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1. 发明申请

US20050167812A1 Semiconductor device, three-dimensional semiconductor device, and method of manufacturing semiconductor device 审中-公开
标题翻译：半导体器件，三维半导体器件以及半导体器件的制造方法
公开(公告)号：US20050167812A1
公开(公告)日：2005-08-04
申请号：US11062735
申请日：2005-02-23
申请人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
发明人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
IPC分类号： H01L21/768 , H01L23/31 , H01L23/48 , H01L23/485 , H01L23/522 , H01L25/065 , H01L29/76
CPC分类号： H01L21/76898 , H01L23/3128 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/13008 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
摘要翻译：提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。通过蚀刻形成孔，电极焊盘用作蚀刻停止层。埋入电极形成在孔中。该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

2. 发明授权

US08216934B2 Semiconductor device suitable for a stacked structure 有权
标题翻译：适用于堆叠结构的半导体器件
公开(公告)号：US08216934B2
公开(公告)日：2012-07-10
申请号：US12976089
申请日：2010-12-22
申请人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
发明人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
IPC分类号： H01L21/4763
CPC分类号： H01L21/76898 , H01L23/3128 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/13008 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
摘要翻译：提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。通过蚀刻形成孔，电极焊盘用作蚀刻停止层。埋入电极形成在孔中。该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

3. 发明申请

US20090008798A1 SEMICONDUCTOR DEVICE SUITABLE FOR A STACKED STRUCTURE 有权
标题翻译：适用于堆叠结构的半导体器件
公开(公告)号：US20090008798A1
公开(公告)日：2009-01-08
申请号：US12210645
申请日：2008-09-15
申请人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
发明人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
IPC分类号： H01L23/52
CPC分类号： H01L21/76898 , H01L23/3128 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/13008 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
摘要翻译：提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。通过蚀刻形成孔，电极焊盘用作蚀刻停止层。埋入电极形成在孔中。该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

4. 发明授权

US07884459B2 Semiconductor device suitable for a stacked structure 有权
标题翻译：适用于堆叠结构的半导体器件
公开(公告)号：US07884459B2
公开(公告)日：2011-02-08
申请号：US12210645
申请日：2008-09-15
申请人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
发明人： Eiji Yoshida , Takao Ohno , Yoshito Akutagawa , Koji Sawahata , Masataka Mizukoshi , Takao Nishimura , Akira Takashima , Mitsuhisa Watanabe
IPC分类号： H01L23/02
CPC分类号： H01L21/76898 , H01L23/3128 , H01L23/481 , H01L24/05 , H01L24/13 , H01L24/16 , H01L25/0657 , H01L25/50 , H01L2224/02371 , H01L2224/0401 , H01L2224/05572 , H01L2224/06181 , H01L2224/13008 , H01L2224/13009 , H01L2224/13025 , H01L2224/131 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/45144 , H01L2225/06513 , H01L2225/06517 , H01L2225/06524 , H01L2225/06527 , H01L2225/06541 , H01L2225/06551 , H01L2225/06555 , H01L2924/0002 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01011 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01019 , H01L2924/01022 , H01L2924/01027 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01039 , H01L2924/01047 , H01L2924/0106 , H01L2924/01074 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/12042 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/00012 , H01L2224/05552 , H01L2924/00
摘要： A semiconductor device is provided that forms a three-dimensional semiconductor device having semiconductor devices stacked on one another. In this semiconductor device, a hole is formed in a silicon semiconductor substrate that has an integrated circuit unit and an electrode pad formed on a principal surface on the outer side. The hole is formed by etching, with the electrode pad serving as an etching stopper layer. An embedded electrode is formed in the hole. This embedded electrode serves to electrically lead the electrode pad to the principal surface on the bottom side of the silicon semiconductor substrate.
摘要翻译：提供一种半导体器件，其形成具有彼此堆叠的半导体器件的三维半导体器件。在该半导体器件中，在具有形成在外侧的主面上的集成电路单元和电极焊盘的硅半导体基板中形成有孔。通过蚀刻形成孔，电极焊盘用作蚀刻停止层。埋入电极形成在孔中。该嵌入电极用于将电极焊盘导电到硅半导体衬底的底侧的主表面。

5. 发明申请

US20100007178A1 SYSTEM FOR OPENING/CLOSING A ROOF PANEL AND A BRANCHED DRIVING CABLE TO BE USED FOR THE SYSTEM 有权
标题翻译：用于打开/关闭用于系统的屋顶板和分配的驱动电缆的系统
公开(公告)号：US20100007178A1
公开(公告)日：2010-01-14
申请号：US12295159
申请日：2007-03-28
申请人： Koji Sawahata , Shinya Matsui , Takaaki Motohashi , Takuya Izumi
发明人： Koji Sawahata , Shinya Matsui , Takaaki Motohashi , Takuya Izumi
IPC分类号： B60J11/00 , B60J7/057
CPC分类号： B60J7/198 , B60J7/145 , B60J7/1855 , B60J7/1856 , Y10T74/20012
摘要： Reducing number of components in a case where a plurality of locking mechanism is being used. The system includes an input cable (84) driven when pulled by an electric motor (10) via a hook (81); a connecting member (110) rotatably connected to a vehicle body, an output end of the input cable (84) is connected thereto; and a branched driving cable (100) having a first driving cable (503), an input end of which is connected to the connecting member (110) while an output end of which is connected to a link restricting mechanism (500) for transmitting a pulling force of the input cable (84) to the link restricting mechanism (500), and second driving cable (514), an input end of which is connected to the connecting member (110) and an output end of which is connected to the stored state locking mechanism (510) for transmitting a pulling force of the input cable (84) to the stored state locking mechanism (510), wherein the link restricting mechanism (500) and the stored state locking mechanism (510) are driven by the electric motor (10) via the branched driving cable (100).
摘要翻译：在使用多个锁定机构的情况下，减少部件数量。该系统包括经电动马达（10）经由钩（81）拉动而被驱动的输入电缆（84）。与车身可转动地连接的连接部件（110），输入电缆（84）的输出端与其连接; 以及具有第一驱动电缆（503）的分支驱动电缆（100），其输入端连接到所述连接部件（110），同时其输出端连接到用于传输输入电缆（84）向连杆限制机构（500）的拉力，以及第二驱动电缆（514），其输入端连接到连接部件（110），其输出端连接到存储状态锁定机构（510），用于将输入电缆（84）的拉力传递到存储状态锁定机构（510），其中链接限制机构（500）和存储状态锁定机构（510）由电动机（10）经由分支驱动电缆（100）。

6. 发明授权

US08042424B2 System for opening/closing a roof panel and a branched driving cable to be used for the system 有权
标题翻译：用于打开/关闭屋顶板的系统和用于系统的分支驱动电缆
公开(公告)号：US08042424B2
公开(公告)日：2011-10-25
申请号：US12295159
申请日：2007-03-28
申请人： Koji Sawahata , Shinya Matsui , Takashi Motohashi , Takuya Izumi
发明人： Koji Sawahata , Shinya Matsui , Takashi Motohashi , Takuya Izumi
IPC分类号： F16C1/10
CPC分类号： B60J7/198 , B60J7/145 , B60J7/1855 , B60J7/1856 , Y10T74/20012
摘要： Reducing number of components in a case where a plurality of locking mechanism is being used. The system includes an input cable (84) driven when pulled by an electric motor (10) via a hook (81); a connecting member (110) rotatably connected to a vehicle body, an output end of the input cable (84) is connected thereto; and a branched driving cable (100) having a first driving cable (503), an input end of which is connected to the connecting member (110) while an output end of which is connected to a link restricting mechanism (500) for transmitting a pulling force of the input cable (84) to the link restricting mechanism (500), and second driving cable (514), an input end of which is connected to the connecting member (110) and an output end of which is connected to the stored state locking mechanism (510) for transmitting a pulling force of the input cable (84) to the stored state locking mechanism (510), wherein the link restricting mechanism (500) and the stored state locking mechanism (510) are driven by the electric motor (10) via the branched driving cable (100).
摘要翻译：在使用多个锁定机构的情况下，减少部件数量。该系统包括经电动马达（10）经由钩（81）拉动而被驱动的输入电缆（84）。与车身可转动地连接的连接部件（110），输入电缆（84）的输出端与其连接; 以及具有第一驱动电缆（503）的分支驱动电缆（100），其输入端连接到所述连接部件（110），同时其输出端连接到用于传输输入电缆（84）向连杆限制机构（500）的拉力，以及第二驱动电缆（514），其输入端连接到连接部件（110），其输出端连接到存储状态锁定机构（510），用于将输入电缆（84）的拉力传递到存储状态锁定机构（510），其中链接限制机构（500）和存储状态锁定机构（510）由电动机（10）经由分支驱动电缆（100）。

7. 发明授权

US07837250B2 Opening/closing device for roof panel 有权
标题翻译：屋顶板开/关装置
公开(公告)号：US07837250B2
公开(公告)日：2010-11-23
申请号：US12295180
申请日：2007-03-28
申请人： Shinya Matsui , Koji Sawahata , Kozo Odoi
发明人： Shinya Matsui , Koji Sawahata , Kozo Odoi
IPC分类号： B60J7/185
CPC分类号： B60J7/145 , B60J7/1855 , B60J7/1856 , B60J7/198
摘要： To reliably prevent lifting of a roof panel when the roof panel is fully closed. To provide a roof panel (12) to a vehicle body (1) capable of opening/closing a vehicle cabin space (11), a link mechanism (3) for supporting the roof panel (12) at the vehicle body (1) having a front connecting link (33) rotatably connected to both of the vehicle body (1) and the roof panel (12), and a rear connecting link (34) rotatably connected to both of the vehicle body (1) and the roof panel (12) at rear side of a vehicle relative to front connecting link (33), and link restricting mechanism (500) for restricting the rear connecting link (34) to the vehicle body (1) when the roof panel (12) is in fully closed state over the vehicle cabin space (11).
摘要翻译：当屋顶板完全关闭时，可靠地防止屋顶板的抬起。为了向能够打开/关闭车厢空间（11）的车体（1）提供顶板（12），用于在车体（1）上支撑顶板（12）的连杆机构（3）具有：可旋转地连接到车体（1）和车顶板（12）的前连接连杆（33），以及可旋转地连接到车体（1）和车顶板（12）两者的后连接连杆（34） 12），相对于前连接连杆（33）的车辆后侧，以及用于当屋顶板（12）完全为止时将后连接连杆（34）限制在车体（1）上的连杆限制机构（500）关闭状态在车厢空间（11）上。

8. 发明授权

US07659937B2 Camera module equipped with an optical filter having an edge not in contact with a fixing portion 失效
标题翻译：配备有具有不与固定部分接触的边缘的滤光器的相机模块
公开(公告)号：US07659937B2
公开(公告)日：2010-02-09
申请号：US11391706
申请日：2006-03-29
申请人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Koji Sawahata , Shigeo Iriguchi , Toshiyuki Honda , Katsuro Hiraiwa
发明人： Masanori Onodera , Susumu Moriya , Izumi Kobayashi , Hiroshi Aoki , Koji Sawahata , Shigeo Iriguchi , Toshiyuki Honda , Katsuro Hiraiwa
IPC分类号： H04N5/225
CPC分类号： H04N5/2254 , H04N5/2253
摘要： A camera module includes a module structure constituted by a lens unit to which an image pickup lens is attached and a package to which an imaging element is attached so as to be opposite to the image pickup lens. An optical filter is arranged between the imaging element and the image pickup lens. A portion of a flat surface of the optical filter is fixed to a filter fixing portion via an adhesive. The optical filter is adhered to the filter fixing portion in a state in which an end portion formed by a side surface of the optical filter and the flat surface is in noncontact with the filter fixing portion or the adhesive. Minute particles generated from a cut surface of the optical filter fall outside the filter fixing portion.
摘要翻译：相机模块包括由附接有图像拾取透镜的透镜单元和附接有成像元件以与图像拾取透镜相对的包装构成的模块结构。在成像元件和图像拾取透镜之间布置有滤光器。滤光器的平坦表面的一部分通过粘合剂固定到过滤器固定部分。滤光器在由滤光器的侧表面形成的端部与平坦表面与过滤器固定部或粘合剂不接触的状态下粘附到过滤器固定部。从滤光片的切割面产生的细粒子落在过滤器固定部的外侧。

9. 发明授权

US07564111B2 Imaging apparatus 有权
标题翻译：成像设备
公开(公告)号：US07564111B2
公开(公告)日：2009-07-21
申请号：US11657590
申请日：2007-01-25
申请人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
发明人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
IPC分类号： H01L31/0232
CPC分类号： H04N5/2251 , H01L27/14618 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.
摘要翻译：在由用于安装成像装置的壳体和与设置在壳体上的外部连接端子接合的柔性基板构成的成像装置中，柔性基板沿着壳体41的每个面弯曲以围绕壳体41。通过弯曲柔性基板，施加到柔性基板的负载被容纳在柔性基板的弯曲部分处，形成难以将负载传递到外部连接端子的接合部分的结构。此外，通过利用粘合剂等将壳体固定到柔性基板的一部分上，形成了不向外部连接端子向柔性基板剥离的方向施加应力的结构。此外，壳体被配备有电磁波屏蔽材料的柔性基板覆盖。

10. 发明申请

US20070120050A1 Imaging apparatus 有权
标题翻译：成像设备
公开(公告)号：US20070120050A1
公开(公告)日：2007-05-31
申请号：US11657590
申请日：2007-01-25
申请人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
发明人： Koji Sawahata , Susumu Moriya , Hiroshi Aoki , Izumi Kobayashi , Toshiyuki Honda , Shigeo Iriguchi , Masashi Takenaka
IPC分类号： H01J5/02
CPC分类号： H04N5/2251 , H01L27/14618 , H01L2924/0002 , H04N5/2257 , H01L2924/00
摘要： In an imaging apparatus constituted of a case body for mounting an imaging device and a flexible substrate bonding to an external connection terminal provided on the case body, the flexible substrate is bent along each face of case body 41 so as to surround case body 41. By bending the flexible substrate, a load applied to the flexible substrate is received at the bent portion of the flexible substrate, there is formed a structure hard to transmit the load to the bonding portion to the external connection terminal. Further, by fixing the case body to a portion of the flexible substrate with an adhesive agent, etc., there is formed a structure not to transmit a stress to the direction of peeling the flexible substrate from the external connection terminal. Also, the case body is covered with the flexible substrate equipped with an electromagnetic wave shield material.
摘要翻译：在由用于安装成像装置的壳体和与设置在壳体上的外部连接端子接合的柔性基板构成的成像装置中，柔性基板沿着壳体41的每个面弯曲以围绕壳体41。通过弯曲柔性基板，施加到柔性基板的负载被容纳在柔性基板的弯曲部分处，形成难以将负载传递到外部连接端子的接合部分的结构。此外，通过利用粘合剂等将壳体固定到柔性基板的一部分上，形成了不向外部连接端子向柔性基板剥离的方向施加应力的结构。此外，壳体被配备有电磁波屏蔽材料的柔性基板覆盖。

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