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    • 4. 发明授权
    • Nitride compound semiconductor light emitting device
    • 氮化物半导体发光元件
    • US06242761B1
    • 2001-06-05
    • US09026941
    • 1998-02-20
    • Hidetoshi FujimotoJohn RennieMasahiro YamamotoMasayuki IshikawaShinya NunoueLisa Sugiura
    • Hidetoshi FujimotoJohn RennieMasahiro YamamotoMasayuki IshikawaShinya NunoueLisa Sugiura
    • H01L2972
    • H01L33/145H01L33/32H01S5/2205H01S5/2206H01S5/2214H01S5/2226H01S5/2231H01S5/32341
    • In order to remove the problems in conventional nitride compound semiconductor laser structures, namely, high operation voltage caused by a high resistance in a p-type layer and a high contact resistance of an electrode, damage to the crystal caused by dry etching, insufficient current injection, and the need for a high current density, a nitride compound semiconductor light emitting device has current blocking layers made of n-type B(1−x−y−z)InxAlyGazN (0≦x≦1, 0≦y≦1, 0≦z≦1) single crystal containing an oxide of a predetermined metal, carbon and impurities exhibiting p-type and n-type conductivity, or i-type B(1−x−y−z)InxAlyGazN (0≦x≦1, 0≦y≦1, 0≦z≦1) single crystal in which carriers are inactivated by hydrogen or oxygen to realize an internal current blocking structure without the need for dry etching. By applying a reverse bias voltage, the semiconductor can be activated only along a current path, and the remainder region is utilized as a current blocking layer. When the n-side electrode has a unique three-layered structure, a reduction in contact resistance and good wire bonding are promised.
    • 为了消除常规氮化物化合物半导体激光器结构中的问题,即由p型层中的高电阻引起的高操作电压和电极的高接触电阻,由干蚀刻引起的晶体损坏,电流不足 注入,并且需要高电流密度,氮化物化合物半导体发光器件具有由n型B(1-xyz)In x AlyGazN(0≤x≤1,0<= y <= 1)形成的电流阻挡层 ,0 <= z <= 1)含有预定金属的氧化物的单晶,碳和表现出p型和n型导电性的杂质,或i型B(1-xyz)In x AlyGazN(0 <= x < 1,0 <= y <= 1,0 <= z <= 1)其中载体被氢或氧灭活以实现内部电流阻挡结构而不需要干法蚀刻的单晶。 通过施加反向偏置电压,半导体只能沿着电流路径被激活,并且剩余区域被用作电流阻挡层。 当n侧电极具有独特的三层结构时,承诺了接触电阻的降低和良好的引线接合。