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1. 发明授权

US10670535B2 Automated pattern fidelity measurement plan generation 审中-公开
公开(公告)号：US10670535B2
公开(公告)日：2020-06-02
申请号：US16296132
申请日：2019-03-07
申请人： KLA-Tencor Corporation
发明人： Brian Duffy , Ajay Gupta , Thanh Huy Ha
IPC分类号： G01N21/88 , G03F7/20 , G01N21/95 , G01N23/00 , G01N21/956
摘要： Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

2. 发明授权

US10267746B2 Automated pattern fidelity measurement plan generation 有权
公开(公告)号：US10267746B2
公开(公告)日：2019-04-23
申请号：US14918394
申请日：2015-10-20
申请人： KLA-Tencor Corporation
发明人： Brian Duffy , Ajay Gupta , Thanh Huy Ha
IPC分类号： G01N21/88 , G01N23/00 , G01N21/95 , G03F7/20 , G01N21/956
摘要： Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

3. 发明申请

US20160116420A1 Automated Pattern Fidelity Measurement Plan Generation 审中-公开
标题翻译：自动图案保真度测量计划生成
公开(公告)号：US20160116420A1
公开(公告)日：2016-04-28
申请号：US14918394
申请日：2015-10-20
申请人： KLA-Tencor Corporation
发明人： Brian Duffy , Ajay Gupta , Thanh Huy Ha
IPC分类号： G01N21/88 , G01N23/00 , G01N21/95
CPC分类号： G01N21/8851 , G01N21/9501 , G01N21/956 , G01N23/00 , G01N2021/8883 , G03F7/70625
摘要： Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (ROIs) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.
摘要翻译：提供了用于确定要在样本上执行的计量过程的参数的方法和系统。一个系统包括一个或多个计算机子系统，其被配置为在基于样本的设计的测量子系统为样本执行的度量过程期间自动生成要测量的感兴趣区域（ROI）。计算机子系统还被配置为在测量子系统的计量过程中自动确定在ROI的第一和第二子集中执行的测量参数，其基于位于 ROI的第一和第二子集。在第一子集中执行的测量的参数被分开地和独立于在第二子集中执行的测量的参数来确定。

4. 发明申请

US20160377425A1 DETERMINING MULTI-PATTERNING STEP OVERLAY ERROR 审中-公开
标题翻译：确定多模式步骤覆盖错误
公开(公告)号：US20160377425A1
公开(公告)日：2016-12-29
申请号：US15170881
申请日：2016-06-01
申请人： KLA-Tencor Corporation
发明人： Ajay Gupta , Thanh Huy Ha , Olivier Moreau , Kumar Raja
IPC分类号： G01B15/00 , H01J37/22 , G01B11/27 , H01L21/67 , H01L21/68
CPC分类号： H01J37/222 , G03F7/70633 , H01J2237/221 , H01J2237/24578 , H01J2237/31798
摘要： Methods and systems for determining overlay error between different patterned features of a design printed on a wafer in a multi-patterning step process are provided. For multi-patterning step designs, the design for a first patterning step is used as a reference and designs for each of the remaining patterning steps are synthetically shifted until the synthetically shifted designs have the best global alignment with the entire image based on global image-to-design alignment. The final synthetic shift of each design for each patterning step relative to the design for the first patterning step provides a measurement of relative overlay error between any two features printed on the wafer using multi-patterning technology.
摘要翻译：提供了用于在多图案化步骤过程中确定印刷在晶片上的设计的不同图案特征之间确定覆盖误差的方法和系统。对于多图案化步骤设计，将第一图案化步骤的设计用作参考，并且对于每个剩余的图案化步骤的设计被合成移位，直到合成移位的设计基于全局图像步骤与整个图像具有最佳的全局对准，设计对齐。相对于第一图案化步骤的设计，每个图案化步骤的每个设计的最终合成位移提供了使用多图案化技术印刷在晶片上的任何两个特征之间的相对重叠误差的测量。

5. 发明授权

US09483819B2 Contour-based array inspection of patterned defects 有权
标题翻译：基于轮廓的阵列检查图案缺陷
公开(公告)号：US09483819B2
公开(公告)日：2016-11-01
申请号：US14062761
申请日：2013-10-24
申请人： KLA-Tencor Corporation
发明人： Chien-Huei Chen , Ajay Gupta , Thanh Huy Ha , Jianwei Wang , Hedong Yang , Christopher Michael Maher , Michael J. Van Riet
IPC分类号： G06T7/00 , G01N23/225 , H01L21/66
CPC分类号： G06T7/001 , G01N23/2251 , G01N2223/6116 , G06T2207/10061 , G06T2207/30148 , H01L22/12
摘要： One embodiment relates to a method of inspecting an array of cells on a substrate. A reference image is generated using a cell image that was previously determined to be defect free. A reference contour image which includes contours of the reference image is also generated. The reference contour image is used to detect defects in the array of cells on the substrate. Another embodiment relates to a system for detecting defects in an array on a substrate. Other embodiments, aspects and features are also disclosed.
摘要翻译：一个实施例涉及一种检查衬底上的单元阵列的方法。使用先前确定为无缺陷的单元图像来生成参考图像。还生成包括参考图像的轮廓的参考轮廓图像。参考轮廓图像用于检测基板上的单元阵列中的缺陷。另一个实施例涉及用于检测衬底上的阵列中的缺陷的系统。还公开了其它实施例，方面和特征。

6. 发明授权

US10733744B2 Learning based approach for aligning images acquired with different modalities 有权
公开(公告)号：US10733744B2
公开(公告)日：2020-08-04
申请号：US15927011
申请日：2018-03-20
申请人： KLA-Tencor Corporation
发明人： Thanh Huy Ha , Scott A. Young , Mohan Mahadevan
IPC分类号： G06K9/00 , G06T7/30 , G06K9/62 , H01J37/26 , G06F30/00
摘要： Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

7. 发明申请

US20190204237A1 Automated Pattern Fidelity Measurement Plan Generation 审中-公开
公开(公告)号：US20190204237A1
公开(公告)日：2019-07-04
申请号：US16296132
申请日：2019-03-07
申请人： KLA-Tencor Corporation
发明人： Brian Duffy , Ajay Gupta , Thanh Huy Ha
IPC分类号： G01N21/88 , G01N23/00 , G03F7/20 , G01N21/95
摘要： Methods and systems for determining parameter(s) of a metrology process to be performed on a specimen are provided. One system includes one or more computer subsystems configured for automatically generating regions of interest (Rats) to be measured during a metrology process performed for the specimen with the measurement subsystem based on a design for the specimen. The computer subsystem(s) are also configured for automatically determining parameter(s) of measurement(s) performed in first and second subsets of the ROIs during the metrology process with the measurement subsystem based on portions of the design for the specimen located in the first and second subsets of the ROIs, respectively. The parameter(s) of the measurement(s) performed in the first subset are determined separately and independently of the parameter(s) of the measurement(s) performed in the second subset.

8. 发明申请

US20180330511A1 LEARNING BASED APPROACH FOR ALIGNING IMAGES ACQUIRED WITH DIFFERENT MODALITIES 审中-公开
公开(公告)号：US20180330511A1
公开(公告)日：2018-11-15
申请号：US15927011
申请日：2018-03-20
申请人： KLA-Tencor Corporation
发明人： Thanh Huy Ha , Scott A. Young , Mohan Mahadevan
IPC分类号： G06T7/30 , G06K9/62 , G06F17/50 , H01J37/26
摘要： Methods and systems for aligning images for a specimen acquired with different modalities are provided. One method includes acquiring information for a specimen that includes at least first and second images for the specimen. The first image is acquired with a first modality different than a second modality used to acquire the second image. The method also includes inputting the information into a learning based model. The learning based model is included in one or more components executed by one or more computer systems. The learning based model is configured for transforming one or more of the at least first and second images to thereby render the at least the first and second images into a common space. In addition, the method includes aligning the at least the first and second images using results of the transforming. The method may also include generating an alignment metric using a classifier.

9. 发明授权

US10062543B2 Determining multi-patterning step overlay error 有权
公开(公告)号：US10062543B2
公开(公告)日：2018-08-28
申请号：US15170881
申请日：2016-06-01
申请人： KLA-Tencor Corporation
发明人： Ajay Gupta , Thanh Huy Ha , Olivier Moreau , Kumar Raja
IPC分类号： G06K9/00 , H01L21/76 , G01B11/00 , H01L23/544 , G06F19/00 , H01J37/22 , G03F7/20
CPC分类号： H01J37/222 , G03F7/70633 , H01J2237/221 , H01J2237/24578 , H01J2237/31798
摘要： Methods and systems for determining overlay error between different patterned features of a design printed on a wafer in a multi-patterning step process are provided. For multi-patterning step designs, the design for a first patterning step is used as a reference and designs for each of the remaining patterning steps are synthetically shifted until the synthetically shifted designs have the best global alignment with the entire image based on global image-to-design alignment. The final synthetic shift of each design for each patterning step relative to the design for the first patterning step provides a measurement of relative overlay error between any two features printed on the wafer using multi-patterning technology.

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