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1. 发明申请

US20110029268A1 METHODS FOR DELIVERING A PROCESS GAS 有权
标题翻译：提供工艺气体的方法
公开(公告)号：US20110029268A1
公开(公告)日：2011-02-03
申请号：US12887218
申请日：2010-09-21
申请人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
发明人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
IPC分类号： G06F19/00 , G01F25/00
CPC分类号： G01F25/0053 , Y10T137/7722
摘要： A method for delivering a process gas to a reaction chamber of a plasma processing system using a recipe having a recipe flow rate is provided. The method includes delivering the process gas by a gas flow delivery system controlled by a mass flow controller (MFC) to an orifice. The predicted flow rate is previously computed by pressurizing a gas. The predicted flow rate further being previously computed measuring a set of upstream pressure values of the gas via at least one pressure sensor. The method also includes applying, using a programmed computing device, a calibration factor of a set of calibration factors to determine the predicted flow rate, the calibration factor being a ratio of an average of the set of upstream pressure values to an average of a set of golden upstream pressure values.
摘要翻译：提供了一种使用具有配方流量的食谱将处理气体输送到等离子体处理系统的反应室的方法。该方法包括通过由质量流量控制器（MFC）控制的气体输送系统将工艺气体输送到孔口。先前通过对气体进行加压来计算预测流量。进一步预先计算的预测流量通过至少一个压力传感器测量气体的一组上游压力值。该方法还包括使用编程的计算设备应用一组校准因子的校准因子来确定预测流量，校准因子是该组上游压力值的平均值与一组的平均值之比的金上游压力值。

2. 发明申请

US20080115560A1 METHODS FOR PERFORMING ACTUAL FLOW VERIFICATION 有权
标题翻译：执行实际流程验证的方法
公开(公告)号：US20080115560A1
公开(公告)日：2008-05-22
申请号：US11938171
申请日：2007-11-09
申请人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
发明人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
IPC分类号： G01F25/00
CPC分类号： G01F25/0053 , Y10T137/7722
摘要： A method for determining an actual gas flow rate in a reaction chamber of a plasma processing system is provided. The method includes delivering gas fay a gas flow delivery system controlled by a mass flow controller (MFC) to an orifice, which is located upstream from the reaction chamber. The method also includes pressurizing the gas to create a choked flow condition within the orifice. The method further includes measuring a set of upstream pressure values of the gas via a set of pressure sensors. The method yet also includes applying a calibration factor of a set of calibration factors to determine the actual flow rate. The calibration factor is a ratio of an average of the set of upstream pressure values to an average of a set of golden upstream pressure values, which is associated with an indicated flow rate for an MFC.
摘要翻译：提供了一种用于确定等离子体处理系统的反应室中的实际气体流量的方法。该方法包括将由质量流量控制器（MFC）控制的气体输送系统输送到位于反应室上游的孔口。该方法还包括对气体进行加压以在孔口内产生阻塞流动状态。该方法还包括经由一组压力传感器测量气体的一组上游压力值。该方法还包括应用一组校准因子的校准因子来确定实际流量。校准因子是一组上游压力值的平均值与一组黄金上游压力值的平均值的比值，其与MFC的指示流速相关联。

3. 发明授权

US08521461B2 Apparatus for delivering a process gas 有权
标题翻译：用于输送处理气体的装置
公开(公告)号：US08521461B2
公开(公告)日：2013-08-27
申请号：US13436705
申请日：2012-03-30
申请人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
发明人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
IPC分类号： G01F1/12
CPC分类号： G01F25/0053 , Y10T137/7722
摘要： A processing system for delivering a process gas to a reaction chamber using a recipe having a recipe flow rate is provided. The processing system includes a gas flow delivery system configured for delivering the process gas, wherein said gas flow delivery system controlled by a mass flow controller (MFC) to an orifice. The predicted flow rate is previously computed by pressurizing a gas. The predicted flow rate further being previously computed measuring a set of upstream pressure values of the gas via at least one sensor. The processing system also includes a programmed computing device configured for applying a calibration factor of a set of calibration factors to determine the predicted flow rate, the calibration factor being a ratio of an average of the set of upstream pressure values to an average of a set of golden upstream pressure values.
摘要翻译：提供了一种使用具有配方流量的食谱将处理气体输送到反应室的处理系统。处理系统包括配置用于输送处理气体的气体流量输送系统，其中由质量流量控制器（MFC）控制到气孔的所述气体流量输送系统。先前通过对气体进行加压来计算预测流量。预先计算的预测流量通过至少一个传感器测量气体的一组上游压力值。处理系统还包括编程计算装置，其被配置为施加一组校准因子的校准因子以确定预测流量，所述校准因子是该组上游压力值的平均值与一组的平均值的比率的金上游压力值。

4. 发明授权

US08150646B2 Methods for delivering a process gas 有权
标题翻译：交付工艺气体的方法
公开(公告)号：US08150646B2
公开(公告)日：2012-04-03
申请号：US12887218
申请日：2010-09-21
申请人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
发明人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
IPC分类号： G06F19/00 , G01F1/12
CPC分类号： G01F25/0053 , Y10T137/7722
摘要： A method for delivering a process gas to a reaction chamber of a plasma processing system using a recipe having a recipe flow rate is provided. The method includes delivering the process gas by a gas flow delivery system controlled by a mass flow controller (MFC) to an orifice. The predicted flow rate is previously computed by pressurizing a gas. The predicted flow rate further being previously computed measuring a set of upstream pressure values of the gas via at least one pressure sensor. The method also includes applying, using a programmed computing device, a calibration factor of a set of calibration factors to determine the predicted flow rate, the calibration factor being a ratio of an average of the set of upstream pressure values to an average of a set of golden upstream pressure values.
摘要翻译：提供了一种使用具有配方流量的食谱将处理气体输送到等离子体处理系统的反应室的方法。该方法包括通过由质量流量控制器（MFC）控制的气体输送系统将工艺气体输送到孔口。先前通过对气体进行加压来计算预测流量。进一步预先计算的预测流量通过至少一个压力传感器测量气体的一组上游压力值。该方法还包括使用编程的计算设备应用一组校准因子的校准因子来确定预测流量，校准因子是该组上游压力值的平均值与一组的平均值之比的金上游压力值。

5. 发明授权

US07881886B1 Methods for performing transient flow prediction and verification using discharge coefficients 有权
标题翻译：使用放电系数执行瞬态流预测和验证的方法
公开(公告)号：US07881886B1
公开(公告)日：2011-02-01
申请号：US11938168
申请日：2007-11-09
申请人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
发明人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
IPC分类号： G01F25/00
CPC分类号： G01F1/36 , Y10T137/0368 , Y10T137/0379 , Y10T137/0396 , Y10T137/7759 , Y10T137/7761
摘要： A method for determining an actual gas flow rate as gas flows through a gas flow delivery system is provided. The method includes sending the gas through the gas flow delivery system into a gas conduit, wherein a section of the gas conduit is widened to form an orifice. The method also includes pressurizing the gas to create a choked flow condition within the orifice of the gas conduit. The method further includes measuring upstream pressure of the gas via a set of pressure sensors. The method yet also includes calculating the actual flow rate based on the upstream pressure of the orifice of the gas conduit.
摘要翻译：提供了一种用于当气体流过气体输送系统时确定实际气体流速的方法。该方法包括将气体通过气流输送系统送入气体管道，其中气体管道的一部分被加宽以形成孔口。该方法还包括对气体进行加压以在气体管道的孔口内产生阻塞流动状态。该方法还包括经由一组压力传感器测量气体的上游压力。该方法还包括基于气体管道的孔口的上游压力来计算实际流量。

6. 发明授权

US07822570B2 Methods for performing actual flow verification 有权
标题翻译：执行实际流程验证的方法
公开(公告)号：US07822570B2
公开(公告)日：2010-10-26
申请号：US11938171
申请日：2007-11-09
申请人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
发明人： Iqbal A. Shareef , James V. Tietz , Vernon Wong , Richard J. Meinecke
IPC分类号： G01F1/12
CPC分类号： G01F25/0053 , Y10T137/7722
摘要： A method for determining an actual gas flow rate in a reaction chamber of a plasma processing system is provided. The method includes delivering gas by a gas flow delivery system controlled by a mass flow controller (MFC) to an orifice, which is located upstream from the reaction chamber. The method also includes pressurizing the gas to create a choked flow condition within the orifice. The method further includes measuring a set of upstream pressure values of the gas via a set of pressure sensors. The method yet also includes applying a calibration factor of a set of calibration factors to determine the actual flow rate. The calibration factor is a ratio of an average of the set of upstream pressure values to an average of a set of golden upstream pressure values, which is associated with an indicated flow rate for an MFC.
摘要翻译：提供了一种用于确定等离子体处理系统的反应室中的实际气体流量的方法。该方法包括通过由质量流量控制器（MFC）控制的气体输送系统将气体输送到位于反应室上游的孔口。该方法还包括对气体进行加压以在孔口内产生阻塞流动状态。该方法还包括经由一组压力传感器测量气体的一组上游压力值。该方法还包括应用一组校准因子的校准因子来确定实际流量。校准因子是一组上游压力值的平均值与一组金黄上游压力值的平均值的比值，其与MFC的指示流速相关联。

7. 发明授权

US07835874B2 System and method for gas flow verification 有权
标题翻译：气流验证系统及方法
公开(公告)号：US07835874B2
公开(公告)日：2010-11-16
申请号：US12104438
申请日：2008-04-17
申请人： Vernon Wong , Richard J. Meinecke
发明人： Vernon Wong , Richard J. Meinecke
IPC分类号： G01F17/00
CPC分类号： G01F1/34 , G01F7/005 , G01F17/00 , G01F22/02 , G01F25/0038 , G01F25/0053
摘要： A gas flow rate verification apparatus is provided for shared use in a multiple tool semiconductor processing platform. The gas flow rate verification apparatus is defined to measure a pressure rate of rise and temperature within a test volume for determination of a corresponding gas flow rate. The apparatus includes first and second volumes, wherein the second volume is larger than the first volume. The apparatus also includes first and second pressure measurement devices, wherein the second pressure measurement device is capable of measuring higher pressures. Based on the target gas flow rate to be measured, either the first or second volume can be selected as the test volume, and either the first or second pressure measurement device can be selected to measure the pressure in the test volume. Configurability of the apparatus enables accurate measurement of gas flow rates over a broad range and in an time efficient manner.
摘要翻译：气体流量验证装置被提供用于在多个工具半导体处理平台中共享使用。气体流量验证装置被定义为测量测试体积内的升高和温度的压力，以确定相应的气体流量。该装置包括第一和第二体积，其中第二体积大于第一体积。该装置还包括第一和第二压力测量装置，其中第二压力测量装置能够测量更高的压力。基于要测量的目标气体流量，可以选择第一或第二体积作为测试体积，并且可以选择第一或第二压力测量装置来测量测试体积中的压力。该装置的可配置性使得能够在宽范围内以及以时间有效的方式精确测量气体流量。

8. 发明申请

US20080195332A1 System and Method for Gas Flow Verification 有权
标题翻译：气流验证系统与方法
公开(公告)号：US20080195332A1
公开(公告)日：2008-08-14
申请号：US12104438
申请日：2008-04-17
申请人： Vernon Wong , Richard J. Meinecke
发明人： Vernon Wong , Richard J. Meinecke
IPC分类号： G01F1/34 , G01F1/86
CPC分类号： G01F1/34 , G01F7/005 , G01F17/00 , G01F22/02 , G01F25/0038 , G01F25/0053
摘要： A gas flow rate verification apparatus is provided for shared use in a multiple tool semiconductor processing platform. The gas flow rate verification apparatus is defined to measure a pressure rate of rise and temperature within a test volume for determination of a corresponding gas flow rate. The apparatus includes first and second volumes, wherein the second volume is larger than the first volume. The apparatus also includes first and second pressure measurement devices, wherein the second pressure measurement device is capable of measuring higher pressures. Based on the target gas flow rate to be measured, either the first or second volume can be selected as the test volume, and either the first or second pressure measurement device can be selected to measure the pressure in the test volume. Configurability of the apparatus enables accurate measurement of gas flow rates over a broad range and in an time efficient manner.
摘要翻译：气体流量验证装置被提供用于在多个工具半导体处理平台中共享使用。气体流量验证装置被定义为测量测试体积内的升高和温度的压力，以确定相应的气体流量。该装置包括第一和第二体积，其中第二体积大于第一体积。该装置还包括第一和第二压力测量装置，其中第二压力测量装置能够测量更高的压力。基于要测量的目标气体流量，可以选择第一或第二体积作为测试体积，并且可以选择第一或第二压力测量装置来测量测试体积中的压力。该装置的可配置性使得能够在宽范围内以及以时间有效的方式精确测量气体流量。

9. 发明申请

US20090061640A1 Alternate gas delivery and evacuation system for plasma processing apparatuses 有权
标题翻译：用于等离子体处理装置的替代气体输送和抽空系统
公开(公告)号：US20090061640A1
公开(公告)日：2009-03-05
申请号：US12230089
申请日：2008-08-22
申请人： Harry P. Wong , Vernon Wong , Christopher Charles Griffin , Mark Taskar
发明人： Harry P. Wong , Vernon Wong , Christopher Charles Griffin , Mark Taskar
IPC分类号： H01L21/3065 , C23F1/08
CPC分类号： C23C16/45523 , C23C16/4412 , C23C16/45561 , C23C16/5096 , H01J37/3244 , H01J37/32449
摘要： A gas distribution system for supplying a gas mixture to a plasma process chamber is provided. A first valve arrangement is connected to upstream ends of a first gas line and a second gas line. A second valve arrangement is connected to downstream ends of the first gas line and the second gas line. A first gas distribution outlet line is connected between a gas supply and the first valve arrangement and a first chamber inlet line connected between the second valve arrangement and the plasma process chamber. A first evacuation line is connected to the first gas line at a location between the first valve arrangement and the second valve arrangement. A second evacuation line is connected to the second gas line at a location between the first valve arrangement and the second valve arrangement. The first evacuation line and second evacuation line are in fluid communication with a vacuum line. A controller is operable to actuate the first valve arrangement and second valve arrangement to selectively flow the gas mixture from the gas supply to the plasma process chamber through the first gas line while the second gas is selectively evacuated by the vacuum line; or to selectively flow the gas mixture from the gas supply to the plasma process chamber through the second gas line while the first gas line is selectively evacuated by the vacuum line.
摘要翻译：提供了一种用于将气体混合物供应到等离子体处理室的气体分配系统。第一阀装置连接到第一气体管线和第二气体管线的上游端。第二阀装置连接到第一气体管线和第二气体管线的下游端。第一气体分配出口管线连接在气体供应源和第一阀装置之间，连接在第二阀装置和等离子体处理室之间的第一室入口管线。在第一阀装置和第二阀装置之间的位置处，第一排气管线连接到第一气体管线。在第一阀装置和第二阀装置之间的位置处，第二排气管线连接到第二气体管线。第一排气管线和第二排气管线与真空管线流体连通。控制器可操作以致动第一阀装置和第二阀装置，以选择性地将气体混合物从气体供应通过第一气体管道流动到等离子体处理室，同时第二气体被真空管线选择性地抽真空; 或者通过第二气体管线将气体混合物从气体供给选择性地流动到等离子体处理室，同时第一气体管线被真空管线选择性抽真空。

10. 发明授权

US07376520B2 System and method for gas flow verification 有权
标题翻译：气流验证系统及方法
公开(公告)号：US07376520B2
公开(公告)日：2008-05-20
申请号：US11083761
申请日：2005-03-16
申请人： Vernon Wong , Richard J. Meinccke
发明人： Vernon Wong , Richard J. Meinccke
IPC分类号： G01F1/00 , G01F7/00
CPC分类号： G01F1/34 , G01F7/005 , G01F17/00 , G01F22/02 , G01F25/0038 , G01F25/0053
摘要： A gas flow rate verification apparatus is provided for shared use in a multiple tool semiconductor processing platform. The gas flow rate verification apparatus is defined to measure a pressure rate of rise and temperature within a test volume for determination of a corresponding gas flow rate. The apparatus includes first and second volumes, wherein the second volume is larger than the first volume. The apparatus also includes first and second pressure measurement devices, wherein the second pressure measurement device is capable of measuring higher pressures. Based on the target gas flow rate to be measured, either the first or second volume can be selected as the test volume, and either the first or second pressure measurement device can be selected to measure the pressure in the test volume. Configurability of the apparatus enables accurate measurement of gas flow rates over a broad range and in an time efficient manner.
摘要翻译：气体流量验证装置被提供用于在多个工具半导体处理平台中共享使用。气体流量验证装置被定义为测量测试体积内的升高和温度的压力，以确定相应的气体流量。该装置包括第一和第二体积，其中第二体积大于第一体积。该装置还包括第一和第二压力测量装置，其中第二压力测量装置能够测量更高的压力。基于要测量的目标气体流量，可以选择第一或第二体积作为测试体积，并且可以选择第一或第二压力测量装置来测量测试体积中的压力。该装置的可配置性使得能够在宽范围内以及以时间有效的方式精确测量气体流量。

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