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1. 发明授权

US09969608B2 Methods for mounting a MEMS sensor for in-stream measurements 有权
公开(公告)号：US09969608B2
公开(公告)日：2018-05-15
申请号：US15069948
申请日：2016-03-14
申请人： DUNAN SENSING, LLC
发明人： Tom Kwa , Danny Do , Gary Winzeler , Emir Vukotic
IPC分类号： G01L7/00 , B81B7/00 , B81C1/00 , G01L19/14
CPC分类号： B81B7/0035 , B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81C1/00277 , B81C2203/0145 , G01L9/0073 , G01L19/147
摘要： Systems and methods for packaging a MEMS device to measure the in-stream pressure within a pipe are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, the MEMS device is mounted directly to the pipe using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal pipe.

2. 发明申请

US20170190570A1 METHODS FOR MOUNTING A MEMS SENSOR FOR IN-STREAM MEASUREMENTS 审中-公开
公开(公告)号：US20170190570A1
公开(公告)日：2017-07-06
申请号：US15069948
申请日：2016-03-14
申请人： DUNAN SENSING, LLC
发明人： TOM KWA , DANNY DO , GARY WINZELER , EMIR VUKOTIC
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0035 , B81B7/0061 , B81B2201/0264 , B81B2203/0127 , B81C1/00277 , B81C2203/0145 , G01L9/0073 , G01L19/147
摘要： Systems and methods for packaging a MEMS device to measure the in-stream pressure within a pipe are provided. Embodiments herein avoid the use of a metal housing enclosing the MEMS device or die pad of the MEMS device. Instead, the MEMS device is mounted directly to the pipe using a ceramic carrier. In preferred embodiments, the ceramic carrier is soldered, brazed, welded or eutectic bonded to the metal pipe.

3. 发明申请

US20160075553A1 Sensor Protective Coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US20160075553A1
公开(公告)日：2016-03-17
申请号：US14949869
申请日：2015-11-23
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A microelectromechanical system (MEMS) sensor device includes a substrate, a support structure supported by the substrate, a membrane supported by the support structure and spaced from the substrate, and a polymer layer covering the membrane.
摘要翻译：微机电系统（MEMS）传感器装置包括基板，由基板支撑的支撑结构，由支撑结构支撑并与基板间隔开的膜以及覆盖膜的聚合物层。

4. 发明授权

US09425382B2 Sensor protective coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US09425382B2
公开(公告)日：2016-08-23
申请号：US14949869
申请日：2015-11-23
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： G01L9/00 , H01L21/00 , H01L41/09 , B81C1/00 , B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A microelectromechanical system (MEMS) sensor device includes a substrate, a support structure supported by the substrate, a membrane supported by the support structure and spaced from the substrate, and a polymer layer covering the membrane.
摘要翻译：微机电系统（MEMS）传感器装置包括基板，由基板支撑的支撑结构，由支撑结构支撑并与基板间隔开的膜以及覆盖膜的聚合物层。

5. 发明申请

US20160167950A1 ENCAPSULATED MICROELECTROMECHANICAL STRUCTURE 有权
标题翻译：封装微电子结构
公开(公告)号：US20160167950A1
公开(公告)日：2016-06-16
申请号：US14961760
申请日：2015-12-07
申请人： SiTime Corporation
发明人： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
摘要： A semiconductor layer having an opening and a MEMS resonator formed in the opening is disposed between first and second substrates to encapsulate the MEMS resonator. An electrical contact that extends from the opening to an exterior of the MEMS device is formed at least in part within the semiconductor layer and at least in part within the first substrate.
摘要翻译：具有开口的半导体层和形成在开口中的MEMS谐振器设置在第一和第二基板之间以封装MEMS谐振器。至少部分地在半导体层内并且至少部分地在第一衬底内形成从MEMS器件的开口延伸到外部的电接触。

6. 发明申请

US20150321905A1 WAFER LEVEL PACKAGED INFRARED (IR) FOCAL PLANE ARRAY (FPA) WITH EVANESCENT WAVE COUPLING 有权
标题翻译： WAFER LEVEL包装红外（IR）FOCAL PLANE ARRAY（FPA）与EVANESCENT WAVE COUPLING
公开(公告)号：US20150321905A1
公开(公告)日：2015-11-12
申请号：US14270945
申请日：2014-05-06
申请人： Raytheon Company
发明人： Roland W. Gooch , Stephen H. Black , Thomas A. Kocian , Adam M. Kennedy , Buu Q. Diep
IPC分类号： B81B7/00 , H01L37/00
CPC分类号： B81B7/0067 , B81B7/0035 , B81B2201/0207 , B81C1/00317 , G01J5/045 , G01J5/08 , G01J5/20 , H01L37/00
摘要： A structure for detecting electromagnetic radiation having a predetermined wavelength. The structure includes a device wafer having a sensing element disposed on a predetermined region of a surface of the device wafer responsive to the electromagnetic radiation. A cover wafer is provided having a region thereof transparent to the electromagnetic radiation for passing the electromagnetic radiation through the transparent region onto a surface of the sensing element. A bond gap spacer structure is provided for supporting the surface of the sensing element from an opposing surface of the transparent region of the cover wafer a distance less than a fraction of the predetermined wavelength when. the cover wafer is bonded to the device wafer.
摘要翻译：一种用于检测具有预定波长的电磁辐射的结构。该结构包括具有传感元件的器件晶片，其响应于电磁辐射而设置在器件晶片的表面的预定区域上。提供了覆盖晶片，其具有对电磁辐射透明的区域，以将电磁辐射穿过透明区域传递到感测元件的表面上。提供了一种键间隔结构，用于当从盖玻片的透明区域的相对表面以小于预定波长的一小部分的距离来支撑感测元件的表面时。盖晶片被结合到器件晶片。

7. 发明授权

US09099569B2 MEMS microphone 有权
标题翻译： MEMS麦克风
公开(公告)号：US09099569B2
公开(公告)日：2015-08-04
申请号：US14261633
申请日：2014-04-25
申请人： BSE CO., LTD.
发明人： Sang Ho Lee , Yong Hyun Shim
IPC分类号： H01L29/84 , H04R19/04 , B81B3/00 , B81B7/00
CPC分类号： H01L29/84 , B81B3/0021 , B81B7/0032 , B81B7/0035 , B81B7/0061 , H04R1/086 , H04R1/2807 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2499/11
摘要： A micro-electro mechanical system (MEMS) microphone includes: a printed circuit substrate; a MEMS chip that is combined with the printed circuit substrate and has a MEMS inner space; and a case that is combined with the printed circuit substrate, accommodates the MEMS chip, and forms an inner space that is separated from an external space, wherein the case is a double-type case including an inner case and an outer case, a medium acoustic path space is formed between the inner case and the outer case, and the printed circuit substrate includes a substrate acoustic path that connects the medium acoustic path space to the MEMS inner space of the MEMS chip so that external sound passing through the sound hole enters the MEMS inner space of the MEMS chip after passing through the medium acoustic path space.
摘要翻译：微机电系统（MEMS）麦克风包括：印刷电路基板; 与印刷电路基板结合并具有MEMS内部空间的MEMS芯片; 以及与印刷电路基板结合的情况，容纳MEMS芯片，并且形成与外部空间分离的内部空间，其中壳体是包括内壳体和外壳体的双重情况，介质在内壳和外壳之间形成声路空间，并且印刷电路基板包括将介质声路空间连接到MEMS芯片的MEMS内部空间的基板声道，使得通过声孔的外部声音进入 MEMS芯片的MEMS内部空间通过介质声道空间。

8. 发明申请

US20150123222A1 Sensor Protective Coating 有权
标题翻译：传感器保护涂层
公开(公告)号：US20150123222A1
公开(公告)日：2015-05-07
申请号：US14069633
申请日：2013-11-01
申请人： Dubravka Bilic , Stephen R. Hooper
发明人： Dubravka Bilic , Stephen R. Hooper
IPC分类号： B81C1/00 , B81B7/00
CPC分类号： H01L41/0973 , B81B7/0035 , B81B7/0058 , B81B2201/0264 , B81B2203/0127 , B81C1/00825 , B81C1/00896 , B81C2201/053 , B81C2203/0145 , H01L41/0926
摘要： A method of fabricating a sensor device includes forming a plurality of sensor structures on a wafer, covering the plurality of sensor structures with a polymer layer, and dicing the wafer into a plurality of die while each sensor structure remains covered by the polymer layer.
摘要翻译：制造传感器装置的方法包括在晶片上形成多个传感器结构，用聚合物层覆盖多个传感器结构，并且在每个传感器结构保持被聚合物层覆盖的同时将晶片切割成多个模具。

9. 发明申请

US20140284729A1 ELECTRICAL COMPONENT AND METHOD OF MANUFACTURING THE SAME 有权
标题翻译：电气部件及其制造方法
公开(公告)号：US20140284729A1
公开(公告)日：2014-09-25
申请号：US13962892
申请日：2013-08-08
申请人： KABUSHIKI KAISHA TOSHIBA
发明人： Kei OBARA , Yoshiaki SUGIZAKI , Yoshiaki SHIMOOKA
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0051 , B81B7/0032 , B81B7/0035 , B81B7/0038 , B81C2201/0167 , B81C2203/0136
摘要： According to one embodiment, an electrical component comprises a substrate, a functional element formed on the substrate, a first layer which includes through holes, and forms a cavity that stores the functional element on the substrate, and a second layer which is formed on the first layer, and closes the through holes. The first layer includes a first film, a second film on the first film, and a third film on the second film. A Young's modulus of the second film is higher than a Young's modulus of the first film and the third film.
摘要翻译：根据一个实施例，电气部件包括基板，形成在基板上的功能元件，包括通孔的第一层，并且形成将功能元件存储在基板上的空腔和形成在基板上的第二层第一层，并关闭通孔。第一层包括第一膜，第一膜上的第二膜和第二膜上的第三膜。第二膜的杨氏模量高于第一膜和第三膜的杨氏模量。

10. 发明申请

US20070170531A1 Wafer encapsulated microelectromechanical structure and method of manufacturing same 审中-公开
公开(公告)号：US20070170531A1
公开(公告)日：2007-07-26
申请号：US11593428
申请日：2006-11-06
申请人： Aaron Partridge , Markus Lutz , Pavan Gupta
发明人： Aaron Partridge , Markus Lutz , Pavan Gupta
IPC分类号： H01L29/84
CPC分类号： B81C1/00277 , B81B7/0035 , B81B7/0058 , B81B7/007 , B81B2201/0271 , B81B2203/0315 , B81B2203/04 , B81B2207/07 , B81C1/00269 , B81C1/00301 , B81C2201/0171 , B81C2203/031 , B81C2203/036 , B81C2203/037 , B81C2203/038 , H01L23/051 , H01L41/1136 , H01L2924/0002 , H01L2924/00
摘要： There are many inventions described and illustrated herein. In one aspect, the present inventions relate to devices, systems and/or methods of encapsulating and fabricating electromechanical structures or elements, for example, accelerometer, gyroscope or other transducer (for example, pressure sensor, strain sensor, tactile sensor, magnetic sensor and/or temperature sensor), filter or resonator. The fabricating or manufacturing microelectromechanical systems of the present invention, and the systems manufactured thereby, employ wafer bonding encapsulation techniques.

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