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1. 发明申请

US20180138064A1 WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION 审中-公开
公开(公告)号：US20180138064A1
公开(公告)日：2018-05-17
申请号：US15872335
申请日：2018-01-16
申请人： GLOBALFOUNDRIES, Inc.
发明人： William J. Fosnight , Stephanie Waite , Stephen B. Miner , John Robinson
IPC分类号： H01L21/673 , H01L21/677 , B08B9/00 , B08B5/02 , B08B5/00
CPC分类号： H01L21/67389 , B08B5/00 , B08B5/02 , B08B9/00 , H01L21/67769 , H01L21/67775
摘要： A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

2. 发明申请

US20160155654A1 WAFER CARRIER PURGE APPARATUSES, AUTOMATED MECHANICAL HANDLING SYSTEMS INCLUDING THE SAME, AND METHODS OF HANDLING A WAFER CARRIER DURING INTEGRATED CIRCUIT FABRICATION 有权
标题翻译： WAFER CARRIER PURGE装置，包括其中的自动机械处理系统以及在集成电路制造过程中处理波浪载体的方法
公开(公告)号：US20160155654A1
公开(公告)日：2016-06-02
申请号：US15015578
申请日：2016-02-04
申请人： GLOBALFOUNDRIES, Inc.
发明人： William J. Fosnight , Stephanie Waite , Stephen B. Miner , John Robinson
IPC分类号： H01L21/673 , B08B5/02 , B08B9/00 , H01L21/677
CPC分类号： H01L21/67389 , B08B5/00 , B08B5/02 , B08B9/00 , H01L21/67769 , H01L21/67775
摘要： A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.
摘要翻译：提供了晶片载体清除装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。晶片载体清洗装置包括适于插入载体存放位置的清洗板。净化板包括气体端口和与气体端口流体连通的气体喷嘴。气体端口接收气流。气体喷嘴适于接触晶片载体的入口。吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。净化板是分离的，可从载体存放位置移除。

3. 发明授权

US09257320B2 Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication 有权
标题翻译：晶片载体清洗装置，包括其的自动机械处理系统以及在集成电路制造期间处理晶片载体的方法
公开(公告)号：US09257320B2
公开(公告)日：2016-02-09
申请号：US13910683
申请日：2013-06-05
申请人： GLOBALFOUNDRIES, Inc.
发明人： William J. Fosnight , Stephanie Waite , Stephen B. Miner , John Robinson
IPC分类号： H01L21/673 , H01L21/677 , B08B5/02 , B08B5/00 , B08B9/00
CPC分类号： H01L21/67389 , B08B5/00 , B08B5/02 , B08B9/00 , H01L21/67769 , H01L21/67775
摘要： A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.
摘要翻译：提供了晶片载体清洗装置，自动机械处理系统以及在集成电路制造期间处理晶片载体的方法。晶片载体清洗装置包括适于插入载体存放位置的清洗板。净化板包括气体端口和与气体端口流体连通的气体喷嘴。气体端口接收气流。气体喷嘴适于接触晶片载体的入口。吹扫板还包括与气体喷嘴间隔开的与真空口流体连通的真空口和真空喷嘴。真空喷嘴适于捕获通过晶片载体的出口从晶片载体逸出的气体。净化板是分离的，可从载体存放位置移除。

4. 发明申请

US20190148180A1 SELF-CONTAINED METROLOGY WAFER CARRIER SYSTEMS 审中-公开
公开(公告)号：US20190148180A1
公开(公告)日：2019-05-16
申请号：US16248220
申请日：2019-01-15
申请人： GLOBALFOUNDRIES Inc.
发明人： Abner Bello , Stephanie Waite , William J. Fosnight , Thomas Beeg
IPC分类号： H01L21/673 , G01N21/21 , G01J5/00 , G01J5/02 , G01R27/00 , G01N21/55 , H01L21/66 , H01L21/67
摘要： Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.

5. 发明授权

US09911634B2 Self-contained metrology wafer carrier systems 有权
公开(公告)号：US09911634B2
公开(公告)日：2018-03-06
申请号：US15193502
申请日：2016-06-27
申请人： GLOBALFOUNDRIES Inc.
发明人： Abner Bello , Stephanie Waite , William J. Fosnight , Thomas Beeg
IPC分类号： G01J5/00 , H01L21/673 , H01L21/66 , G01N21/55 , G01N21/21 , G01J5/08
CPC分类号： G01J5/0096 , G01J5/0007 , G01J5/025 , G01J5/0825 , G01J5/0896 , G01N21/211 , G01N21/55 , G01N2201/06113 , G01N2201/0683 , G01N2201/12 , G01R27/00 , H01L21/67253 , H01L21/6732 , H01L21/67353 , H01L21/67386 , H01L22/12
摘要： A self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers are provided. A wafer carrier system includes, for instance, a housing configured for transport within the automated material handling system, the housing having a support configured to support a semiconductor wafer in the housing, and a metrology system disposed within the housing, the metrology system operable to measure at least one characteristic of the wafer, the metrology system comprising a sensing unit and a computing unit operably connected to the sensing unit. Also provided are methods of measuring one or more characteristics of a semiconductor wafer within the wafer carrier systems of the present disclosure.

6. 发明授权

US09142437B2 System for separately handling different size FOUPs 有权
标题翻译：用于分别处理不同尺寸的FOUP的系统
公开(公告)号：US09142437B2
公开(公告)日：2015-09-22
申请号：US13859773
申请日：2013-04-10
申请人： GLOBALFOUNDRIES Inc.
发明人： William J. Fosnight , Ryan J. Gallagher , Stephen B. Miner
IPC分类号： B66F19/00 , H01L21/677 , H01L21/673
CPC分类号： H01L21/67775 , H01L21/67379
摘要： A system for separately handling different size FOUPs includes an end effector having a surface thereon for supporting a FOUP. The end effector and surface is configured to support different size FOUPs. A fixture or means for engaging and maintaining a FOUP, of different size FOUPs, included to position and maintain each of a different size FOUP on the end effector during transport thereof. A shelf is configured to receive each of said different size FOUPs. The end effector is thus capable of transporting either a first size FOUP or a second, smaller size FOUP.
摘要翻译：用于分开处理不同尺寸的FOUP的系统包括其上具有用于支撑FOUP的表面的端部执行器。端部执行器和表面配置为支持不同尺寸的FOUP。包括用于接合和保持不同尺寸FOUP的FOUP的固定装置或装置，用于在其运送期间在末端执行器上定位和保持每个不同尺寸的FOUP。架子被配置为接收每个所述不同大小的FOUP。因此，末端执行器能够运送第一尺寸FOUP或第二较小尺寸的FOUP。

7. 发明授权

US09870936B2 Wafer carrier purge apparatuses, automated mechanical handling systems including the same, and methods of handling a wafer carrier during integrated circuit fabrication 有权
公开(公告)号：US09870936B2
公开(公告)日：2018-01-16
申请号：US15015578
申请日：2016-02-04
申请人： GLOBALFOUNDRIES, Inc.
发明人： William J. Fosnight , Stephanie Waite , Stephen B. Miner , John Robinson
IPC分类号： H01L21/68 , H01L21/673 , H01L21/677 , B08B5/02 , B08B9/00 , B08B5/00
CPC分类号： H01L21/67389 , B08B5/00 , B08B5/02 , B08B9/00 , H01L21/67769 , H01L21/67775
摘要： A wafer carrier purge apparatus, an automated mechanical handling system, and a method of handling a wafer carrier during integrated circuit fabrication are provided. The wafer carrier purge apparatus includes a purge plate adapted for insertion into a carrier storage position. The purge plate includes a gas port and a gas nozzle in fluid communication with the gas port. The gas port receives a gas flow. The gas nozzle is adapted to contact an inlet port of a wafer carrier. The purge plate further includes a vacuum port and a vacuum nozzle in fluid communication with the vacuum port, spaced from the gas nozzle. The vacuum nozzle is adapted to capture gas that escapes from the wafer carrier through an outlet port of the wafer carrier. The purge plate is separate and removable from the carrier storage position.

8. 发明申请

US20160268152A1 OVERHEAD SUBSTRATE HANDLING AND STORAGE SYSTEM 审中-公开
标题翻译： OVERHEAD基板处理和存储系统
公开(公告)号：US20160268152A1
公开(公告)日：2016-09-15
申请号：US15164204
申请日：2016-05-25
申请人： GLOBALFOUNDRIES Inc.
发明人： William J. Fosnight , Eric Christensen , Leslie Marshall , Ryan John Gallagher , Stephanie Waite , Gabriel Gaxiola
IPC分类号： H01L21/677 , B65G1/04
CPC分类号： H01L21/67733 , B65G1/0464 , B65G2201/0297 , H01L21/677
摘要： A method for operating a material handling system including an overhead rack defining a plurality of storage positions, first and second side rails disposed above the overhead rack, a first cross rail movably coupled to the first and second side rails, and a first transport vehicle movably coupled to the first cross rail includes positioning the first transport vehicle above at least one interior window defined in the overhead rack. At least a portion of the first transport vehicle is descended through the interior window to interface with a first load port of a first tool disposed below the overhead rack. The first transport vehicle is positioned above at least one periphery window defined in the overhead rack. At least a portion of the first transport vehicle is descended through the periphery window to interface with a second load port of a second tool disposed below the overhead rack.
摘要翻译：一种用于操作材料处理系统的方法，所述材料处理系统包括限定多个存储位置的顶架，布置在所述架空架上方的第一和第二侧轨，可移动地联接到所述第一和第二侧轨的第一横梁，以及可移动地耦合到所述第一交叉导轨包括将所述第一运输车辆定位在限定在所述架空架中的至少一个内部窗口之上。第一运输车辆的至少一部分通过内部窗口下降，以与设置在架空架下方的第一工具的第一负载端口相接。第一运输车辆位于架空架上限定的至少一个外围窗口的上方。第一运输车辆的至少一部分通过周边窗口下降，以与布置在架空架下方的第二工具的第二负载端口相接。

9. 发明授权

US10931143B2 Rechargeable wafer carrier systems 有权
公开(公告)号：US10931143B2
公开(公告)日：2021-02-23
申请号：US15233454
申请日：2016-08-10
申请人： GLOBALFOUNDRIES Inc.
发明人： Abner Bello , Stephanie Waite , William J. Fosnight
IPC分类号： H02J50/10 , H02J7/00 , H02J7/02 , H01L21/677 , H01L21/673
摘要： Rechargeable wafer carrier systems and methods are provided. A rechargeable wafer carrier system includes, for instance, a housing for holding at least one wafer and at least one electronics system therein, a rechargeable power source operably connected to the housing for powering the at least one electronics system, and a charging interface for receiving a supply of power for charging the rechargeable power source. The housing may be configured for transport within an automated material handling system. Also provided are methods of charging a rechargeable wafer carrier system, which includes, for instance, providing a rechargeable wafer carrier system having at least one electronics system and a rechargeable power source, operably connecting the rechargeable wafer carrier system to a charging base, and supplying power from the charging base to the rechargeable power source.

10. 发明授权

US10818528B2 Self-contained metrology wafer carrier systems 有权
公开(公告)号：US10818528B2
公开(公告)日：2020-10-27
申请号：US16248220
申请日：2019-01-15
申请人： GLOBALFOUNDRIES Inc.
发明人： Abner Bello , Stephanie Waite , William J. Fosnight , Thomas Beeg
IPC分类号： G01J5/00 , H01L21/673 , H01L21/66 , G01N21/55 , G01N21/21 , G01J5/02 , H01L21/67 , G01R31/28 , G01N21/01 , H01L21/677 , G01R27/00 , G01J5/08 , G01B11/06 , G01B11/30
摘要： Self-contained metrology wafer carrier systems and methods of measuring one or more characteristics of semiconductor wafers. The wafer carrier system may include a housing configured for transport within the automated material handling system. A support is configured to support a semiconductor wafer within a housing. A metrology system is disposed within the housing. The metrology system is operable to measure at least one characteristic of the wafer. The metrology system may include a sensing unit and a computing unit operably connected to the sensing unit.

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