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1. 发明申请

US20130100628A1 Printed Circuit Board and Electronic Device Using Printed Circuit Board 有权
标题翻译：印刷电路板和使用印刷电路板的电子设备
公开(公告)号：US20130100628A1
公开(公告)日：2013-04-25
申请号：US13655049
申请日：2012-10-18
申请人： Hitachi Automotive Systems, Ltd.
发明人： Takuto YAMAGUCHI
IPC分类号： H05K1/11
CPC分类号： H01R12/585 , H05K1/0271 , H05K1/116 , H05K3/308 , H05K2201/10189 , H05K2201/1059
摘要： An electronic device having a press-fit connection for connecting a connector and an electronic part mounted on a printed circuit board which is possible to enable high density mounting. Viewing the printed circuit board from an upper surface, between adjacent through holes on which a compressive force acts upon insertion of the press-fit terminal, among the large number of through holes, a land or a conductor film connected to the conductor film formed on the inner wall surface of the through hole or the conductor film not connected to the conductor film formed on the inner wall surface of the through hole, formed in the circuit board held between the top layer circuit board and the bottom layer circuit board, exists in a width equal to or wider than the diameter of the through hole.
摘要翻译：具有用于连接连接器的压配合连接器和安装在印刷电路板上的可能实现高密度安装的电子部件的电子设备。在大量通孔中观察印刷电路板的上表面，相邻通孔之间施加有压缩力作用在压配合端子之间的连接到导体膜上的焊盘或导体膜，形成在贯通孔的内壁面或导体膜未连接到形成于贯通孔的内壁面的导体膜，形成在保持在顶层电路基板与底层电路基板之间的电路基板中，存在于宽度等于或大于通孔的直径。

2. 发明申请

US20170108390A1 Mechanical Quantity Measuring Device and Sensor Unit 审中-公开
公开(公告)号：US20170108390A1
公开(公告)日：2017-04-20
申请号：US15107246
申请日：2015-01-26
申请人： Hitachi Automotive Systems, Ltd.
发明人： Hanae SHIMOKAWA , Hiroyuki OOTA , Atsushi KAZAMA , Shohei HATA , Takuto YAMAGUCHI , Atsuo SOMA , Kisho ASHIDA , Junji ONOZUKA , Kentarou MIYAJIMA , Masayuki HIO
IPC分类号： G01L9/00 , G01L19/14 , G01L19/04
摘要： A mechanical quantity measuring device includes: a sensor chip having a strain detector formed on a surface of a semiconductor substrate and a plurality of electrodes connected to the strain detector; a stem having ascot that protrudes from an adjacent peripheral portion and has an upper surface that is attached to a lower surface of the sensor chip by a bonding material formed from a metallic material or a glass material; a lead-out wiring part including a plurality of wires that are electrically connected to the plurality of electrodes; and a fixing part for fixing the stem, wherein: the stem and the fixing part are integrally molded or fixed through metallic bonding or mechanical bonding.

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