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1. 发明申请

US20090183849A1 FULL-FIELD SOLDER COVERAGE 有权
标题翻译：全场焊接覆盖
公开(公告)号：US20090183849A1
公开(公告)日：2009-07-23
申请号：US12018421
申请日：2008-01-23
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B22D27/15 , B67D5/00 , B22D23/00
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

2. 发明授权

US07408780B2 Compliant thermal interface structure utilizing spring elements with fins 有权
标题翻译：符合热接口结构，利用带翅片的弹簧元件
公开(公告)号：US07408780B2
公开(公告)日：2008-08-05
申请号：US11151843
申请日：2005-06-14
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20 , F28F7/00
CPC分类号： H01L23/433 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a top layer disposed over the electronic device. The structure further includes a plurality of spring elements disposed between the top layer and the electronic device, wherein at least one of the spring elements comprises a spring portion and a fin portion. At least one of the spring elements provides a heat path from the electronic device and provides mechanical compliance. In another embodiment, the structure further includes a heat-conducting layer disposed over the electronic device, wherein the fin portion of each of at least one of the spring elements is coupled to the heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的顶层。该结构还包括设置在顶层和电子设备之间的多个弹簧元件，其中弹簧元件中的至少一个包括弹簧部分和翅片部分。至少一个弹簧元件提供来自电子设备的热路径并且提供机械顺应性。在另一个实施例中，该结构还包括设置在电子设备上的导热层，其中至少一个弹簧元件中的每一个的翅片部分耦合到导热层。

3. 发明授权

US07980445B2 Fill head for full-field solder coverage with a rotatable member 有权
标题翻译：用可旋转构件填充头用于全场焊接覆盖
公开(公告)号：US07980445B2
公开(公告)日：2011-07-19
申请号：US12018421
申请日：2008-01-23
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B23K1/00 , B23K37/06 , B23K37/00 , B23K35/12
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A system, apparatus, and method, are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供一种系统，装置和方法，以将导电接合材料沉积在模具中的空腔中。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

4. 发明授权

US07545648B2 Cooling structure using rigid movable elements 失效
标题翻译：冷却结构采用刚性可动元件
公开(公告)号：US07545648B2
公开(公告)日：2009-06-09
申请号：US12055263
申请日：2008-03-25
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20 , H01L23/34
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.
摘要翻译：一种信息处理系统，包括：处理器; 记忆输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。该系统还包括用于冷却处理器的冷却结构。冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。

5. 发明授权

US08181846B2 Method of full-field solder coverage using a vacuum fill head 有权
标题翻译：使用真空填充头的全场焊接覆盖方法
公开(公告)号：US08181846B2
公开(公告)日：2012-05-22
申请号：US13100133
申请日：2011-05-03
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B23K31/02
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method and apparatus are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供了一种方法和装置，以将导电接合材料沉积在模具中的空腔中。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

6. 发明申请

US20080170370A1 COOLING STRUCTURE USING RIGID MOVABLE ELEMENTS 失效
标题翻译：使用刚性可移动元件冷却结构
公开(公告)号：US20080170370A1
公开(公告)日：2008-07-17
申请号：US12055263
申请日：2008-03-25
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： An information processing system includes: a processor; a memory; an input/output subsystem; and a bus coupled to the processor, the memory and the input/output subsystem. The system further includes a cooling structure for cooling the processor. The cooling structure consists of: a compressible backing; a plurality of rigid copper elements disposed between the backing and the processor; a first conformable heat-conducting layer disposed over the processor; a second conformable heat-conducting layer disposed between the compressible backing and the rigid elements; a liquid coolant; and a seal for containing the liquid coolant.
摘要翻译：一种信息处理系统，包括：处理器; 记忆输入/输出子系统; 以及耦合到处理器，存储器和输入/输出子系统的总线。该系统还包括用于冷却处理器的冷却结构。冷却结构包括：可压缩背衬; 设置在背衬和处理器之间的多个刚性铜元件; 设置在所述处理器上的第一适形导热层; 设置在可压缩背衬和刚性元件之间的第二适形导热层; 液体冷却剂; 以及用于容纳液体冷却剂的密封件。

7. 发明申请

US20080144288A1 COMPLIANT THERMAL INTERFACE STRUCTURE UTILIZING SPRING ELEMENTS 失效
标题翻译：使用弹簧元件的合适的热接口结构
公开(公告)号：US20080144288A1
公开(公告)日：2008-06-19
申请号：US12037067
申请日：2008-02-25
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的固体导热层。固体导热层是与电子设备接触的平面。该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大，导电层。

8. 发明授权

US08286855B2 Method of full-field solder coverage by inverting a fill head and a mold 有权
标题翻译：通过倒置灌装头和模具来实现全场焊接覆盖的方法
公开(公告)号：US08286855B2
公开(公告)日：2012-10-16
申请号：US13442322
申请日：2012-04-09
申请人： Russell A. Budd , John P. Karidis , Mark D. Schultz
发明人： Russell A. Budd , John P. Karidis , Mark D. Schultz
IPC分类号： B23K31/02 , B23K31/00
CPC分类号： H05K3/3457 , B23K1/0016 , B23K3/0638 , H05K2203/0113 , H05K2203/0126 , H05K2203/0338
摘要： A method are provided to deposit conductive bonding material into cavities in a mold. A fill head is placed in substantial contact with a mold that includes cavities. The fill head includes a sealing member that substantially encompasses an entire area to be filled with conductive bonding material. The fill head and mold are transitioned so that the fill head is situated substantially directly above the mold and so that the plurality of cavities are facing in an upward direction with respect to the sealing member. The conductive bonding material is forced out of the fill head toward the mold. The conductive bonding material is provided into at least one cavity of the cavities contemporaneous with the at least one cavity being in proximity to the fill head.
摘要翻译：提供了一种将导电接合材料沉积在模具中的空腔中的方法。填充头被放置成与包括空腔的模具基本接触。填充头包括密封构件，其基本上包围要填充有导电接合材料的整个区域。填充头和模具被过渡，使得填充头基本上位于模具的正上方，并且使得多个空腔相对于密封构件向上的方向面对。导电接合材料被迫从模具顶端朝向模具。导电接合材料设置在与填充头附近的至少一个空腔同时的空腔的至少一个空腔中。

9. 发明申请

US20090151893A1 HIGH PERFORMANCE COMPLIANT THERMAL INTERFACE COOLING STRUCTURES 审中-公开
标题翻译：高性能合适的热接口冷却结构
公开(公告)号：US20090151893A1
公开(公告)日：2009-06-18
申请号：US11956311
申请日：2007-12-13
申请人： John P. Karidis , Mark D. Schultz
发明人： John P. Karidis , Mark D. Schultz
IPC分类号： F28F7/00
CPC分类号： H01L23/473 , H01L21/4882 , H01L2924/0002 , Y10T29/4935 , H01L2924/00
摘要： A method for producing a compliant thermal interface device for cooling an integrated circuit includes steps of: cutting a plurality of high thermal conductivity sheets according to at least one pattern, the sheets made up of a first material; forming spring elements in at least one of the plurality of sheets; coating the sheets with a second material, wherein the second material is different from the first material; stacking the high thermal conductivity sheets; and bonding areas of the stacked sheets using thermo-compression bonding.
摘要翻译：用于制造用于冷却集成电路的柔性热界面装置的方法包括以下步骤：根据至少一种图案切割多个高导热性片材，所述片材由第一材料制成; 在所述多个片材中的至少一个片材中形成弹簧元件; 用第二材料涂覆片材，其中第二材料不同于第一材料; 堆叠高导热片材; 以及使用热压接合的层叠片材的接合区域。

10. 发明授权

US07545647B2 Compliant thermal interface structure utilizing spring elements 失效
标题翻译：采用弹簧元件的热接口结构
公开(公告)号：US07545647B2
公开(公告)日：2009-06-09
申请号：US12037067
申请日：2008-02-25
申请人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
发明人： John P. Karidis , Mark D. Schultz , Bucknell C. Webb
IPC分类号： H05K7/20 , H01L23/36
CPC分类号： H01L23/433 , A01H5/02 , A01H6/42 , H01L23/427 , H01L2924/0002 , H01L2924/00
摘要： A structure for cooling an electronic device is disclosed. The structure includes a solid heat-conducting layer disposed over the electronic device. The solid heat-conducting layer is a planar surface in contact with the electronic device. The structure further includes a plurality of copper spring elements disposed between the solid heat-conducting layer and the electronic device for providing a heat path from the electronic device and wherein the plurality of spring elements extend in an upper direction away from the electronic device and wherein the plurality of spring elements include a spring for offering resistance when loaded and wherein the spring elements have a smaller profile at a first end in contact with the electronic device, wherein the profile increases in size at a second end in contact with the solid heat-conducting layer.
摘要翻译：公开了一种用于冷却电子设备的结构。该结构包括设置在电子设备上的固体导热层。固体导热层是与电子设备接触的平面。该结构还包括设置在固体导热层和电子装置之间的多个铜弹簧元件，用于提供来自电子装置的热路径，并且其中多个弹簧元件沿远离电子装置的上方向延伸，并且其中多个弹簧元件包括用于在加载时提供电阻的弹簧，并且其中弹簧元件在与电子设备接触的第一端处具有较小的轮廓，其中，在与固体热交换器接触的第二端处的轮廓尺寸增大，导电层。

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