/495
CPC分类号： G01L9/0073 , H01L27/0629 , H01L27/0805
摘要： A capacitor assembly (82) is formed on a substrate (20). The capacitor assembly a first conductive plate (38) and a second conductive plate (60) formed over the substrate such that the second conductive plate is separated from the first conductive plate by a distance. A conductive trace (40) is formed over the substrate that is connected to the first conductive plate and extends away from the capacitor assembly. A conductive shield (62) is formed over at least a portion of the conductive trace that is separated from the first and second conductive plates to control a fringe capacitance between the second conductive plate and the conductive trace.
摘要翻译：电容器组件（82）形成在衬底（20）上。所述电容器组件形成在所述基板上方的第一导电板（38）和第二导电板（60），使得所述第二导电板与所述第一导电板分离一定距离。导电迹线（40）形成在衬底上，其连接到第一导电板并且远离电容器组件延伸。导电屏蔽（62）形成在导电迹线的至少一部分上，其与第一和第二导电板分离，以控制第二导电板和导电迹线之间的边缘电容。

3. 发明申请

US20160075553A1 Sensor Protective Coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US20160075553A1
公开(公告)日：2016-03-17
申请号：US14949869
申请日：2015-11-23
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A microelectromechanical system (MEMS) sensor device includes a substrate, a support structure supported by the substrate, a membrane supported by the support structure and spaced from the substrate, and a polymer layer covering the membrane.
摘要翻译：微机电系统（MEMS）传感器装置包括基板，由基板支撑的支撑结构，由支撑结构支撑并与基板间隔开的膜以及覆盖膜的聚合物层。

4. 发明授权

US07528468B2 Capacitor assembly with shielded connections and method for forming the same 失效
标题翻译：具有屏蔽连接的电容器组件及其形成方法
公开(公告)号：US07528468B2
公开(公告)日：2009-05-05
申请号：US11526971
申请日：2006-09-25
申请人： Andrew C. McNeil , Dubravka Bilic , Stephen R. Hooper
发明人： Andrew C. McNeil , Dubravka Bilic , Stephen R. Hooper
IPC分类号： H01L23/552
CPC分类号： G01L9/0073 , H01L27/0629 , H01L27/0805
摘要： A capacitor assembly (82) is formed on a substrate (20). The capacitor assembly a first conductive plate (38) and a second conductive plate (60) formed over the substrate such that the second conductive plate is separated from the first conductive plate by a distance. A conductive trace (40) is formed over the substrate that is connected to the first conductive plate and extends away from the capacitor assembly. A conductive shield (62) is formed over at least a portion of the conductive trace that is separated from the first and second conductive plates to control a fringe capacitance between the second conductive plate and the conductive trace.
摘要翻译：电容器组件（82）形成在衬底（20）上。所述电容器组件形成在所述基板上方的第一导电板（38）和第二导电板（60），使得所述第二导电板与所述第一导电板分离一定距离。导电迹线（40）形成在衬底上，其连接到第一导电板并且远离电容器组件延伸。导电屏蔽（62）形成在导电迹线的至少一部分上，其与第一和第二导电板分离，以控制第二导电板和导电迹线之间的边缘电容。

5. 发明授权

US09425382B2 Sensor protective coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US09425382B2
公开(公告)日：2016-08-23
申请号：US14949869
申请日：2015-11-23
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： G01L9/00 , H01L21/00 , H01L41/09 , B81C1/00 , B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A microelectromechanical system (MEMS) sensor device includes a substrate, a support structure supported by the substrate, a membrane supported by the support structure and spaced from the substrate, and a polymer layer covering the membrane.
摘要翻译：微机电系统（MEMS）传感器装置包括基板，由基板支撑的支撑结构，由支撑结构支撑并与基板间隔开的膜以及覆盖膜的聚合物层。

6. 发明申请

US20150123222A1 Sensor Protective Coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US20150123222A1
公开(公告)日：2015-05-07
申请号：US14069633
申请日：2013-11-01
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer.
摘要翻译：制造传感器装置的方法包括在晶片上形成多个传感器结构，用聚合物层覆盖多个传感器结构，并且在每个传感器结构保持被聚合物层覆盖的同时将晶片切割成多个模具。

7. 发明申请

US20170341926A9 MICROELECTROMECHANICAL SYSTEM DEVICES HAVING CRACK RESISTANT MEMBRANE STRUCTURES AND METHODS FOR THE FABRICATION THEREOF 有权
公开(公告)号：US20170341926A9
公开(公告)日：2017-11-30
申请号：US14537498
申请日：2014-11-10
申请人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
发明人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
IPC分类号： B81B3/00 , G01L9/00
CPC分类号： B81B3/007 , B81B2201/0264 , B81B2203/0127 , G01L9/0072
摘要： Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

8. 发明申请

US20150059484A1 MICROELECTROMECHANICAL SYSTEM DEVICES HAVING CRACK RESISTANT MEMBRANE STRUCTURES AND METHODS FOR THE FABRICATION THEREOF 有权
标题翻译：具有抗裂膜结构的微电子系统装置及其制造方法
公开(公告)号：US20150059484A1
公开(公告)日：2015-03-05
申请号：US14537498
申请日：2014-11-10
申请人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
发明人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
IPC分类号： G01L9/12
CPC分类号： B81B3/007 , B81B2201/0264 , B81B2203/0127 , G01L9/0072
摘要： Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.
摘要翻译：提供了制造抗电微机电（MEMS）器件的方法，以及根据这些方法制造的MEMS器件。在一个实施例中，该方法包括在衬底上形成牺牲体，在衬底上产生多层膜结构，以及去除牺牲体的至少一部分以在多层膜结构内形成内腔。多层膜结构通过首先在牺牲体上方和周围形成基膜层使得基膜层具有非平面的上表面来制造。然后去除预定厚度的基膜层，以使基膜层具有平坦的上表面。在基膜层的平面上表面上形成盖膜层。盖膜层由具有基本上平行的晶粒取向的材料构成。

9. 发明申请

US20100050776A1 PRESSURE SENSOR FEATURING OFFSET CANCELLATION AND METHOD OF MAKING 有权
标题翻译：压力传感器特征取消和制作方法
公开(公告)号：US20100050776A1
公开(公告)日：2010-03-04
申请号：US12201211
申请日：2008-08-29
申请人： Marco Fuhrmann , Dubravka Bilic , Thomas D. Ohe
发明人： Marco Fuhrmann , Dubravka Bilic , Thomas D. Ohe
IPC分类号： G01L9/12
CPC分类号： G01L9/0073 , Y10T29/49002
摘要： A pressure sensor includes a first set of electrodes, a second set of electrodes, and a common electrode. The first and second sets of electrodes overlie an insulative surface, wherein the first set of electrodes represent sense capacitor bottom electrodes and the second set of electrodes represent reference capacitor bottom electrodes. The second set of electrodes is configured in an interleaved arrangement with the first set of electrodes, wherein the geometry of individual electrodes of the first set of electrodes substantially matches the geometry of individual electrodes of the second set of electrodes. In addition, the common electrode represents a sense and reference capacitor top electrode that is (i) overlying, (ii) spaced from, and (iii) configured in connection with the first and second sets of electrodes to form a common pressure cavity, wherein the common electrode includes first portions corresponding to sense membrane portions and second portions corresponding to reference membrane portions, further wherein an area of a sense membrane portion is greater than an area of a reference membrane portion.
摘要翻译：压力传感器包括第一组电极，第二组电极和公共电极。第一和第二组电极覆盖绝缘表面，其中第一组电极表示感测电容器底部电极，第二组电极表示参考电容器底部电极。第二组电极被配置成与第一组电极交错布置，其中第一组电极的各个电极的几何形状基本上与第二组电极的单独电极的几何形状相匹配。另外，公共电极表示感测和参考电容器顶部电极，其是（i）与第一组和第二组电极相连并且（iii）与第一和第二组电极相配合，并且（iii）形成公共压力腔，其中公共电极包括对应于感测膜部分的第一部分和对应于参考膜部分的第二部分，此外，感测膜部分的面积大于参考膜部分的面积。

10. 发明授权

US09926187B2 Microelectromechanical system devices having crack resistant membrane structures and methods for the fabrication thereof 有权
公开(公告)号：US09926187B2
公开(公告)日：2018-03-27
申请号：US14537498
申请日：2014-11-10
申请人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
发明人： Chad S Dawson , Dubravka Bilic , Lianjun Liu , Andrew C McNeil
IPC分类号： G01L9/12 , B81B3/00 , G01L9/00
CPC分类号： B81B3/007 , B81B2201/0264 , B81B2203/0127 , G01L9/0072
摘要： Methods for fabricating crack resistant Microelectromechanical (MEMS) devices are provided, as are MEMS devices produced pursuant to such methods. In one embodiment, the method includes forming a sacrificial body over a substrate, producing a multi-layer membrane structure on the substrate, and removing at least a portion of the sacrificial body to form an inner cavity within the multi-layer membrane structure. The multi-layer membrane structure is produced by first forming a base membrane layer over and around the sacrificial body such that the base membrane layer has a non-planar upper surface. A predetermined thickness of the base membrane layer is then removed to impart the base membrane layer with a planar upper surface. A cap membrane layer is formed over the planar upper surface of the base membrane layer. The cap membrane layer is composed of a material having a substantially parallel grain orientation.

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