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    • 1. 发明授权
    • Discrete sampling based nonlinear control system
    • 基于离散采样的非线性控制系统
    • US08874249B2
    • 2014-10-28
    • US14079132
    • 2013-11-13
    • International Business Machines Corporation
    • Christopher P. Ausschnitt
    • G06F19/00G03F7/20G05B13/02H01L21/66
    • H01L22/26G03F7/705G05B13/02H01L2924/0002H01L2924/00
    • System, method and computer program product for configuring and controlling a facility to perform a manufacturing process and updating a tool controlling the process according to a model employed for mapping calculated coefficients that characterize non-linear variations observed of a product to actual control parameters governing the processes/tools used by the facility during the manufacturing process. The method enables real-time control of variation in an exposure step of a patterning process using an exposure tool to minimize a nonlinear variation in one or more pattern attributes by adjusting the exposure tool or the patterning process corresponding to the calculated coefficients. In the method, measurements of product attributes, obtained by finite sampling over a well defined domain, are projected onto a predefined reference mesh spanning the domain, using a physically based model comprised of functions constructed to be orthogonal and normalized over a discrete set of reference mesh locations.
    • 用于配置和控制设备执行制造过程的系统,方法和计算机程序产品,并且根据用于将表征产品观察到的非线性变化的计算系数映射到用于将产品观察到的实际控制参数 工厂在制造过程中使用的工艺/工具。 该方法能够实时地控制使用曝光工具的图案化处理的曝光步骤中的变化,以通过调整对应于所计算的系数的曝光工具或图案化处理来最小化一个或多个图案属性中的非线性变化。 在该方法中,通过在良好定义的域上的有限采样获得的产品属性的测量被投影到横跨该域的预定参考网格上,使用基于物理的模型,该模型由构造为通过离散参考集合正交和归一化的函数组成 网格位置。
    • 2. 发明申请
    • DISCRETE SAMPLING BASED NONLINEAR CONTROL SYSTEM
    • 基于离散采样的非线性控制系统
    • US20140065733A1
    • 2014-03-06
    • US14079132
    • 2013-11-13
    • INTERNATIONAL BUSINESS MACHINES CORPORATION
    • Christopher P. Ausschnitt
    • H01L21/66G05B13/02
    • H01L22/26G03F7/705G05B13/02H01L2924/0002H01L2924/00
    • System, method and computer program product for configuring and controlling a facility to perform a manufacturing process and updating a tool controlling the process according to a model employed for mapping calculated coefficients that characterize non-linear variations observed of a product to actual control parameters governing the processes/tools used by the facility during the manufacturing process. The method enables real-time control of variation in an exposure step of a patterning process using an exposure tool to minimize a nonlinear variation in one or more pattern attributes by adjusting the exposure tool or the patterning process corresponding to the calculated coefficients. In the method, measurements of product attributes, obtained by finite sampling over a well defined domain, are projected onto a predefined reference mesh spanning the domain, using a physically based model comprised of functions constructed to be orthogonal and normalized over a discrete set of reference mesh locations.
    • 用于配置和控制设备执行制造过程的系统,方法和计算机程序产品,并且根据用于将表征产品观察到的非线性变化的计算系数映射到用于将产品观察到的实际控制参数 工厂在制造过程中使用的工艺/工具。 该方法能够实时地控制使用曝光工具的图案化处理的曝光步骤中的变化,以通过调整对应于所计算的系数的曝光工具或图案化处理来最小化一个或多个图案属性中的非线性变化。 在该方法中,通过在良好定义的域上的有限采样获得的产品属性的测量被投影到横跨该域的预定参考网格上,使用基于物理的模型,该模型由构造为通过离散参考集合正交和归一化的函数组成 网格位置。
    • 3. 发明申请
    • FABRICATION OF LITHOGRAPHIC IMAGE FIELDS USING A PROXIMITY STITCH METROLOGY
    • 使用临时地图学方法制作图像图像场
    • US20150162249A1
    • 2015-06-11
    • US14100297
    • 2013-12-09
    • International Business Machines Corporation
    • Christopher P. AusschnittJaime D. MorilloRoger J. Yerdon
    • H01L21/66G06F17/50
    • H01L22/12G03F7/70475
    • A method of determining stitching errors in multiple lithographically exposed fields on a semiconductor layer during a semiconductor manufacturing process is provided. The method may include receiving a predetermined design distance corresponding to a plurality of petals associated with the multiple lithographically exposed fields and identifying a blossom within a single field-of-view (FOV) of a metrology tool, where the blossom is formed by a non-overlapping abutment of corners corresponding to the multiple lithographically exposed fields. The blossom may include the plurality of petals associated with the multiple lithographically exposed fields. Petal position errors may then be calculated based on both a coordinate position for each of the plurality of petals within the blossom and the predetermined design distance, whereby the calculated petal position errors are indicative of stitching errors for the multiple lithographically exposed fields.
    • 提供了一种在半导体制造过程中确定半导体层上的多个光刻曝光场中的拼接误差的方法。 该方法可以包括接收对应于与多个光刻曝光场相关联的多个花瓣的预定设计距离,并且在计量工具的单个视场(FOV)内识别开花,其中开花由非 - 对应于多个光刻曝光场的角的重叠基台。 花可以包括与多个光刻曝光场相关联的多个花瓣。 然后可以基于花内的多个花瓣中的每一个的坐标位置和预定设计距离来计算花瓣位置误差,由此计算的花瓣位置误差指示多个光刻曝光场的缝合误差。
    • 8. 发明授权
    • Fabrication of lithographic image fields using a proximity stitch metrology
    • 使用邻近针迹计量法制作平版印刷图像场
    • US09087740B2
    • 2015-07-21
    • US14100297
    • 2013-12-09
    • International Business Machines Corporation
    • Christopher P. AusschnittJaime D. MorilloRoger J. Yerdon
    • G06F17/50H01L21/66
    • H01L22/12G03F7/70475
    • A method of determining stitching errors in multiple lithographically exposed fields on a semiconductor layer during a semiconductor manufacturing process is provided. The method may include receiving a predetermined design distance corresponding to a plurality of petals associated with the multiple lithographically exposed fields and identifying a blossom within a single field-of-view (FOV) of a metrology tool, where the blossom is formed by a non-overlapping abutment of corners corresponding to the multiple lithographically exposed fields. The blossom may include the plurality of petals associated with the multiple lithographically exposed fields. Petal position errors may then be calculated based on both a coordinate position for each of the plurality of petals within the blossom and the predetermined design distance, whereby the calculated petal position errors are indicative of stitching errors for the multiple lithographically exposed fields.
    • 提供了一种在半导体制造过程中确定半导体层上的多个光刻曝光场中的拼接误差的方法。 该方法可以包括接收对应于与多个光刻曝光场相关联的多个花瓣的预定设计距离,并且在计量工具的单个视场(FOV)内识别开花,其中开花由非 - 对应于多个光刻曝光场的角的重叠基台。 花可以包括与多个光刻曝光场相关联的多个花瓣。 然后可以基于花内的多个花瓣中的每一个的坐标位置和预定设计距离来计算花瓣位置误差,由此计算的花瓣位置误差指示多个光刻曝光场的缝合误差。