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    • 5. 发明授权
    • Multi-layer structured nitride-based semiconductor devices
    • 多层结构氮化物基半导体器件
    • US6121638A
    • 2000-09-19
    • US955747
    • 1997-10-22
    • John RennieGenichi HatakoshiShinji Saito
    • John RennieGenichi HatakoshiShinji Saito
    • H01L33/00H01L33/32H01S5/327H01S5/343A01L33/00A01L31/0328A01L31/0336A01L31/109
    • H01L33/32B82Y20/00H01L33/007H01S2301/173H01S5/3214H01S5/327H01S5/34333
    • At an n--n hetero-interface in a GaN-based or ZnSe-based multilayered semiconductor laser and light-emitting diode, an excessive voltage drop causing the operating voltage to increased is reduced, thereby lengthening the service life of the device. A single or plurality of n-type intermediate layers are provided in the n--n hetero-interface region where the excessive voltage drop develops. The excessive voltage drop developing at the n--n hetero-interface is decreased by setting the energy value at the edge of the conduction band of each intermediate layer to a mid-value between the energy values at the edges of the conduction bands of the n-type compound semiconductors adjoining both sides of the intermediate layer. The configuration of a GaN-based MQW laser including the intermediate layer formed on sapphire substrate is shown. The relationship between the lattice constant of an intermediate layer necessary for obtaining an intermediate layer excellent in crystallinity suitable for the above object and the lattice constants of compound semiconductors adjoining both sides of the intermediate layer is described.
    • 在基于GaN或ZnSe的多层半导体激光器和发光二极管中的n-n异质界面处,降低了导致工作电压增加的过大的电压降,从而延长了器件的使用寿命。 在形成过大的电压降的n-n异质界面区域中设置单个或多个n型中间层。 通过将n型异质界面的导带边缘处的能量值设定在n型导带边缘的能量值之间的中间值,可以减小在nn异质界面处产生的过大的电压降 邻接中间层两侧的复合半导体。 示出了包括在蓝宝石衬底上形成的中间层的GaN基MQW激光器的构造。 描述了获得适合于上述目的的结晶度优异的中间层所需的中间层的晶格常数与邻接中间层两侧的化合物半导体的晶格常数之间的关系。
    • 6. 发明授权
    • Semiconductor light emitting device and method of manufacturing the same
    • 半导体发光器件及其制造方法
    • US6060335A
    • 2000-05-09
    • US20900
    • 1998-02-09
    • John RennieGenichi HatakoshiMasaaki Onomura
    • John RennieGenichi HatakoshiMasaaki Onomura
    • H01L21/205H01L33/06H01L33/12H01L33/14H01L33/32H01L33/36H01S5/00H01S5/323H01S5/343H01L21/00
    • H01L33/025B82Y20/00H01L33/007H01S5/34333Y10S148/095
    • According to the present invention, a high-efficiency and high reliability GaN-based semiconductor light emitting device having uniform light emission from the active layer, can be obtained by suppressing the defect density of the interface between the guide layer and cladding layer. When manufacturing the GaN-based semiconductor light emitting device, the growth temperature and pressure are increased, or the carrier gas flow rate and ammonia flow rate necessary for efficiently growing p-GaAlN are increased, in the vicinity of the interface between the upper p-GaN guide layer and p-AlGaN cladding layer in particular, and thus a method and structure, capable of suppressing these high defect densities generated, can be provided. By selecting appropriate conditions, namely whether the increment in the temperature and pressure, and the increment in the flow rates of the carrier gas and ammonia should be carried out during the growth of the cladding layer or after, or they should be carried out at the same time or independently, or by inserting an InAlGaN or InGaN buffering layer for preventing the generation of defects, between the waveguide layer and cladding layer, the defect densities can be very much decreased.
    • 根据本发明,通过抑制引导层和包层之间的界面的缺陷密度,可以获得具有来自有源层的均匀发光的高效率和高可靠性的GaN基半导体发光器件。 当制造GaN基半导体发光器件时,生长温度和压力增加,或者有效地生长p-GaAlN所需的载气流量和氨流量增加,在上p- GaN引导层和p-AlGaN包覆层,因此可以提供能够抑制所产生的高缺陷密度的方法和结构。 通过选择适当的条件,即是否应在包层生长过程中或之后进行载运气体和氨的流量的升高和温度和压力的增加,或者应在 或者通过在波导层和包层之间插入用于防止缺陷产生的InAlGaN或InGaN缓冲层,可以非常大地降低缺陷密度。