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1. 发明申请

US20140369047A1 Frame and Light Apparatus 审中-公开
标题翻译：框架和灯具
公开(公告)号：US20140369047A1
公开(公告)日：2014-12-18
申请号：US14306803
申请日：2014-06-17
申请人： Everlight Electronics Co., Ltd.
发明人： Yung Chieh Chen , Jung Chiuan Lin , Feng-Ting Hsu , Chien-Chang Pei
IPC分类号： F21V21/30 , F21V23/00
CPC分类号： H01L33/62 , H01L25/0753 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： A frame for a light apparatus and the light apparatus are provided. The light apparatus has at least one light-emitting diode chip. The frame includes an electrode portion, a first body and a second body. The frame has a first portion, a second portion and a bendable connecting portion which is located between the first portion and the second portion. An angle is formed between the first portion and the second portion by the connecting portion. The first body is disposed on the first portion. The first body has a first recess exposing a portion of a first electrode surface of the first portion. The light-emitting diode chip is disposed in the first recess and connected with the first electrode surface electrically. The second body is disposed on the second portion and exposes a portion of the connection surface of the second portion.
摘要翻译：提供了一种用于照明装置的框架和灯装置。光装置具有至少一个发光二极管芯片。框架包括电极部分，第一主体和第二主体。框架具有位于第一部分和第二部分之间的第一部分，第二部分和可弯曲连接部分。通过连接部在第一部分和第二部分之间形成角度。第一主体设置在第一部分上。第一主体具有暴露第一部分的第一电极表面的一部分的第一凹部。发光二极管芯片设置在第一凹部中并与第一电极表面电连接。第二主体设置在第二部分上并暴露第二部分的连接表面的一部分。

2. 发明授权

US09691960B1 Carrier, carrier leadframe, and light emitting device and method for manufacturing same 有权
公开(公告)号：US09691960B1
公开(公告)日：2017-06-27
申请号：US15441582
申请日：2017-02-24
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/10 , H01L33/62 , H01L33/48 , H01L33/60 , H01L33/38
CPC分类号： H01L33/62 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

3. 发明授权

US09391251B2 Carrier structure and lighting device 有权
标题翻译：载体结构和照明装置
公开(公告)号：US09391251B2
公开(公告)日：2016-07-12
申请号：US14273933
申请日：2014-05-09
申请人： Everlight Electronics Co., Ltd.
发明人： Yung Chieh Chen , Jung Chiuan Lin
IPC分类号： H01L33/62 , H01L33/48
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing defines a concavity. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concavity of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.
摘要翻译：描述了载体结构和照明装置的各种示例。构造成携带LED的载体结构包括壳体和引线框架。外壳定义一个凹面。引线框架包括具有主板通孔的主板部分，从主板部分延伸到主板通孔中的至少两个插入部分和被配置为电耦合到LED的两个电极部分。壳体设置在至少两个插入部分上，其中至少两个插入部分插入到壳体中。壳体的凹面暴露电极部分。每个电极部分具有延伸到壳体外部的相应突起子部分。此外，还提供了利用载体结构的照明装置。

4. 发明申请

US20150340568A1 Carrier, Carrier Leadframe, And Light Emitting Device 有权
标题翻译：载体，载体引线框架和发光装置
公开(公告)号：US20150340568A1
公开(公告)日：2015-11-26
申请号：US14720230
申请日：2015-05-22
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/48 , H01L33/62
CPC分类号： H01L33/62 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.
摘要翻译：提供了包括框架体和载体的载体引线框架。框架主体包括至少一个支撑部分，并且托架包括壳体和至少一个电极部分，并且经由支撑部分与框架主体机械接合。还提供了如上所述的用于制造载体引线框架的方法，以及由载体引线框架制成的发光器件及其制造方法。载体引线框架具有预先分离的并且与框架体机械接合的载体，从而有助于封装之后材料的快速释放。此外，在所提供的载体引线框架中，每个载体与另一个载体电隔离，因此可在材料释放之前执行电测量。因此，提高了由载体引线框制成的发光器件的生产速度和产量。

5. 发明授权

US10475974B2 Carrier, carrier leadframe, and light emitting device 有权
公开(公告)号：US10475974B2
公开(公告)日：2019-11-12
申请号：US15859858
申请日：2018-01-02
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/08 , H01L33/62 , H01L33/48 , H01L23/00 , H01L23/495 , H01L33/60 , H01L33/38 , H01L33/56
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

6. 发明授权

US09640733B2 Carrier, carrier leadframe, and light emitting device 有权
公开(公告)号：US09640733B2
公开(公告)日：2017-05-02
申请号：US14720230
申请日：2015-05-22
申请人： Everlight Electronics Co., Ltd.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/48 , H01L33/62 , H01L23/00 , H01L33/60
CPC分类号： H01L33/62 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

7. 发明申请

US20140346551A1 Carrier Structure And Lighting Device 有权
标题翻译：载体结构和照明装置
公开(公告)号：US20140346551A1
公开(公告)日：2014-11-27
申请号：US14273933
申请日：2014-05-09
申请人： Everlight Electronics Co., Ltd.
发明人： Yung Chieh Chen , Jung Chiuan Lin
IPC分类号： H01L33/62 , F21V15/01
CPC分类号： H01L33/62 , H01L33/486 , H01L2224/48091 , H01L2224/48247 , H01L2924/00014
摘要： Various examples of a carrier structure and lighting device are described. A carrier structure configured to carry an LED includes a housing and a lead frame. The housing has a concave. The lead frame includes a main board portion having a main board through hole, at least two insertion portions extending from the main board portion into the main board through hole, and two electrode portions configured to be electrically coupled to the LED. The housing is disposed over the at least two insertion portions with the at least two insertion portions inserted into the housing. The concave of the housing expose the electrode portions. Each of the electrode portions has a respective protrusion sub-portion that extends outside of the housing. Additionally, a lighting device utilizing the carrier structure is also provided.
摘要翻译：描述了载体结构和照明装置的各种示例。构造成携带LED的载体结构包括壳体和引线框架。外壳有凹面。引线框架包括具有主板通孔的主板部分，从主板部分延伸到主板通孔中的至少两个插入部分和被配置为电耦合到LED的两个电极部分。壳体设置在至少两个插入部分上，其中至少两个插入部分插入到壳体中。壳体的凹部露出电极部分。每个电极部分具有延伸到壳体外部的相应突起子部分。此外，还提供了利用载体结构的照明装置。

8. 发明授权

US10177292B2 Carrier, carrier leadframe, and light emitting device 有权
公开(公告)号：US10177292B2
公开(公告)日：2019-01-08
申请号：US15470009
申请日：2017-03-27
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/62 , H01L33/48 , H01L33/60 , H01L23/00
摘要： A light emitting device may comprise a wing portion of an electrode exposed from the resin housing. The wing portion may be made by a single or multiple stamp cutting process. To increase the connecting region between the electrode and solder, the outer side surface of the wing portion is an uneven surface. The device may further comprise a protective plating layer and an external protective plating layer. The protective plating layer may be coated on the top surface, bottom surface and a portion of the side surface of the electrode. The external portative plating layer would be coated on the outer surface of the wing region. The light reflection of the device from top surface of the electrode portion can be maintained and the outer side surface of wing portion can be protected for improving the reliability of connection between light emitting device and outer substrate.

9. 发明申请

US20180123012A1 CARRIER, CARRIER LEADFRAME, AND LIGHT EMITTING DEVICE 审中-公开
公开(公告)号：US20180123012A1
公开(公告)日：2018-05-03
申请号：US15859858
申请日：2018-01-02
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01L33/62 , H01L33/60 , H01L33/56
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

10. 发明授权

US09905742B2 Carrier, carrier leadframe, and light emitting device 有权
公开(公告)号：US09905742B2
公开(公告)日：2018-02-27
申请号：US15441644
申请日：2017-02-24
申请人： EVERLIGHT ELECTRONICS CO., LTD.
发明人： Chung-Chuan Hsieh , Yung Chieh Chen
IPC分类号： H01R43/00 , H01L33/62 , H01L33/60 , H01L33/56
CPC分类号： H01L33/62 , H01L24/97 , H01L33/38 , H01L33/483 , H01L33/486 , H01L33/56 , H01L33/60 , H01L2933/0016 , H01L2933/0033 , H01L2933/005 , H01L2933/0058 , H01L2933/0066
摘要： A carrier leadframe, including a frame body and a carrier, is provided. The frame body includes at least one supporting portion, and the carrier includes a shell and at least one electrode portion and is mechanically engaged with the frame body via the supporting portion. A method for manufacturing the carrier leadframe as described above, as well as a light emitting device made from the carrier leadframe and a method for manufacturing the device, are also provided. The carrier leadframe has carriers that are separate in advance and mechanically engaged with the frame body, thereby facilitating the quick release of material after encapsulation. Besides, in the carrier leadframe as provided, each carrier is electrically isolated from another carrier, so the electric measurement can be performed before the release of material. Therefore, the speed and yield of production of the light emitting device made from the carrier leadframe is improved.

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