专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20180311889A1 METHOD FOR TREATING MILLIMETRE AND/OR MICROMETRE AND/OR NANOMETRE STRUCTURES ON A SURFACE OF A SUBSTRATE 审中-公开
公开(公告)号：US20180311889A1
公开(公告)日：2018-11-01
申请号：US15770638
申请日：2016-10-25
申请人： EV Group E. Thallner GmbH
发明人： Gerald Mittendorfer
IPC分类号： B29C63/00 , B32B27/28 , B32B27/30
CPC分类号： B29C63/0013 , B29C2063/006 , B32B3/30 , B32B7/06 , B32B7/12 , B32B9/04 , B32B27/06 , B32B27/08 , B32B27/16 , B32B27/281 , B32B27/283 , B32B27/285 , B32B27/308 , B32B27/34 , B32B27/38 , B32B2250/44 , B32B2307/51 , B32B2307/714 , B32B2307/748 , B32B2457/14 , H01L23/3135 , H05K3/007 , H05K3/0079 , H05K3/0085 , H05K3/0097 , H05K2203/0769 , H05K2203/1361 , H05K2203/1366 , H05K2203/1383 , H05K2203/1545 , H05K2203/1563
摘要： A method for treating a substrate having millimeter and/or micrometer and/or nanometer structures. The method includes applying at least one protective material to the structures, wherein the at least one protective material can be dissolved in a solvent, and the structures are produced by an imprinting process.

2. 发明申请

US20160316566A1 WIRING BOARD WITH BUILT-IN ELECTRONIC COMPONENT AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：具有内置电子元件的接线板及其制造方法
公开(公告)号：US20160316566A1
公开(公告)日：2016-10-27
申请号：US15138792
申请日：2016-04-26
申请人： IBIDEN CO., LTD.
发明人： Kenji SAKAI , Tomoyuki IKEDA , Toshiki FURUTANI
IPC分类号： H05K1/18 , H05K3/46 , H05K3/32 , H05K1/02
CPC分类号： H05K1/185 , H01L2224/16227 , H05K1/0298 , H05K3/32 , H05K3/4602 , H05K3/4644 , H05K3/4652 , H05K3/4688 , H05K2201/0187 , H05K2201/09009 , H05K2201/09536 , H05K2201/09854 , H05K2201/10015 , H05K2201/10522 , H05K2201/10636 , H05K2203/0191 , H05K2203/1563 , Y02P70/611
摘要： A wiring board includes electronic components, a multilayer core substrate including insulating layers and conductive layers such that the insulating layers include a central insulating layer in the center position of the core in the thickness direction, a first build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core, and a second build-up layer including an insulating layer and a conductive layer such that the insulating layer has resin composition different from that of the insulating layers in the core. The core has cavities accommodating the electronic components, respectively, and including a first cavity and a second cavity such that the first and second cavities have different lengths in the thickness direction and are penetrating through the central layer at centers of the first and second cavities in the thickness direction.
摘要翻译：布线板包括电子部件，包括绝缘层和导电层的多层芯基板，使得绝缘层包括在芯的厚度方向的中心位置的中心绝缘层，包括绝缘层的第一累积层和导电层，使得所述绝缘层具有与所述芯中的绝缘层的树脂组合物不同的树脂组合物，以及包括绝缘层和导电层的第二堆积层，使得所述绝缘层具有与所述绝缘层不同的树脂组合物核心中的绝缘层。芯具有分别容纳电子元件的空腔，并且包括第一空腔和第二空腔，使得第一和第二空腔在厚度方向上具有不同的长度，并且在第一和第二空腔的中心穿过中心层厚度方向。

3. 发明申请

US20160165721A1 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD AND FLEXIBLE PRINTED CIRCUIT BOARD MANUFACTURED THEREBY 审中-公开
标题翻译：制造柔性印刷电路板的柔性印刷电路板的制造方法
公开(公告)号：US20160165721A1
公开(公告)日：2016-06-09
申请号：US14897200
申请日：2014-04-11
申请人： AMOGREENTECH CO., LTD.
发明人： O-Chung Kwon , Jeong-Sang Yu , Jae-Sic Kim , Yong-Il Kim , Hyun-Soo Jang
IPC分类号： H05K1/03 , H05K3/46 , H05K3/40 , H05K3/12 , H05K3/28
CPC分类号： H05K3/4664 , H05K3/0014 , H05K3/007 , H05K3/1208 , H05K3/1216 , H05K3/1283 , H05K3/28 , H05K3/285 , H05K3/381 , H05K3/4069 , H05K2203/097 , H05K2203/1194 , H05K2203/1461 , H05K2203/1563 , H05K2203/1572
摘要： A method for manufacturing a flexible printed circuit board includes preliminarily thermally deforming s substrate through heating, forming a circuit pattern with a conductive paste on the preliminarily thermally deformed substrate, and firing the circuit pattern. A flexible printed circuit board includes a substrate, and a circuit pattern formed by firing a conductive paste on a first surface of the substrate. The substrate is preliminarily thermally deformed and, thus, a shrinkage variation thereof before and after firing the conductive paste is zero. Dimensional stability when firing the circuit pattern printed with the conductive paste can be ensured, deterioration of adhesion between the circuit pattern and the substrate attributable to film deformation upon firing can be prevented, and stable adhesion of the circuit pattern can be maintained even after firing.
摘要翻译：柔性印刷电路板的制造方法包括通过加热预先使基板热变形，在预热变形的基板上形成具有导电浆料的电路图案，并且对该电路图案进行点火。柔性印刷电路板包括基板和通过在基板的第一表面上焙烧导电浆料形成的电路图案。基板预热变形，因此，在导电浆料烧成前后的收缩变化为零。可以确保烧制印有导电膏的电路图形时的尺寸稳定性，可以防止由于烧成时的膜变形引起的电路图案与基板之间的粘合性的劣化，即使在烧成后也能够保持电路图案的稳定的粘合。

4. 发明申请

US20150026972A1 METHOD OF PRODUCING ELECTRONIC COMPONENTS AND METHOD OF PRODUCING SUBSTRATE-TYPE TERMINALS 有权
标题翻译：生产电子元件的方法和生产基片型端子的方法
公开(公告)号：US20150026972A1
公开(公告)日：2015-01-29
申请号：US14332652
申请日：2014-07-16
申请人： Murata Manufacturing Co., Ltd.
发明人： Kazuto OGAWA , Takashi WATANABE , Junya SHIMAKAWA , Mitsuhide KATO
IPC分类号： H05K3/30
CPC分类号： H05K3/0052 , H01G2/065 , H05K1/141 , H05K3/3442 , H05K2201/049 , H05K2201/0909 , H05K2201/09181 , H05K2201/09645 , H05K2201/10636 , H05K2203/0191 , H05K2203/1563 , Y02P70/611 , Y10T29/4913
摘要： A method of producing electronic components each including a substrate-type terminal and a device connected to the substrate-type terminal including a substrate body with first and second principal surfaces opposite to each other and an electrode configured to be connected to the device on the first principal surface, wherein the device is disposed on the first principal surface, includes forming grooves in a substrate from one of the first and second principal surfaces of the substrate such that the substrate is divided into the substrate-type terminals, the grooves each having a depth less than a thickness of the substrate, cutting the substrate from another principal surface opposite to the principal surface of the substrate body such that the grooves penetrate through the substrate in a thickness direction thereof, and mounting the device on each of the first principal surfaces.
摘要翻译：一种电子部件的制造方法，其特征在于，具有基板型端子和与所述基板型端子连接的装置，所述基板型端子包括基板主体，所述基板主体具有彼此相对的第一和第二主要表面;以及电极，被配置为在所述第一主要表面，其中所述装置设置在所述第一主表面上，包括在所述基板的所述第一和第二主表面中的一个的基板中形成凹槽，使得所述基板被划分为所述基板型端子，所述凹槽各自具有深度小于基板的厚度，从与基板主体的主表面相反的另一主表面切割基板，使得凹槽在其厚度方向上穿过基板，并将该装置安装在每个第一主表面上。

5. 发明授权

US08314825B2 Laser direct imaging apparatus and imaging method 有权
标题翻译：激光直接成像装置及成像方法
公开(公告)号：US08314825B2
公开(公告)日：2012-11-20
申请号：US12191901
申请日：2008-08-14
申请人： Yoshitatsu Naito , Mitsuhiro Suzuki , Tomotsugu Katoh
发明人： Yoshitatsu Naito , Mitsuhiro Suzuki , Tomotsugu Katoh
IPC分类号： B41J2/47
CPC分类号： H05K3/0082 , G03F7/2053 , G03F9/00 , H05K1/0269 , H05K3/0008 , H05K2201/091 , H05K2201/09918 , H05K2203/082 , H05K2203/107 , H05K2203/1563 , H05K2203/1572 , H05K2203/167
摘要： A laser beam direct imaging apparatus and an imaging method which can precisely determine a back-surface-side position with respect to a front-surface-side position even if any kind of photosensitive material is used. In the laser direct imaging apparatus, a laser beam is deflected toward a main scanning direction (X-axis direction) while a workpiece mounted on a table is moved in a sub-scanning direction (Y-axis direction) so that a pattern is imaged on the surface of the workpiece. Hollow pins are disposed on the table so that the tips of the hollow pins 20 project over the surface of the table by a predetermined distance. The workpiece is sucked onto the table so that indentations (indentations by the tips of the hollow pins) are formed on the back surface of the workpiece. When a pattern is imaged on the back surface, imaging is performed with reference to the indentations.
摘要翻译：即使使用任何种类的感光材料，也可以精确地确定相对于前表面侧位置的背面侧位置的激光束直接成像装置和成像方法。在激光直接成像装置中，激光束朝向主扫描方向（X轴方向）偏转，同时安装在工作台上的工件沿副扫描方向（Y轴方向）移动，使得图案被成像在工件表面。空心销设置在桌子上，使得中空销20的尖端在桌子的表面上突出预定距离。工件被吸入工作台上，使得在工件的后表面上形成有凹陷（由中空销的顶端压入）。当在背面上成像图案时，参考凹痕进行成像。

6. 发明授权

US07617774B2 Method for printing an electronic circuit component on a substrate using a printing machine 失效
标题翻译：使用印刷机在基板上印刷电子电路部件的方法
公开(公告)号：US07617774B2
公开(公告)日：2009-11-17
申请号：US11118725
申请日：2005-04-29
申请人： Thomas Walther , Reinhard Baumann , Peer Dilling , Robert Weiss
发明人： Thomas Walther , Reinhard Baumann , Peer Dilling , Robert Weiss
IPC分类号： B41F1/12
CPC分类号： H05K3/12 , G06K19/07749 , H05K1/0266 , H05K3/046 , H05K3/1275 , H05K2203/0522 , H05K2203/0534 , H05K2203/1563 , H05K2203/1581
摘要： A method of printing an electronic circuit or components thereof uses a printing machine to print a conductive structure on the front printing side (back side of the sheet) of a printing substrate. The sheet is then reversed and a decorative printing motif is printed on the back side in one work step. Alternatively, the circuit or components of a circuit may be printed by having a printing machine for color printing preceded by a printing machine for printing on the back side of the printing substrate. A chip is applied to the printing substrate where the back side of the printing sheet with the printing motif is cooled to prevent any negative effect on the printing motif and/or the printing substrate.
摘要翻译：打印电子电路或其组件的方法使用印刷机在印刷基板的前印刷侧（片材的背面）上印刷导电结构。然后将纸张倒转，并在一个工作步骤中在背面印刷装饰性印刷图案。或者，电路的电路或组件可以通过具有用于彩色印刷的印刷机打印，之后印刷机用于在印刷基板的背面进行印刷。将芯片施加到印刷基板上，其中印刷图案的印刷版的背面被冷却以防止对印刷图案和/或印刷基板的任何负面影响。

7. 发明授权

US07062845B2 Conveyorized blind microvia laser drilling system 失效
标题翻译：输送盲孔微孔激光钻孔系统
公开(公告)号：US07062845B2
公开(公告)日：2006-06-20
申请号：US10389544
申请日：2003-03-14
申请人： Larry W. Burgess
发明人： Larry W. Burgess
IPC分类号： B23P19/00
CPC分类号： B23K26/0626 , B23K26/066 , B23K26/082 , B23K26/0853 , B23K26/0876 , B23K26/282 , B23K26/389 , B23K26/40 , B23K2101/40 , B23K2103/50 , H05K1/0269 , H05K1/112 , H05K1/167 , H05K3/0008 , H05K3/0026 , H05K3/0035 , H05K3/4638 , H05K3/4652 , H05K3/4679 , H05K2201/09518 , H05K2201/09845 , H05K2201/09918 , H05K2203/0165 , H05K2203/0554 , H05K2203/056 , H05K2203/081 , H05K2203/082 , H05K2203/1509 , H05K2203/1545 , H05K2203/1563 , Y10T29/49155 , Y10T29/49156 , Y10T29/49165 , Y10T29/532 , Y10T29/53261
摘要： A laser drilling system for drilling blind vias in printed circuit board panels, multichip modules and chipscale packages with top and bottom surfaces and which include multiple dielectric polymer and metal layers. The system includes a first laser module comprising a laser able to form at least one via per pulse through one or more polymer layers. The vias are circular or non-circular in shape. An articulated arm is adapted to move at a speed of about 200 inches per second and at an acceleration of about 5 g's or more. A beam delivery unit is attached to the articulated arm and a conveyor adapted to move panels at a constant speed. The first laser module positioned on a separate track from the conveyor moves at a faster rate than the conveyor to drill the top surface. A second laser module is positioned to move on another separate track from the conveyor movable at a faster rate so as to drill the bottom surface.
摘要翻译：一种用于在印刷电路板面板，多芯片模块和具有顶表面和底表面的芯片尺寸封装中钻孔盲孔的激光钻孔系统，并且包括多个介电聚合物和金属层。该系统包括第一激光器模块，其包括能够通过一个或多个聚合物层在每个脉冲上形成至少一个通孔的激光器。通孔为圆形或非圆形。铰接臂适于以每秒约200英寸的速度和约5g或更大的加速度移动。梁传送单元附接到铰接臂和适于以恒定速度移动面板的传送器。位于与输送机分离的轨道上的第一激光模块以比输送机更快的速度移动以钻顶表面。第二激光模块被定位成在另一独立的轨道上移动，该输送机能够以更快的速度运动，以便钻下底面。

8. 发明授权

US06198525B1 System for contact imaging both sides of a substrate 失效
标题翻译：用于接触成像基板两侧的系统
公开(公告)号：US06198525B1
公开(公告)日：2001-03-06
申请号：US09253673
申请日：1999-02-19
申请人： Wayne Albert Barringer , Guenter Schaefer
发明人： Wayne Albert Barringer , Guenter Schaefer
IPC分类号： G03B2732
CPC分类号： H05K3/0082 , G03B27/32 , H05K1/0393 , H05K2203/1563 , H05K2203/1572
摘要： Apparatus for contact exposing each side of a substrate to a different image on a mask includes a first-side imaging station for imaging the first side of the substrate, a second-side imaging station for imaging the second side thereof, an intermediate station between the imaging stations for inverting the substrate. In each imaging station, the substrate is moved longitudinally with a transport carriage, from which it is transferred to an imaging carriage to be driven to an imaging point at which illumination through the mask occurs. The imaging carriage moves in both longitudinal and transverse directions, providing for both exposure to a mask covering the substrate and for step-and-repeat exposure of multiple portions of the substrate to a smaller image. Before exposure, the top surface of the substrate is aligned to be parallel to the adjacent mask, fiducial markings in the substrate are aligned with fiducial markings on the mask, and air is evacuated from the area between the mask and the substrate.
摘要翻译：用于将衬底的每一侧接触到掩模上的不同图像的接触装置包括用于对衬底的第一侧进行成像的第一侧成像站，用于对其第二侧进行成像的第二侧成像站，用于翻转衬底的成像站。在每个成像站中，基板与传送托架纵向移动，从该托架传送到成像托架以被驱动到通过掩模发生照明的成像点。成像托架在纵向和横向方向上移动，提供暴露于覆盖基底的掩模，并且用于将基底的多个部分逐步和重复地暴露于较小的图像。在曝光之前，将衬底的顶表面对齐以平行于相邻掩模，衬底中的基准标记与掩模上的基准标记对准，并且空气从掩模和衬底之间的区域排出。

9. 发明授权

US5678304A Method for manufacturing double-sided circuit assemblies 失效
标题翻译：制造双面电路组件的方法
公开(公告)号：US5678304A
公开(公告)日：1997-10-21
申请号：US686081
申请日：1996-07-24
申请人： Jay B. Soper
发明人： Jay B. Soper
IPC分类号： H05K3/00 , H05K3/34 , H05K13/08
CPC分类号： H05K13/08 , H05K3/3415 , H05K2203/1476 , H05K2203/1563 , H05K2203/1572 , H05K3/0097 , Y02P70/613 , Y10T29/49144
摘要： A method for manufacturing double-sided circuit assemblies by a surface mount process includes the steps of: arranging the circuit assemblies in arrays so that two or more circuit assemblies, at least one top side up and at least one bottom side up, are provided in each array; populating one side of the circuit assemblies in a first pass of the arrays through the surface mount process; flipping each array over; and populating the other side of the circuit assemblies in a second pass of the flipped arrays through the same surface mount process with no changes in stencil, placement program, or components.
摘要翻译：通过表面贴装工艺制造双面电路组件的方法包括以下步骤：将电路组件排列成阵列，使得两个或更多个电路组件至少有一个顶侧向上和至少一个底侧向上设置在每个阵列在阵列的第一遍中通过表面安装过程填充电路组件的一侧; 翻转每个阵列; 并且通过相同的表面贴装过程在翻转阵列的第二次通过中填充电路组件的另一侧，而没有模板，放置程序或组件的变化。

10. 发明授权

US5188669A Circuit board coating apparatus with inverting pallet shuttle 失效
标题翻译：电路板涂层设备，带有翻转托盘梭
公开(公告)号：US5188669A
公开(公告)日：1993-02-23
申请号：US659855
申请日：1991-02-22
申请人： William E. Donges , Jacques Mycke
发明人： William E. Donges , Jacques Mycke
IPC分类号： B05B13/02 , H05K3/00
CPC分类号： H05K3/0091 , B05B13/0221 , H05K2203/1509 , H05K2203/1563
摘要： A coating apparatus has one coating station with a downwardly directed device to coat both opposite surfaces of two sided circuit boards. One upwardly facing surface of a first board is coated at the coating station and moved to a handling station while a second board is moved to the coating station where its upwardly facing surface is coated while the first board is inverted at the handling station. The first board is then moved to the coating station while the second board is removed to a handling station, and the opposite side of the first board is coated at the coating station while the second board is inverted at the handling station. The two boards are exchanged in the coating station and then the opposite side of the second board is coated there while the first board is exchanged with a third board at the handling station. Two handling stations are preferred, equally spaced from the coating station, with two boards are simultaneously carried by a shuttle in two invertible pallets spaced on the shuttle a fixed distance equal to that of the coating station from the handling stations. Couplings at the ends of the shuttle engage pallet rotating drives as a pallet moves into the handling station.
摘要翻译：涂覆装置具有一个具有向下定向装置的涂布台，以涂覆双面电路板的两个相对表面。第一板的一个面向上的表面在涂覆站处被涂覆并移动到处理站，而第二板被移动到其涂覆工位，其中其上面朝上的表面被涂覆，同时第一板在处理站处被倒置。然后将第一板移动到涂布站，同时将第二板移除到处理站，并且第一板的相对侧涂覆在涂布站处，同时第二板在处理站处倒置。两个板在涂覆站中更换，然后第二个板的相反侧涂覆在那里，而第一个板与处理站的第三个板交换。两个处理站是优选的，与涂装站等间隔，两个板同时由梭子承载在两个可倒置的托盘上，间隔一定距离等于来自处理站的涂布站的可移动托盘。当托盘移动到处理站时，梭子的端部处的联轴器接合托盘旋转驱动器。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式