专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US12024419B2 Charge controlled clamp for MEMS readout circuits 有权
公开(公告)号：US12024419B2
公开(公告)日：2024-07-02
申请号：US18174280
申请日：2023-02-24
申请人： Infineon Technologies AG
发明人： Hong Chen , Michael Reinhold , Juergen Roeber , Andreas Wiesbauer
IPC分类号： B81B7/00 , H02J50/05
CPC分类号： B81B7/007 , B81B7/0029 , H02J50/05
摘要： A device includes a readout circuit coupled between an input node and an output node; a microelectromechanical systems (MEMS) device coupled to the input node; and a first charge controlled clamp circuit coupled between the input node and a first bias node.

2. 发明授权

US10640367B2 Water proofing and water detection schemes for MEMS-based environmental sensing devices 有权
公开(公告)号：US10640367B2
公开(公告)日：2020-05-05
申请号：US16147537
申请日：2018-09-28
申请人： Apple Inc.
发明人： Krishna Prasad Vummidi Murali , Kuolung Lei , Richard Yeh , Yun X. Ma
IPC分类号： B81B7/00 , B81C1/00
CPC分类号： B81B7/0058 , B81B7/0029 , B81B7/0077 , B81C1/0023 , B81B2201/0214 , B81B2201/0264 , B81B2201/0278 , B81B2203/0127 , B81B2203/04 , B81B2207/012 , B81B2207/096 , B81C2203/0136 , B81C2203/0792
摘要： A waterproofed environmental sensing device with water detection provisions includes an environmental sensor to sense one or more environmental properties. The device further includes an electronic integrated circuit implemented on a substrate and coupled to the environmental sensor via a wire bonding. An air-permeable cap structure is formed over the environmental sensor, and a protective layer is formed over the wire bonding to protect the wire bonding against damage.

3. 发明申请

US20190161345A1 DEPOSITION OF PROTECTIVE MATERIAL AT WAFER LEVEL IN FRONT END FOR EARLY STAGE PARTICLE AND MOISTURE PROTECTION 审中-公开
公开(公告)号：US20190161345A1
公开(公告)日：2019-05-30
申请号：US15827057
申请日：2017-11-30
申请人： Infineon Technologies AG
发明人： Florian BRANDL , Manfred FRIES , Franz-Peter KALZ
IPC分类号： B81C1/00 , H01L21/50 , H01L23/04 , H01L23/10 , B81B7/00
CPC分类号： B81C1/00285 , B29C35/02 , B81B7/0029 , B81B7/0038 , B81B7/0045 , B81B7/0051 , B81C1/00063 , B81C1/0019 , B81C1/00301 , B81C1/0038 , B81C1/00904 , H01L21/50 , H01L23/04 , H01L23/10 , H01L2924/16235
摘要： A semiconductor device and a method of manufacturing the same are provided such that a microelectromechanical systems (MEMS) element is protected at an early manufacturing stage. A method for protecting a MEMS element includes: providing at least one MEMS element, having a sensitive area, on a substrate; and depositing, prior to a package assembly process, a protective material over the sensitive area of the at least one MEMS element such that the sensitive area of at least one MEMS element is sealed from an external environment, where the protective material permits a sensor functionality of the at least one MEMS element.

4. 发明申请

US20180359571A1 ACOUSTIC SENSOR INTEGRATED MEMS MICROPHONE STRUCTURE AND FABRICATION METHOD THEREOF 审中-公开
公开(公告)号：US20180359571A1
公开(公告)日：2018-12-13
申请号：US15781364
申请日：2015-12-14
申请人： Goertek Inc.
发明人： Junkai ZHAN , Mengjin CAI , Guanxun QIU , Zonglin ZHOU , Qinglin SONG
IPC分类号： H04R19/04 , B81C1/00 , B81B7/00 , H04R31/00
CPC分类号： H04R19/04 , B81B7/0029 , B81B7/02 , B81B2201/0257 , B81B2201/0292 , B81C1/00158 , H04R19/005 , H04R31/00 , H04R2201/003
摘要： An acoustic sensor integrated MEMS microphone structure and a fabrication method thereof. A diaphragm (3e) and back-pole (7) which forms a condenser structure are formed on a substrate (1) having at least one recessed slot (1a) on the top. A sensitive electrode is formed on the substrate (1), the sensitive electrode comprising a fixed portion (3b) fixed on the substrate (1) via a sacrificial layer (2), and a bending portion (3a) inserted into the recessed slot (1a), wherein the bending portion and the side wall of the recessed slot form the condenser structure. The integrated structure integrates the condenser structure of the microphone and condenser structure of the acoustic sensor on a substrate (1), thereby increasing the integration level thereof and reducing the overall size of the package. Meanwhile, the microphone diaphragm (3e) and the sensitive electrode of the acoustic sensor can be fabricated on a same substrate (1) at the same time, from the same material, and using the same fabricating process to increase production efficiency.

5. 发明申请

US20180335358A1 MEMS PRESSURE SENSING ELEMENT 审中-公开
公开(公告)号：US20180335358A1
公开(公告)日：2018-11-22
申请号：US15559647
申请日：2015-12-10
申请人： GOERTEK.INC
发明人： Guoguang ZHENG
IPC分类号： G01L9/00 , B81B7/00 , B81C1/00
CPC分类号： G01L9/0072 , B81B7/0029 , B81B7/0064 , B81B2201/0264 , B81B2203/0172 , B81B2203/0307 , B81B2203/0315 , B81B2203/04 , B81B2203/053 , B81B2207/053 , B81C1/00166 , G01L9/0073 , G01L19/069
摘要： The present invention discloses an MEMS pressure sensing element, including a substrate provided with a groove; a pressure-sensitive film disposed above the substrate, the pressure-sensitive film sealing an opening of the groove to form a sealed cavity; and a movable electrode plate and a fixed electrode plate which are located in the sealed cavity and form a capacitor structure, wherein the fixed electrode plate is fixed on a bottom wall of the groove of the substrate, and the movable electrode plate is suspended above the fixed electrode plate and opposite to the fixed electrode plate; and the pressure-sensitive film is connected to the movable electrode plate so as to drive the movable electrode plate to move under the action of an external pressure. According to the MEMS pressure sensing element, pressure sensitivity and electrical detection are separated, the pressure-sensitive film is exposed in air, the capacitor structures are disposed in the sealed cavity defined by the pressure-sensitive film and the substrate, and the movable electrode plates of the capacitor structures can be driven by the pressure-sensitive film. In this way, not only is a pressure-sensitive function finished, but also external electromagnetic interferences on the capacitor structures are shielded.

6. 发明申请

US20180244516A1 MEMS DEVICE AND PROCESS 审中-公开
公开(公告)号：US20180244516A1
公开(公告)日：2018-08-30
申请号：US15895689
申请日：2018-02-13
申请人： Cirrus Logic International Semiconductor Ltd.
发明人： Marek Sebastian PIECHOCINSKI
IPC分类号： B81B7/00 , B81C1/00 , H04R19/04 , G01L9/00 , H04R7/26
CPC分类号： B81B7/0061 , B81B7/0029 , B81B2201/0257 , B81B2201/0264 , B81B2203/0118 , B81B2203/0127 , B81B2203/0323 , B81B2207/012 , B81C1/00158 , G01L9/0042 , G01L9/0073 , H04R7/26 , H04R19/005 , H04R19/04 , H04R2201/003 , H04R2499/11
摘要： The application describes MEMS transducers and associated methods of fabrication. The MEMS transducer has a flexible membrane with a vent structure comprising a moveable portion which opens in response to a differential pressure across the membrane to provide a flow path through the membrane. At least one edge of the moveable portion comprises one or more protrusions and/or recesses in the plane of the moveable portion.

7. 发明申请

US20170295434A1 PACKAGING FOR MEMS TRANSDUCERS 审中-公开
公开(公告)号：US20170295434A1
公开(公告)日：2017-10-12
申请号：US15634049
申请日：2017-06-27
申请人： Cirrus Logic International Semiconductor Ltd.
发明人： Tsjerk HOEKSTRA
IPC分类号： H04R19/04 , H04R19/00 , H04R31/00 , B81B7/00
CPC分类号： H04R19/04 , B81B7/0029 , B81B7/0038 , B81B7/0051 , B81B7/0064 , B81B7/0077 , B81B2201/0257 , B81B2207/012 , B81B2207/015 , B81C2203/0714 , B81C2203/0742 , B81C2203/0778 , H01L2224/48091 , H04R1/04 , H04R19/005 , H04R31/003 , H04R2201/003 , H04R2499/11 , H01L2924/00014
摘要： This application describes methods and apparatus relating to packaging of MEMS transducers and to MEMS transducer packages. The application describes a MEMS transducer package (300) having a first integrated circuit die (200) which has an integrated MEMS transducer (202) and integrated electronic circuitry (203) for operation of the MEMS transducer. The package is arranged such that the footprint of the MEMS transducer package is substantially the same size as the footprint of the integrated circuit die. At least part of the first integrated circuit die (200) may form a sidewall of the package. The package may be formed by a first package cover (302) which overlies the MEMS transducer and a second package cover (301) on the other side of the first integrated circuit die.

8. 发明申请

US20160016792A1 MICROSTRUCTURE AND ELECTRONIC DEVICE 审中-公开
标题翻译：微结构和电子器件
公开(公告)号：US20160016792A1
公开(公告)日：2016-01-21
申请号：US14873091
申请日：2015-10-01
申请人： STMicroelectronics, Inc.
发明人： Ming Fang
IPC分类号： B81C1/00
CPC分类号： B81C1/00666 , B81B7/0029 , B81B2203/0181 , B81C1/0019 , B81C2201/0169 , B81C2201/112
摘要： A method of manufacturing microstructures, such as MEMS or NEMS devices, including forming a protective layer on a surface of a moveable component of the microstructure. For example, a silicide layer may be formed on a portion of at least four different surfaces of a poly-silicon mass that is moveable with respect to a substrate of the microstructure. The process may be self-aligning.
摘要翻译：一种制造微结构的方法，例如MEMS或NEMS器件，包括在微结构的可移动部件的表面上形成保护层。例如，可以在可相对于微结构的基板移动的多晶硅块的至少四个不同表面的一部分上形成硅化物层。该过程可以是自对准的。

9. 发明申请

US20150378064A1 Piezoelectric Optical MEMS Device With Embedded Moisture Layers 有权
标题翻译：具有嵌入式水分层的压电光学MEMS器件
公开(公告)号：US20150378064A1
公开(公告)日：2015-12-31
申请号：US14553812
申请日：2014-11-25
申请人： Texas Instruments Incorporated
发明人： YungShan Chang , Ricky A. Jackson
IPC分类号： G02B1/18 , B81B7/00 , G02B26/08
CPC分类号： B81B7/0029 , G02B1/14 , G02B26/0875
摘要： A piezoelectric optical micro-electro-mechanical systems (POMEMS) device includes a glass layer having a bottom surface and a top surface. The device may also include an upper moisture barrier layer having a top surface and a bottom surface in which the bottom surface of the top moisture barrier layer is substantially coextensive with and interfaces with the top surface of the glass layer. A piezo stack may be attached above the upper moisture barrier layer. The device may also include a lower moisture barrier layer having a bottom surface and a top surface. The top surface of the lower moisture barrier layer is substantially coextensive with and interfaces with the bottom surface of the glass layer. A semiconductor substrate may be attached below the bottom moisture barrier layer.
摘要翻译：压电光电微机电系统（POMEMS）装置包括具有底表面和顶表面的玻璃层。该装置还可以包括具有顶表面和底表面的上部防潮层，其中顶部防潮层的底表面基本上与玻璃层的顶表面共同延伸并与其接合。压电叠层可以附着在上部防潮层上。该装置还可以包括具有底表面和顶表面的下部防潮层。下部防潮层的上表面与玻璃层的底面基本上共同延伸并与其接触。半导体衬底可以附着在底部阻湿层的下方。

10. 发明申请

US20150321907A1 SEQUENTIAL WAFER BONDING 有权
标题翻译：顺序波形结合
公开(公告)号：US20150321907A1
公开(公告)日：2015-11-12
申请号：US14804110
申请日：2015-07-20
申请人： Philip H. Bowles , Stephen R. Hooper
发明人： Philip H. Bowles , Stephen R. Hooper
IPC分类号： B81B7/04 , B81B7/00
CPC分类号： B81B7/04 , B81B7/0029 , B81B7/0041 , B81B2201/0235 , B81B2201/0242 , B81B2207/012 , B81C1/0023 , B81C1/00293 , B81C2203/0145 , H01L23/10 , H01L29/66007 , H01L29/84 , H01L2224/11 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a sensor device include a sensor substrate and a first cap substrate attached to the sensor substrate with a first bond material. The first bond material is arranged to define a first device cavity. A second cap substrate is attached to the sensor substrate with a second bond material. The second bond material is arranged to define a second device cavity. The second bond material has a lower bonding temperature than the first bond material. The second cap substrate is further secured to the sensor substrate by an adhesive material disposed between the sensor substrate and the second cap substrate.
摘要翻译：传感器装置的实施例包括传感器基板和附接到具有第一粘合材料的传感器基板的第一盖基板。第一接合材料布置成限定第一器件腔。用第二粘结材料将第二盖基片连接到传感器基板上。第二接合材料被布置成限定第二器件腔。第二粘合材料具有比第一粘结材料低的结合温度。第二盖基板通过布置在传感器基板和第二盖基板之间的粘合材料进一步固定到传感器基板。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式