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    • 7. 发明授权
    • Method for minimizing program disturb in a memory cell
    • 用于最小化存储器单元中的程序干扰的方法
    • US06222761B1
    • 2001-04-24
    • US09617281
    • 2000-07-17
    • Donald S. GerberKent HewittJeffrey A. Shields
    • Donald S. GerberKent HewittJeffrey A. Shields
    • G11C1604
    • G11C16/10G11C16/16
    • A method of applying voltages to a memory cell, such as a P-channel EEPROM cell, and in particular to applying voltages to the cell during an erase operation of the cell is described. The method recognizes that during an erase, memory cells sharing deselected word lines are susceptible to a type of program disturb which is subtle and gradually causes corruption and loss of data over many programming cycles. The method of the present invention applies a voltage to deselected word lines, which is lower in magnitude than a programming voltage. This reduces the rate at which program disturb occurs, markedly increasing the number of programming cycles to which the deselected cells may be subjected before becoming susceptible to loss of data. The endurance of the memory array is thus significantly extended.
    • 描述了一种向诸如P沟道EEPROM单元的存储单元施加电压的方法,特别是在单元的擦除操作期间向单元施加电压的方法。 该方法认识到,在擦除期间,共享取消选择的字线的存储器单元容易受到一种程序干扰的影响,该程序干扰是微妙的,并且在许多编程周期中逐渐导致数据损坏和丢失。 本发明的方法将电压施加到低于编程电压的取消选择字线。 这降低了编程干扰发生的速率,显着增加了在忽略数据丢失之前取消选择的单元可能经受的编程周期数。 因此,存储器阵列的耐久性显着延长。
    • 10. 发明授权
    • Memory cell having an ONO film with an ONO sidewall and method of fabricating same
    • 具有具有ONO侧壁的ONO膜的存储单元及其制造方法
    • US06432773B1
    • 2002-08-13
    • US09288597
    • 1999-04-08
    • Donald S. GerberNeil DeutscherRobert P. Ma
    • Donald S. GerberNeil DeutscherRobert P. Ma
    • H01L21336
    • H01L29/66825H01L21/28273H01L29/42324H01L29/511
    • A merged two transistor memory cell of an EEPROM, and method of fabricating same, is provided. The memory cell includes a substrate and insulating layer formed on the substrate. It also includes a memory transistor having a floating gate and a control gate, and a select transistor having a gate that is shared with the memory transistor. The memory cell is configured so that the shared gate serves both as the control gate of the memory transistor and the wordline of the select transistor. The memory cell further includes an ONO stack film that is disposed between the floating gate and the shared gate. In fabricating the memory, the ONO stack film is formed adjacent to the top and side surfaces of the floating gate. The ONO stack film is also formed so as not to be interposed between a potion of the shared gate that is adjacent to the substrate and the insulating layer.
    • 提供EEPROM的合并二晶体管存储单元及其制造方法。 存储单元包括在基板上形成的基板和绝缘层。 它还包括具有浮置栅极和控制栅极的存储晶体管,以及具有与存储晶体管共享的栅极的选择晶体管。 存储单元被配置为使得共享栅极同时用作存储晶体管的控制栅极和选择晶体管的字线。 存储单元还包括设置在浮动栅极和共享栅极之间的ONO堆叠膜。 在制造存储器时,ONO叠层膜与浮栅的顶表面和侧表面相邻地形成。 ONO叠层膜也形成为不被插入在与基板相邻的共享栅极的部分和绝缘层之间。