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1. 发明授权

US09363891B2 Printed wiring board and method for manufacturing the same 有权
标题翻译：印刷电路板及其制造方法
公开(公告)号：US09363891B2
公开(公告)日：2016-06-07
申请号：US14680463
申请日：2015-04-07
申请人： IBIDEN CO., LTD.
发明人： Satoru Kawai , Kenji Sakai , Liyi Chen
IPC分类号： H05K1/11 , H05K1/09 , H05K7/12 , H05K3/40 , H05K1/02 , H05K1/03 , H05K3/34 , H05K3/20 , H05K3/46
CPC分类号： H05K1/112 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/81192 , H01L2924/00014 , H01L2924/15311 , H05K1/0298 , H05K1/032 , H05K1/113 , H05K3/205 , H05K3/3457 , H05K3/4007 , H05K3/4644 , H05K3/4682 , H05K2201/0195 , H05K2201/0367 , H05K2201/09472 , H05K2201/096 , H05K2203/0361 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.
摘要翻译：印刷电路板包括树脂绝缘层，该树脂绝缘层具有在第一表面的相对侧上的第一表面和第二表面，树脂绝缘层具有用于通路导体的开口，形成在树脂绝缘层的第一表面上的焊盘并且提供用于安装电子部件，形成在树脂绝缘层的第二表面上的导电电路和形成在开口中并连接焊盘和导电电路的通孔导体。垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。

2. 发明授权

US09226409B2 Method for manufacturing a wiring board 有权
标题翻译：线路板制造方法
公开(公告)号：US09226409B2
公开(公告)日：2015-12-29
申请号：US13853087
申请日：2013-03-29
申请人： IBIDEN CO., LTD.
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K3/32 , H05K3/40 , H05K1/02 , H05K1/11 , H05K1/18 , H05K3/46
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译：布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路，衬底和第一或第二电路，以及在层间层上的第三导电电路。层间层在层间层中具有通孔导体，并连接第三电路和第二导体。衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体。通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

3. 发明申请

US20150216050A1 PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：印刷线路板及其制造方法
公开(公告)号：US20150216050A1
公开(公告)日：2015-07-30
申请号：US14680463
申请日：2015-04-07
申请人： IBIDEN CO., LTD.
发明人： Satoru KAWAI , Kenji Sakai , Liyi Chen
IPC分类号： H05K1/11 , H05K1/03 , H05K3/34 , H05K1/02
CPC分类号： H05K1/112 , H01L2224/0554 , H01L2224/05568 , H01L2224/05573 , H01L2224/16227 , H01L2224/16235 , H01L2224/16238 , H01L2224/81192 , H01L2924/00014 , H01L2924/15311 , H05K1/0298 , H05K1/032 , H05K1/113 , H05K3/205 , H05K3/3457 , H05K3/4007 , H05K3/4644 , H05K3/4682 , H05K2201/0195 , H05K2201/0367 , H05K2201/09472 , H05K2201/096 , H05K2203/0361 , Y10T29/49126 , Y10T29/4913 , Y10T29/49144 , Y10T29/49155 , Y10T29/49165 , H01L2224/05599 , H01L2224/0555 , H01L2224/0556
摘要： A printed wiring board includes a resin insulation layer having a first surface and a second surface on an opposite side of the first surface, the resin insulation layer having an opening for a via conductor, a pad formed on the first surface of the resin insulation layer and provided to mount an electronic component, a conductive circuit formed on the second surface of the resin insulation layer, and a via conductor formed in the opening and connecting the pad and the conductive circuit. The pad has an embedded portion embedded in the resin insulation layer and a protruding portion protruding from the resin insulation layer, and the embedded portion has an external shape which is greater than an external shape the protruding portion.
摘要翻译：印刷电路板包括树脂绝缘层，该树脂绝缘层具有在第一表面的相对侧上的第一表面和第二表面，树脂绝缘层具有用于通路导体的开口，形成在树脂绝缘层的第一表面上的焊盘并且提供用于安装电子部件，形成在树脂绝缘层的第二表面上的导电电路和形成在开口中并连接焊盘和导电电路的通孔导体。垫具有嵌入在树脂绝缘层中的嵌入部分和从树脂绝缘层突出的突出部分，并且嵌入部分具有大于突出部分的外部形状的外部形状。

4. 发明申请

US20130219714A1 WIRING BOARD AND METHOD FOR MANUFACTURING THE SAME 审中-公开
标题翻译：接线板及其制造方法
公开(公告)号：US20130219714A1
公开(公告)日：2013-08-29
申请号：US13853087
申请日：2013-03-29
申请人： IBIDEN CO., LTD.
发明人： Atsushi Ishida , Ryojiro Tominaga , Kenji Sakai
IPC分类号： H05K3/40
CPC分类号： H05K3/4038 , H05K1/0222 , H05K1/0231 , H05K1/115 , H05K1/185 , H05K3/4602 , H05K2201/09563 , H05K2201/096 , H05K2201/09827 , H05K2201/10636 , Y02P70/611 , Y10T29/49165
摘要： A wiring board includes a substrate having first and second surfaces and a first penetrating hole through the substrate, a first conductive circuit on the first surface of the substrate, a second conductive circuit on the second surface of the substrate, an interlayer insulation layer on the substrate and the first or second circuit, and a third conductive circuit on the interlayer layer. The interlayer layer has a via conductor in the interlayer layer and connecting the third circuit and the second conductor. The substrate has a first through-hole conductor connecting the first and second circuits and on the inner wall of the first hole, a filler filled inside the first conductor and forming a second penetrating hole, and a second through-hole conductor in the second hole. The via conductor is shifted from the center of the second conductor in the direction parallel to the first surface of the substrate.
摘要翻译：布线板包括具有第一表面和第二表面的基底和穿过基底的第一穿透孔，在基底的第一表面上的第一导电电路，在基底的第二表面上的第二导电电路，衬底和第一或第二电路，以及在层间层上的第三导电电路。层间层在层间层中具有通孔导体，并连接第三电路和第二导体。衬底具有第一通孔导体，其连接第一和第二电路，并且在第一孔的内壁上填充填充在第一导体内部并形成第二穿透孔的填充物，以及在第二孔中形成第二通孔导体。通孔导体在平行于基板的第一表面的方向上从第二导体的中心偏移。

5. 发明授权

US09807885B2 Wiring board with built-in electronic component and method for manufacturing the same 有权
公开(公告)号：US09807885B2
公开(公告)日：2017-10-31
申请号：US15138792
申请日：2016-04-26
申请人： IBIDEN CO., LTD.
发明人： Kenji Sakai , Tomoyuki Ikeda , Toshiki Furutani
IPC分类号： H05K1/18 , H05K3/00 , H05K1/02 , H05K3/46 , H05K3/32
CPC分类号： H05K1/185 , H01L2224/16227 , H05K1/0298 , H05K3/32 , H05K3/4602 , H05K3/4644 , H05K3/4652 , H05K3/4688 , H05K2201/0187 , H05K2201/09009 , H05K2201/09536 , H05K2201/09854 , H05K2201/10015 , H05K2201/10522 , H05K2201/10636 , H05K2203/0191 , H05K2203/1563 , Y02P70/611
摘要： A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.

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