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    • 6. 发明申请
    • III-NITRIDE MATERIALS INCLUDING LOW DISLOCATION DENSITIES AND METHODS ASSOCIATED WITH THE SAME
    • 三氮化物材料包括低偏差密度和与之相关的方法
    • US20100295056A1
    • 2010-11-25
    • US12748778
    • 2010-03-29
    • Edwin L. PinerJohn C. RobertsPradeep Rajagopal
    • Edwin L. PinerJohn C. RobertsPradeep Rajagopal
    • H01L29/20H01L21/20
    • C30B29/403C30B25/02H01L21/02381H01L21/02458H01L21/02488H01L21/02505H01L21/0251H01L21/02513H01L21/0254H01L21/02543
    • Semiconductor structures including one, or more, III-nitride material regions (e.g., gallium nitride material region) and methods associated with such structures are provided. The III-nitride material region(s) advantageously have a low dislocation density and, in particular, a low screw dislocation density. In some embodiments, the presence of screw dislocations in the III-nitride material region(s) may be essentially eliminated. The presence of a strain-absorbing layer underlying the III-nitride material region(s) and/or processing conditions can contribute to achieving the low screw dislocation densities. In some embodiments, the III-nitride material region(s) having low dislocation densities include a gallium nitride material region which functions as the active region of the device. The low screw dislocation densities of the active device region (e.g., gallium nitride material region) can lead to improved properties (e.g., electrical and optical) by increasing electron transport, limiting non-radiative recombination, and increasing compositional/growth uniformity, amongst other effects.
    • 提供包括一个或多个III族氮化物材料区域(例如,氮化镓材料区域)的半导体结构以及与这种结构相关联的方法。 III族氮化物材料区域有利地具有低位错密度,特别是低螺旋位错密度。 在一些实施方案中,可以基本上消除III族氮化物材料区域中螺旋位错的存在。 在III族氮化物材料区域和/或加工条件下存在应变吸收层有助于实现低螺旋位错密度。 在一些实施例中,具有低位错密度的III族氮化物材料区域包括用作该器件的有源区域的氮化镓材料区域。 活性器件区域(例如,氮化镓材料区域)的低螺旋位错密度可以通过增加电子传输,限制非辐射复合和增加组成/生长均匀性等而导致改进的性能(例如电和光学) 效果。
    • 8. 发明授权
    • III-nitride materials including low dislocation densities and methods associated with the same
    • III族氮化物材料包括低位错密度和与其相关的方法
    • US08368117B2
    • 2013-02-05
    • US12748778
    • 2010-03-29
    • Edwin L. PinerJohn C. RobertsPradeep Rajagopal
    • Edwin L. PinerJohn C. RobertsPradeep Rajagopal
    • H01L31/101
    • C30B29/403C30B25/02H01L21/02381H01L21/02458H01L21/02488H01L21/02505H01L21/0251H01L21/02513H01L21/0254H01L21/02543
    • Semiconductor structures including one, or more, III-nitride material regions (e.g., gallium nitride material region) and methods associated with such structures are provided. The III-nitride material region(s) advantageously have a low dislocation density and, in particular, a low screw dislocation density. In some embodiments, the presence of screw dislocations in the III-nitride material region(s) may be essentially eliminated. The presence of a strain-absorbing layer underlying the III-nitride material region(s) and/or processing conditions can contribute to achieving the low screw dislocation densities. In some embodiments, the III-nitride material region(s) having low dislocation densities include a gallium nitride material region which functions as the active region of the device. The low screw dislocation densities of the active device region (e.g., gallium nitride material region) can lead to improved properties (e.g., electrical and optical) by increasing electron transport, limiting non-radiative recombination, and increasing compositional/growth uniformity, amongst other effects.
    • 提供包括一个或多个III族氮化物材料区域(例如,氮化镓材料区域)的半导体结构以及与这种结构相关联的方法。 III族氮化物材料区域有利地具有低位错密度,特别是低螺旋位错密度。 在一些实施方案中,可以基本上消除III族氮化物材料区域中螺旋位错的存在。 在III族氮化物材料区域和/或加工条件下存在应变吸收层有助于实现低螺旋位错密度。 在一些实施例中,具有低位错密度的III族氮化物材料区域包括用作该器件的有源区域的氮化镓材料区域。 活性器件区域(例如,氮化镓材料区域)的低螺旋位错密度可以通过增加电子传输,限制非辐射复合和增加组成/生长均匀性等而导致改进的性能(例如电和光学) 效果。
    • 10. 发明授权
    • III-nitride materials including low dislocation densities and methods associated with the same
    • III族氮化物材料包括低位错密度和与其相关的方法
    • US07687827B2
    • 2010-03-30
    • US10886506
    • 2004-07-07
    • Edwin L. PinerJohn C. RobertsPradeep Rajagopal
    • Edwin L. PinerJohn C. RobertsPradeep Rajagopal
    • H01L31/101
    • C30B29/403C30B25/02H01L21/02381H01L21/02458H01L21/02488H01L21/02505H01L21/0251H01L21/02513H01L21/0254H01L21/02543
    • Semiconductor structures including one, or more, III-nitride material regions (e.g., gallium nitride material region) and methods associated with such structures are provided. The III-nitride material region(s) advantageously have a low dislocation density and, in particular, a low screw dislocation density. In some embodiments, the presence of screw dislocations in the III-nitride material region(s) may be essentially eliminated. The presence of a strain-absorbing layer underlying the III-nitride material region(s) and/or processing conditions can contribute to achieving the low screw dislocation densities. In some embodiments, the III-nitride material region(s) having low dislocation densities include a gallium nitride material region which functions as the active region of the device. The low screw dislocation densities of the active device region (e.g., gallium nitride material region) can lead to improved properties (e.g., electrical and optical) by increasing electron transport, limiting non-radiative recombination, and increasing compositional/growth uniformity, amongst other effects.
    • 提供包括一个或多个III族氮化物材料区域(例如,氮化镓材料区域)的半导体结构以及与这种结构相关联的方法。 III族氮化物材料区域有利地具有低位错密度,特别是低螺旋位错密度。 在一些实施方案中,可以基本上消除III族氮化物材料区域中螺旋位错的存在。 在III族氮化物材料区域和/或加工条件下存在应变吸收层有助于实现低螺旋位错密度。 在一些实施例中,具有低位错密度的III族氮化物材料区域包括用作该器件的有源区域的氮化镓材料区域。 活性器件区域(例如,氮化镓材料区域)的低螺旋位错密度可以通过增加电子传输,限制非辐射复合和增加组成/生长均匀性等而导致改进的性能(例如电和光学) 效果。