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1. 发明授权

US09456507B2 Ecological method for constructing circuit boards 有权
标题翻译：电路板生产方法
公开(公告)号：US09456507B2
公开(公告)日：2016-09-27
申请号：US14047323
申请日：2013-10-07
申请人： The Boeing Company
发明人： Donald F. Wilkins
IPC分类号： H05K3/44 , H05K3/46 , H05K1/02 , H05K1/09 , B29C70/88 , B29C35/02 , H05K3/10 , H05K3/00
CPC分类号： H05K3/4673 , B29C35/0261 , B29C70/882 , B29K2995/0005 , H05K1/0298 , H05K1/092 , H05K3/0005 , H05K3/101 , H05K3/4644 , H05K3/4676 , H05K2201/09118 , H05K2203/0113 , Y10T29/49155 , Y10T29/49163 , Y10T29/532
摘要： A method for fabrication of a circuit board using the disclosed embodiments relies on a CAD model of a multilayer circuit board with conductive elements defined by layer. A first granular conductive material layer is introduced into a mold. A fusion process element traverses across the mold to fuse selected portions of the first granular conductive material layer forming first layer conductive elements. An additional granular conductive material layer is introduced into the mold over the fused selected portions of the first layer and unfused portions of the first layer. The fusion process element is then traversed across the mold to fuse selected portions of the additional granular conductive material layer forming an additional layer of conductive elements. Unfused granular conductive material is then purged from the fused first conductive elements and additional conductive layer elements. A dielectric material is then infused into a structure formed by the fused first conductive elements and additional conductive layer elements.
摘要翻译：使用所公开的实施例的用于制造电路板的方法依赖于具有由层限定的导电元件的多层电路板的CAD模型。将第一粒状导电材料层引入模具中。融合过程元件穿过模具以熔合形成第一层导电元件的第一粒状导电材料层的选定部分。在第一层的熔融选定部分和第一层的未熔合部分之后，将另外的粒状导电材料层引入模具中。然后将融合过程元件穿过模具以熔合另外的颗粒状导电材料层的选定部分，形成附加的导电元件层。然后从熔融的第一导电元件和附加的导电层元件清除未填充的颗粒状导电材料。然后将电介质材料注入由熔融的第一导电元件和附加导电层元件形成的结构中。

2. 发明授权

US09330820B2 Method for making electrically conductive three-dimensional structures 有权
标题翻译：制造导电三维结构的方法
公开(公告)号：US09330820B2
公开(公告)日：2016-05-03
申请号：US13873961
申请日：2013-04-30
申请人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
发明人： Mark G. Allen , Seong-O Choi , Jung-Hwan Pauk , Xiaosong Wu , Yanzhu Zhao , Yong-Kyu Yoon , Swaminathan Rajaraman
IPC分类号： H01B13/00 , A61B5/00 , A61M37/00 , H05K1/02 , C25D1/00 , C25D1/10 , C25D5/02 , A61N1/32 , H05K3/40 , H05K3/20
CPC分类号： B32B3/30 , A61B5/685 , A61B2562/125 , A61M37/0015 , A61M2037/0053 , A61N1/327 , C25D1/003 , C25D1/10 , C25D5/022 , H01B13/00 , H05K1/02 , H05K3/20 , H05K3/4007 , H05K2201/0367 , H05K2201/09045 , H05K2201/09118 , H05K2203/0113 , Y10T428/2958 , Y10T428/298
摘要： Methods are provided for fabricating three-dimensional electrically conductive structures. Three-dimensional electrically conductive microstructures are also provided. The method may include providing a mold having at least one microdepression which defines a three-dimensional structure; filling the microdepression of the mold with at least one substrate material; molding the at least one substrate material to form a substrate; and depositing and patterning of at least one electrically conductive layer either during the molding process or subsequent to the molding process to form an electrically conductive structure. In one embodiment, the three-dimensional electrically conductive microstructure comprises an electrically functional microneedle array comprising two or more microneedles, each including a high aspect ratio, polymeric three dimensional substrate structure which is at least substantially coated by an electrically conductive layer.
摘要翻译：提供用于制造三维导电结构的方法。还提供三维导电微结构。该方法可以包括提供具有限定三维结构的至少一个微压缩的模具; 用至少一种基底材料填充模具的微压缩; 模制所述至少一种基底材料以形成基底; 以及在模制过程期间或在模制过程之后沉积和图案化至少一个导电层以形成导电结构。在一个实施例中，三维导电微结构包括电功能微针阵列，其包括两个或更多个微针，每个微针包括高纵横比，至少基本上被导电层涂覆的聚合物三维衬底结构。

3. 发明申请

US20160037650A1 METHOD FOR THE METALLATION OF A WORKPIECE AND A LAYER STRUCTURE MADE UP OF A WORKPIECE AND A METAL LAYER 有权
标题翻译：工件的金属化和工件和金属层的层结构的方法
公开(公告)号：US20160037650A1
公开(公告)日：2016-02-04
申请号：US14653274
申请日：2013-12-03
申请人： LPKF LASER & ELECTRONICS AG
发明人： Roman OSTHOLT , Robin Alexander KRUEGER , Bernd ROESENER , Eugen HAUMANN
IPC分类号： H05K3/18 , H05K3/00 , H05K1/02 , C23C18/20 , C23C18/16 , B44F3/00 , H05K3/38 , C23C18/31
CPC分类号： H05K3/181 , B44F3/00 , C23C18/1608 , C23C18/165 , C23C18/1841 , C23C18/2013 , C23C18/204 , C23C18/208 , C23C18/30 , C23C18/31 , C23C18/38 , C25D5/00 , C25D5/02 , H05K1/0296 , H05K3/0014 , H05K3/182 , H05K3/381 , H05K2201/2072 , H05K2203/0113
摘要： A method for the at least portion-wise and adhesive metallisation of a non-conductive workpiece includes introducing periodic microstructures into the workpiece in regions to be metallised, within an area to be metallised that is enclosed by one or more limiting lines, by moulding a tool that is microstructured in accordance with the regions to be metallised within a moulding area.
摘要翻译：用于非导电工件的至少部分地和粘合的金属化的方法包括在被金属化的区域内的周期性微结构引入待金属化的区域中，所述区域被被金属化的区域内被一个或多个限制线包围，根据在成型区域内被金属化的区域微结构化的工具。

4. 发明申请

US20150183942A1 PHOTOCURABLE COMPOSITION AND METHOD OF MANUFACTURING FILM USING THE COMPOSITION 有权
标题翻译：光学组合物和使用该组合物制造薄膜的方法
公开(公告)号：US20150183942A1
公开(公告)日：2015-07-02
申请号：US14405929
申请日：2013-09-11
申请人： CANON KABUSHIKI KAISHA
发明人： Toshiki Ito , Chieko Mihara , Youji Kawasaki
IPC分类号： C08J5/18 , H05K3/06 , B29C35/08
CPC分类号： C08J5/18 , B29C35/0805 , B29C2035/0827 , B29K2033/04 , B29K2105/0005 , B29K2909/00 , C08F2/48 , C08J2333/08 , G03F7/0002 , G03F7/0046 , G03F7/0048 , G03F7/027 , G03F7/031 , H01L21/02118 , H01L21/3086 , H01L21/311 , H05K3/0023 , H05K3/0076 , H05K3/0079 , H05K3/06 , H05K3/107 , H05K2203/0113 , H05K2203/086 , H05K2203/087
摘要： Provided are a photocurable composition having high filling property and capable of reducing a mold release force upon production of a film through the utilization of a photo-imprint method, and a method of manufacturing a film using the photocurable composition. The photocurable composition is a photocurable composition, including at least the following component (A) to component (C): (A) a polymerizable compound; (B) a photopolymerization initiator; and (C) a surfactant represented by the following general formula (1): Rf1-Rc-X (1)
摘要翻译：本发明提供一种具有高填充性且能够通过利用光印方法降低膜生成时的脱模力的光固化性组合物，以及使用该光固化性组合物的膜的制造方法。光固化性组合物为至少包含以下成分（A）〜成分（C）的光固化性组合物：（A）聚合性化合物; （B）光聚合引发剂; 和（C）由以下通式（1）表示的表面活性剂：Rf1-Rc-X（1）

5. 发明授权

US08893618B2 Patterning method and method for manufacturing liquid crystal display device using the same 有权
标题翻译：用于制造使用其的液晶显示装置的图案化方法和方法
公开(公告)号：US08893618B2
公开(公告)日：2014-11-25
申请号：US11477439
申请日：2006-06-30
申请人： Hong Suk Yoo , Chul Ho Kim , Jung Jae Lee , Tae Young Oh , Choon Ho Park
发明人： Hong Suk Yoo , Chul Ho Kim , Jung Jae Lee , Tae Young Oh , Choon Ho Park
IPC分类号： B41F9/01 , H05K3/12 , G02B5/20 , G02B5/22 , G02F1/1335 , H05K3/20
CPC分类号： H05K3/1275 , B41F3/36 , B41M1/02 , B41M1/04 , B41M3/003 , B41M5/0256 , G02B5/201 , G02B5/223 , G02F1/133512 , G02F1/133516 , H05K3/125 , H05K3/207 , H05K2203/0113 , H05K2203/013 , H05K2203/0143 , H05K2203/0534 , H05K2203/1173
摘要： A patterning method and a method for manufacturing an LCD device using the same are disclosed. The patterning method includes preparing a printing plate having concave and convex portions; coating a pattern material in the concave portion of the printing plate; rolling a printing roller on the printing plate to print the pattern material of the concave portion on the printing roller; and rolling the printing roller on a substrate to print the pattern material of the printing roller on the substrate.
摘要翻译：公开了一种图案化方法及其制造方法。图案化方法包括制备具有凹凸部分的印版; 在印版的凹部中涂布图案材料; 在印版上滚动印刷辊以将印刷辊上的凹部的图案材料印刷; 并将印刷辊滚动到基板上，以将印刷辊的图案材料印刷在基板上。

6. 发明授权

US08802214B2 Non-random array anisotropic conductive film (ACF) and manufacturing processes 有权
标题翻译：非随机阵列各向异性导电膜（ACF）和制造工艺
公开(公告)号：US08802214B2
公开(公告)日：2014-08-12
申请号：US12608955
申请日：2009-10-29
申请人： Rong-Chang Liang , Jerry Chung , Chinjen Tseng , Shuji Rokutanda , Yuhao Sun , Hsiao-Ken Chuang
发明人： Rong-Chang Liang , Jerry Chung , Chinjen Tseng , Shuji Rokutanda , Yuhao Sun , Hsiao-Ken Chuang
IPC分类号： B32B3/10
CPC分类号： H05K1/0296 , B32B3/08 , B32B3/30 , B32B7/06 , B32B7/12 , B32B27/08 , B32B27/16 , B32B27/28 , B32B27/30 , B32B27/32 , B32B27/34 , B32B27/36 , B32B27/38 , B32B27/40 , B32B2264/02 , B32B2264/10 , B32B2307/202 , B32B2307/706 , B32B2457/00 , B32B2457/08 , B32B2457/202 , H01B1/22 , H01L23/48 , H01L24/29 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/07811 , H01L2924/12042 , H05K3/00 , H05K3/323 , H05K2201/10378 , H05K2203/0113 , H05K2203/0338 , Y10T428/24289 , H01L2924/00
摘要： Structures and manufacturing processes of an ACF array using a non-random array of microcavities of predetermined configuration, shape and dimension. The manufacturing process includes fluidic filling of conductive particles onto a substrate or carrier web comprising a predetermined array of microcavities, or selective metallization of the array followed by filling the array with a filler material and a second selective metallization on the filled microcavity array. The thus prepared filled conductive microcavity array is then over-coated or laminated with an adhesive film. Cavities in the array, and particles filling the cavities, can have a unimodal, bimodal, or multimodal distribution.
摘要翻译：使用具有预定构型，形状和尺寸的微腔的非随机阵列的ACF阵列的结构和制造过程。该制造方法包括将导电颗粒流体填充到包含预定阵列的微腔的衬底或载体纤维网上，或者阵列的选择性金属化，然后用填充材料填充阵列，并在填充的微腔阵列上进行第二选择性金属化。然后将由此制备的填充的导电微腔阵列用粘合剂膜覆盖或层压。阵列中的腔和填充腔的颗粒可以具有单峰，双峰或多峰分布。

7. 发明授权

US08740599B2 Apparatus and method for producing two-sided patterned web in registration 有权
标题翻译：用于制造注册中的双面图案织物的装置和方法
公开(公告)号：US08740599B2
公开(公告)日：2014-06-03
申请号：US12837826
申请日：2010-07-16
申请人： John S. Huizinga , Vincent W. S. King , John T. Strand , James N. Dobbs , William V. Dower , Daniel H. Carlson , Serge Wetzels , Gregory F. King , Olester Benson, Jr. , Brian W. Lueck , Haiyan Zhang , Jeremy K. Larsen , M. Benton Free , David W. Kuhns , Samual W. Hunter , Thelma E. Hunter
发明人： John S. Huizinga , Vincent W. S. King , John T. Strand , James N. Dobbs , Thomas B. Hunter , William V. Dower , Daniel H. Carlson , Serge Wetzels , Gregory F. King , Olester Benson, Jr. , Brian W. Lueck , Haiyan Zhang , Jeremy K. Larsen , M. Benton Free , David W. Kuhns
IPC分类号： B29C39/14 , B29C59/04 , B29C35/10
CPC分类号： B29C59/04 , B05D1/40 , B05D3/067 , B05D3/12 , B05D2252/02 , B29C35/0805 , B29C35/0888 , B29C35/0894 , B29C39/148 , B29C39/203 , B29C59/046 , B29C2035/0827 , B29C2043/463 , B29C2059/023 , G03F7/0957 , G03F7/2032 , H05K1/0393 , H05K3/0008 , H05K3/0079 , H05K3/101 , H05K2201/0108 , H05K2203/0113 , H05K2203/0143 , H05K2203/1545 , H05K2203/1572
摘要： An apparatus for casting a patterned surface on both sides of an opaque web. The apparatus includes a first patterned roll, a second pattered roll, and a means for rotating the first and second patterned rolls such that their patterns are transferred to opposite sides of the opaque web while it is in continuous motion. During this process, their patterns are maintained in continuous registration to within at least 100 micrometers.
摘要翻译：用于在不透明网的两侧上铸造图案化表面的装置。该设备包括第一图案化辊，第二图案辊和用于旋转第一和第二图案化辊的装置，使得它们的图案在连续运动时转移到不透明纸幅的相对侧。在该过程中，它们的图案被保持在至少100微米内的连续配准。

8. 发明申请

US20140000938A1 ELECTRODE SUBSTRATE AND TOUCH PANEL 有权
标题翻译：电极基板和触控面板
公开(公告)号：US20140000938A1
公开(公告)日：2014-01-02
申请号：US13927276
申请日：2013-06-26
申请人： LG INNOTEK CO., LTD.
发明人： Kyoung Jong YOO , Jin Su KIM , Young Jae LEE , Jun LEE
IPC分类号： H05K1/02
CPC分类号： H05K1/02 , G06F3/041 , G06F2203/04103 , G06F2203/04112 , H05K1/0289 , H05K1/0296 , H05K3/06 , H05K2203/0113
摘要： Provided is an electrode substrate, including: a substrate; a first pattern unit on the substrate; and a second pattern unit on the substrate.
摘要翻译：提供一种电极基板，包括：基板; 基板上的第一图案单元; 以及在所述基板上的第二图案单元。

9. 发明授权

US08453314B2 Process for forming channels in a flexible circuit substrate using an elongated wedge and a channel shaped receptacle 有权
标题翻译：在柔性电路基板中使用细长楔形物和通道形状的容器形成通道的方法
公开(公告)号：US08453314B2
公开(公告)日：2013-06-04
申请号：US13368248
申请日：2012-02-07
申请人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
发明人： Alberto F. Viscarra , Ethan S. Heinrich , Melvin S. Campbell , David T. Winslow , Kevin C. Rolston , Rosalio S. Vidaurri
IPC分类号： H01P11/00
CPC分类号： H05K3/0014 , H01Q1/38 , H05K1/147 , H05K1/189 , H05K2201/0129 , H05K2201/058 , H05K2203/0113 , H05K2203/0353 , H05K2203/1105 , H05K2203/302 , Y10T29/49002 , Y10T29/49016 , Y10T29/49126 , Y10T29/4913
摘要： A process for fabricating an origami formed antenna radiating structure is provided. In one embodiment, the invention relates to a process for precisely fabricating a radio frequency (RF) antenna structure, the process including providing a flexible circuit substrate, forming a plurality of parallel channels in the flexible circuit substrate in a first direction, mounting the flexible substrate to a precision die, pressing the flexible substrate into the precision die using an elastomeric material thereby sandwiching the flexible substrate between the elastomeric material and the precision die, and applying heat to the flexible substrate sandwiched between the elastomeric material and the precision die.
摘要翻译：提供了一种制造折纸形天线辐射结构的方法。在一个实施例中，本发明涉及一种用于精确地制造射频（RF）天线结构的方法，所述方法包括提供柔性电路基板，在第一方向上在柔性电路基板中形成多个平行通道，衬底加工成精密模具，使用弹性材料将柔性衬底压入精密模具中，从而将柔性衬底夹在弹性体材料和精密模具之间，并将热量施加到夹在弹性体材料和精密模具之间的柔性衬底上。

10. 发明授权

US08418355B2 Method for manufacturing circuit board 失效
标题翻译：电路板制造方法
公开(公告)号：US08418355B2
公开(公告)日：2013-04-16
申请号：US11976071
申请日：2007-10-19
申请人： Sang-Duck Kim , Jung-Hyun Park , Hoe-Ku Jung , Jong-Gyu Choi , Ji-Eun Kim , Jeong-Woo Park
发明人： Sang-Duck Kim , Jung-Hyun Park , Hoe-Ku Jung , Jong-Gyu Choi , Ji-Eun Kim , Jeong-Woo Park
IPC分类号： H05K3/20
CPC分类号： H05K3/20 , H05K3/205 , H05K3/207 , H05K3/386 , H05K2203/0113 , Y10T29/49126 , Y10T29/49128 , Y10T29/49155 , Y10T29/49158 , Y10T29/49163
摘要： A method for forming transcriptional circuits and a method for manufacturing a circuit board are disclosed. A method of forming a transcriptional circuit, which includes forming an intaglio pattern corresponding to a circuit pattern by selectively forming a resist on a mold board, filling conductive material in the intaglio pattern, and transferring the conductive material onto a carrier by pressing the carrier onto the mold board such that the carrier faces the surface of the mold board having the conductive material filled in, makes it possible to form transcriptional circuits that can be transcribed into an insulation board using existing equipment, whereby costs can be reduced.
摘要翻译：公开了一种形成转录电路的方法及其制造方法。一种形成转录电路的方法，其包括通过在模板上选择性地形成抗蚀剂来形成对应于电路图案的凹版图案，将导电材料填充到凹版图案中，以及通过将载体压载到载体上而将载体转移到使得载体面向具有填充有导电材料的模板的表面的模板，使得可以形成可以使用现有设备转录成绝缘板的转录电路，由此可以降低成本。

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