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1. 发明授权

US08648463B2 Assembly of multi-chip modules with proximity connectors using reflowable features 有权
标题翻译：使用可回流功能组装具有接近连接器的多芯片模块
公开(公告)号：US08648463B2
公开(公告)日：2014-02-11
申请号：US12781732
申请日：2010-05-17
申请人： Hiren D. Thacker , Jing Shi , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , Jing Shi , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/02 , H01L23/34 , H01L21/00
CPC分类号： H01L23/13 , H01L23/48 , H01L23/49811 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/05655 , H01L2224/05671 , H01L2224/13147 , H01L2224/13155 , H01L2224/1319 , H01L2224/13541 , H01L2224/13561 , H01L2224/1357 , H01L2224/13578 , H01L2224/13611 , H01L2224/14051 , H01L2224/14505 , H01L2224/16147 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17517 , H01L2224/81141 , H01L2224/81211 , H01L2224/81815 , H01L2225/06531 , H01L2225/06593 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15787 , H01L2924/00012 , H01L2924/00014 , H01L2924/01082 , H01L2924/01079 , H01L2924/01029 , H01L2924/01049 , H01L2924/206 , H01L2924/01028 , H01L2224/05552 , H01L2924/00
摘要： A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.
摘要翻译：描述了包括具有面对表面的至少两个基板的多芯片模块（MCM），其通过一组具有回流特性的耦合元件机械耦合。两个基板中的一个包括另一组具有不同于回流特性的另外的回流特性的耦合元件。耦合元件组的这些不同的回流特性允许在将两个基板彼此接合时使用不同的温度曲线，而不是将两个基板中的一个接合到载体上。例如，温度分布可以具有不同的峰值温度和/或彼此不同的持续时间。这些回流特性可以促进MCM中的基板的低成本，高产量组装和对准，并且可以允许将温度敏感组件包括在MCM中。

2. 发明授权

US08334149B2 Mechanical coupling in a multi-chip module using magnetic components 有权
标题翻译：使用磁性元件的多芯片模块中的机械耦合
公开(公告)号：US08334149B2
公开(公告)日：2012-12-18
申请号：US13467671
申请日：2012-05-09
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L21/00
CPC分类号： H01L23/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/16147 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01051 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。这些正面和负面的特征相互交织在一起。特别地，正特征可以与给定的一对负特征匹配，其包括每个基底上的负特征。此外，给定对中的负特征中的至少一个可以包括硬磁材料，并且给定对中的正特征和另一个负特征可以包括软磁材料，其提供到硬磁体的通量回流路径材料。以这种方式，硬磁材料可以促进基板的可重新机械耦合。

3. 发明授权

US08188581B2 Mechanical coupling in a multi-chip module using magnetic components 有权
公开(公告)号：US08188581B2
公开(公告)日：2012-05-29
申请号：US12568024
申请日：2009-09-28
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/495
CPC分类号： H01L23/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/16147 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01051 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.

4. 发明申请

US20110278718A1 ASSEMBLY OF MULTI-CHIP MODULES USING REFLOWABLE FEATURES 有权
标题翻译：使用可逆特性组装多芯片模块
公开(公告)号：US20110278718A1
公开(公告)日：2011-11-17
申请号：US12781732
申请日：2010-05-17
申请人： Hiren D. Thacker , Jing Shi , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Hiren D. Thacker , Jing Shi , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： H01L23/498 , H01L21/60
CPC分类号： H01L23/13 , H01L23/48 , H01L23/49811 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0652 , H01L25/50 , H01L2224/0401 , H01L2224/05557 , H01L2224/05558 , H01L2224/05571 , H01L2224/05655 , H01L2224/05671 , H01L2224/13147 , H01L2224/13155 , H01L2224/1319 , H01L2224/13541 , H01L2224/13561 , H01L2224/1357 , H01L2224/13578 , H01L2224/13611 , H01L2224/14051 , H01L2224/14505 , H01L2224/16147 , H01L2224/16225 , H01L2224/16227 , H01L2224/1703 , H01L2224/17517 , H01L2224/81141 , H01L2224/81211 , H01L2224/81815 , H01L2225/06531 , H01L2225/06593 , H01L2924/0002 , H01L2924/09701 , H01L2924/14 , H01L2924/15153 , H01L2924/15787 , H01L2924/00012 , H01L2924/00014 , H01L2924/01082 , H01L2924/01079 , H01L2924/01029 , H01L2924/01049 , H01L2924/206 , H01L2924/01028 , H01L2224/05552 , H01L2924/00
摘要： A multi-chip module (MCM) that includes at least two substrates, having facing surfaces, which are mechanically coupled by a set of coupling elements having a reflow characteristic, is described. One of the two substrates includes another set of coupling elements having another reflow characteristic, which is different than the reflow characteristic. These different reflow characteristics of the sets of coupling elements allow different temperature profiles to be used when bonding the two substrates to each other than when bonding the one of the two substrates to a carrier. For example, the temperature profiles may have different peak temperatures and/or different durations from one another. These reflow characteristics may facilitate low-cost, high-yield assembly and alignment of the substrates in the MCM, and may allow temperature-sensitive components to be included in the MCM.
摘要翻译：描述了包括具有面对表面的至少两个基板的多芯片模块（MCM），其通过一组具有回流特性的耦合元件机械耦合。两个基板中的一个包括另一组具有不同于回流特性的另外的回流特性的耦合元件。耦合元件组的这些不同的回流特性允许在将两个基板彼此接合时使用不同的温度曲线，而不是将两个基板中的一个接合到载体上。例如，温度分布可以具有不同的峰值温度和/或彼此不同的持续时间。这些回流特性可以促进MCM中的基板的低成本，高产量组装和对准，并且可以允许将温度敏感组件包括在MCM中。

5. 发明申请

US20120220056A1 MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS 有权
标题翻译：使用磁性元件的多芯片模块中的机械耦合
公开(公告)号：US20120220056A1
公开(公告)日：2012-08-30
申请号：US13467671
申请日：2012-05-09
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L21/02
CPC分类号： H01L23/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/16147 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01051 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。这些正面和负面的特征相互交织在一起。特别地，正特征可以与给定的一对负特征匹配，其包括每个基底上的负特征。此外，给定对中的负特征中的至少一个可以包括硬磁材料，并且给定对中的正特征和另一个负特征可以包括软磁材料，其提供到硬磁体的通量回流路径材料。以这种方式，硬磁材料可以促进基板的可重新机械耦合。

6. 发明申请

US20110074011A1 MECHANICAL COUPLING IN A MULTI-CHIP MODULE USING MAGNETIC COMPONENTS 有权
标题翻译：使用磁性元件的多芯片模块中的机械耦合
公开(公告)号：US20110074011A1
公开(公告)日：2011-03-31
申请号：US12568024
申请日：2009-09-28
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/34 , H01L21/00
CPC分类号： H01L23/13 , H01L24/48 , H01L24/73 , H01L25/0652 , H01L25/0657 , H01L2224/16147 , H01L2224/16237 , H01L2224/48091 , H01L2224/48227 , H01L2224/73257 , H01L2224/81141 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06593 , H01L2924/00014 , H01L2924/01006 , H01L2924/01012 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01038 , H01L2924/01051 , H01L2924/01056 , H01L2924/01079 , H01L2924/014 , H01L2924/10253 , H01L2924/14 , H01L2924/15153 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features mate with each other. In particular, a positive feature may mate with a given pair of negative features, which includes negative features on each of the substrates. Furthermore, at least one of the negative features in the given pair may include a hard magnetic material, and the positive feature and the other negative feature in the given pair may include a soft magnetic material that provide a flux-return path to the hard magnetic material. In this way, the hard magnetic material may facilitate the remateable mechanical coupling of the substrates.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。这些正面和负面的特征相互交织在一起。特别地，正特征可以与给定的一对负特征匹配，其包括每个基底上的负特征。此外，给定对中的负特征中的至少一个可以包括硬磁材料，并且给定对中的正特征和另一个负特征可以包括软磁材料，其提供到硬磁体的通量回流路径材料。以这种方式，硬磁材料可以促进基板的可重新机械耦合。

7. 发明授权

US08315065B2 Self-locking features in a multi-chip module 有权
标题翻译：多芯片模块中的自锁功能
公开(公告)号：US08315065B2
公开(公告)日：2012-11-20
申请号：US12568017
申请日：2009-09-28
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy
IPC分类号： H05K7/02 , H05K7/06 , H05K7/08 , H05K7/10
CPC分类号： H05K3/303 , H01L23/13 , H01L23/49811 , H01L23/49838 , H01L2924/0002 , H05K3/325 , H05K2201/0311 , H05K2201/09036 , H05K2201/1059 , H05K2201/209 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , H01L2924/00
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。这些积极和消极的特征可以彼此交配和自锁。例如，其中一个表面上的阳性特征可以包括成对的相对的微弹簧，并且负特征可以包括在另一个表面上的凹坑或凹槽。当基板机械耦合时，给定的一对正特征可以在另一表面的平面中提供力。此外，通过压缩MCM使得基板的表面彼此推动，可以释放机械联接。

8. 发明申请

US20110075380A1 SELF-LOCKING FEATURES IN A MULTI-CHIP MODULE 有权
标题翻译：多芯片模块中的自锁特性
公开(公告)号：US20110075380A1
公开(公告)日：2011-03-31
申请号：US12568017
申请日：2009-09-28
申请人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy
发明人： Jing Shi , Hiren D. Thacker , Ashok V. Krishnamoorthy
IPC分类号： H05K1/14 , H05K3/36
CPC分类号： H05K3/303 , H01L23/13 , H01L23/49811 , H01L23/49838 , H01L2924/0002 , H05K3/325 , H05K2201/0311 , H05K2201/09036 , H05K2201/1059 , H05K2201/209 , H05K2203/167 , Y02P70/613 , Y10T29/49126 , H01L2924/00
摘要： A multi-chip module (MCM) is described. This MCM includes at least two substrates that are remateably mechanically coupled by positive and negative features on facing surfaces of the substrates. These positive and negative features may mate and self-lock with each other. For example, the positive features on one of the surfaces may include pairs of counterposed micro-springs, and the negative features may include pits or grooves on the other surface. When the substrates are mechanically coupled, a given pair of positive features may provide a force in a plane of the other surface. Furthermore, by compressing the MCM so that the surfaces of the substrates are pushed toward each other, the mechanical coupling may be released.
摘要翻译：描述了多芯片模块（MCM）。该MCM包括至少两个基板，其通过在基板的相对表面上的正和负特征可重新机械耦合。这些积极和消极的特征可以彼此交配和自锁。例如，其中一个表面上的阳性特征可以包括成对的相对的微弹簧，并且负特征可以包括在另一个表面上的凹坑或凹槽。当基板机械耦合时，给定的一对正特征可以在另一表面的平面中提供力。此外，通过压缩MCM使得基板的表面彼此推动，可以释放机械联接。

9. 发明授权

US07863743B1 Capactive connectors with enhanced capacitive coupling 有权
标题翻译：具有增强电容耦合的电容式连接器
公开(公告)号：US07863743B1
公开(公告)日：2011-01-04
申请号：US12494981
申请日：2009-06-30
申请人： Jing Shi , Darko R. Popovic , Ashok V. Krishnamoorthy
发明人： Jing Shi , Darko R. Popovic , Ashok V. Krishnamoorthy
IPC分类号： H01L23/48
CPC分类号： H01L25/0657 , H01L23/642 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/00
摘要： A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other.
摘要翻译：描述了包括SCM的至少两个实例的单芯片模块（SCM）和多芯片模块（MCM）。 SCM包括设置在基板上的焊盘。该垫具有包括特征图案的顶面。特征图案中的给定特征具有高于垫的最小厚度的高度，从而增加与衬垫相关联的电容相对于顶表面为平面的构造。此外，设置在MCM中的SCM的两个实例上的焊盘可以各自具有对应的特征图案，其相对于其中一个或两个焊盘的顶表面是平面的配置增加了焊盘之间的电容耦合。注意，焊盘可以对准，使得这些焊盘上的特征图案中的特征彼此交叉。

10. 发明申请

US20100327460A1 CAPACTIVE CONNECTORS WITH ENHANCED CAPACITIVE COUPLING 有权
标题翻译：具有增强电容耦合的电容连接器
公开(公告)号：US20100327460A1
公开(公告)日：2010-12-30
申请号：US12494981
申请日：2009-06-30
申请人： Jing Shi , Darko R. Popovic , Ashok V. Krishnamoorthy
发明人： Jing Shi , Darko R. Popovic , Ashok V. Krishnamoorthy
IPC分类号： H01L25/065 , H01L23/495
CPC分类号： H01L25/0657 , H01L23/642 , H01L2225/06513 , H01L2225/06531 , H01L2225/06534 , H01L2924/0002 , H01L2924/00
摘要： A single-chip module (SCM) and a multi-chip module (MCM) that includes at least two instances of the SCM are described. The SCM includes a pad disposed on a substrate. This pad has a top surface that includes a pattern of features. A given feature in the pattern of features has a height that extends above a minimum thickness of the pad, thereby increasing a capacitance associated with the pad relative to a configuration in which the top surface is planar. Furthermore, pads disposed on the two instances of the SCM in the MCM may each have a corresponding pattern of features that increases the capacitive coupling between the pads relative to a configuration in which the top surfaces of either or both of the pads are planar. Note that the pads may be aligned such that features in the patterns of features on these pads are interdigited with each other.
摘要翻译：描述了包括SCM的至少两个实例的单芯片模块（SCM）和多芯片模块（MCM）。 SCM包括设置在基板上的焊盘。该垫具有包括特征图案的顶面。特征图案中的给定特征具有高于垫的最小厚度的高度，从而增加与衬垫相关联的电容相对于顶表面为平面的构造。此外，设置在MCM中的SCM的两个实例上的焊盘可以各自具有对应的特征图案，其相对于其中一个或两个焊盘的顶表面是平面的配置增加了焊盘之间的电容耦合。注意，焊盘可以对准，使得这些焊盘上的特征图案中的特征彼此交叉。

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