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1. 发明申请

US20090040654A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20090040654A1
公开(公告)日：2009-02-12
申请号：US12136828
申请日：2008-06-11
申请人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
发明人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
IPC分类号： G11B33/14
CPC分类号： G11B33/1413
摘要： An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.
摘要翻译：一种电子设备1，其安装有具有至少包括第一发热部和第二发热部的多个发热部的电子单元，包括：用于保持电子单元的保持框架9，第一热量用于传递由第一发热部产生的热的导热部件11，用于传递由第二发热部产生的热的第二导热部件11和用于释放通过第一和第二发热部分传递的热的冷却单元8 发热段; 在该装置中，第一导热构件11被热连接到冷却单元8，并且第二导热构件11经由保持框架9被热连接到冷却单元8。

2. 发明授权

US08223454B2 Cooling system for an electronic unit with plural heat-generating sections 有权
标题翻译：具有多个发热部的电子单元的冷却系统
公开(公告)号：US08223454B2
公开(公告)日：2012-07-17
申请号：US12136828
申请日：2008-06-11
申请人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
发明人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
IPC分类号： G11B33/14
CPC分类号： G11B33/1413
摘要： An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.
摘要翻译：一种电子设备1，其安装有具有至少包括第一发热部和第二发热部的多个发热部的电子单元，包括：用于保持电子单元的保持框架9，第一热量用于传递由第一发热部产生的热的导热部件11，用于传递由第二发热部产生的热的第二导热部件11和用于释放通过第一和第二发热部分传递的热的冷却单元8 发热段; 在该装置中，第一导热构件11被热连接到冷却单元8，并且第二导热构件11经由保持框架9被热连接到冷却单元8。

3. 发明申请

US20070012423A1 Liquid cooling jacket and liquid cooling device 审中-公开
标题翻译：液体冷却套和液体冷却装置
公开(公告)号：US20070012423A1
公开(公告)日：2007-01-18
申请号：US11412971
申请日：2006-04-28
申请人： Koichiro Kinoshita , Hironori Oikawa , Shigeo Ohashi , Koichi Takahashi , Takeshi Hizono , Masato Nakanishi
发明人： Koichiro Kinoshita , Hironori Oikawa , Shigeo Ohashi , Koichi Takahashi , Takeshi Hizono , Masato Nakanishi
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up from one surface of the base portion, being curved, and a casing accommodating therein the fin piece in its center part so as to cause the liquid refrigerant to flow between the thin fins. Further, the cooling device includes a plurality of heat receiving jackets and a plurality of heat radiating portions which are alternately connected so as to constitute a passage for the liquid refrigerant, a part of the passage being connected with a circulation pump so as to constitute a closed circulation passage for the liquid refrigerant. With this configuration, it is possible to provide a liquid cooling device capable of decreasing the temperature rise of a heating element such as a CPU, having a high performance and being excellent in costs.
摘要翻译：一种用于电子设备的液体冷却装置中的热接收套管，用于将热量从电子设备中的加热部分传送到液体制冷剂，由具有形成有基部的翅片组成，薄片从一个表面起升的基部弯曲，以及在其中心部分容纳翅片的壳体，以使液体制冷剂在薄翅片之间流动。此外，冷却装置包括多个热接收夹套和多个热辐射部分，其交替地连接成构成用于液体制冷剂的通道，所述通道的一部分与循环泵连接以构成一个用于液体制冷剂的封闭循环通道。根据该结构，能够提供能够降低CPU等加热元件的温度上升的液体冷却装置，其性能高，成本优异。

4. 发明授权

US06639797B2 Computer having cooling device 有权
标题翻译：电脑有冷却装置
公开(公告)号：US06639797B2
公开(公告)日：2003-10-28
申请号：US10196145
申请日：2002-07-17
申请人： Masayuki Saeki , Hironori Oikawa , Takeshi Hizono
发明人： Masayuki Saeki , Hironori Oikawa , Takeshi Hizono
IPC分类号： H05K720
CPC分类号： G06F1/20 , G06F2200/201
摘要： In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.
摘要翻译：在具有使用诸如热管和液冷系统之类的传热措施的冷却结构的信息处理设备中，散热单元具有减小的厚度和噪声并提高效率。由CPU产生的热量通过由泵输送的液体冷却剂通过热接收头和柔性管传递到散热单元。散热单元包括螺旋桨，与螺旋桨接触的壁表面，以及在与螺旋桨轴垂直的平面中螺旋地缠绕在传动轴上的冷却管。热冷却剂循环进入冷却管的中心部分并从管的外周部排出。来自螺旋桨的冷却空气从冷却管的中心部分向其周边部分流动。冷却管与壁面热连接，使得壁面作为散热器工作。

5. 发明授权

US06778394B2 Electronic device having a heat dissipation member 有权
标题翻译：具有散热构件的电子装置
公开(公告)号：US06778394B2
公开(公告)日：2004-08-17
申请号：US10414152
申请日：2003-04-16
申请人： Hironori Oikawa , Takeshi Hizono , Katsuya Sato
发明人： Hironori Oikawa , Takeshi Hizono , Katsuya Sato
IPC分类号： H05K720
CPC分类号： H05K7/20154 , F28D15/0266 , F28F3/12
摘要： In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.
摘要翻译：为了有效地冷却安装在电子设备上的高发热元件，需要提供作为散热构件的大型散热器，这就造成设备尺寸增大，安装空间增大的问题。将热接收部件安装在安装在壳体中的发热部件上，将壳体内的空气排出外壳的风扇安装在壳体的壁的一部分上，散热器具有基部和翅片，该散热器布置在基座与壳体的外壁上的风扇相对地安装，或者突出到壁的外面，翅片面向壳体，散热器和热接收构件通过热传递装置连接。

6. 发明授权

US07021367B2 Liquid cooling jacket 有权
标题翻译：液体冷却套
公开(公告)号：US07021367B2
公开(公告)日：2006-04-04
申请号：US10796045
申请日：2004-03-10
申请人： Hironori Oikawa
发明人： Hironori Oikawa
IPC分类号： F28F7/00
CPC分类号： F28F3/12 , F28D15/02 , F28F3/02 , H01L23/3672 , H01L23/427 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： In a liquid cooling jacket, to improve the heat transfer coefficient, extensibility and assembling, the liquid cooling jacket comprises a base bonded to a heating element; a post standing perpendicularly to the base; a plurality of radiating fins attached to the post and arranged so as to be parallel to the base; a partition filling up intervals between the plurality of radiating fins at a predetermined width; and a case which surrounds the post and the radiating fins and is bonded to the base, and to which an inlet and an outlet for coolant are attached at positions where flow of the coolant is divided by the partition. The plurality of radiating fins may be arranged at intervals each of which is narrow in comparison with a thickness of each of the plurality of radiating fins. Therefore, because the coolant flow within the liquid cooling jacket ensures a plurality of passages, the passage resistance is low. In addition, by setting the size of each of the inlet and outlet for the coolant to be substantially equal to the height of the arranged radiating fins, the flow rates on the radiating fins can be even.
摘要翻译：在液体冷却套中，为了提高传热系数，伸长性和组装性，液体冷却套包括与加热元件结合的基座; 垂直于基座的立柱; 多个散热片，其安装在所述柱上并且被布置成平行于所述基座; 分隔件，以预定的宽度填满所述多个散热片之间的间隔; 以及围绕柱和散热片并且结合到基座的壳体，并且在冷却剂的流动被分隔件分隔的位置附接有用于冷却剂的入口和出口的壳体。多个散热片可以间隔布置，每个散热片与多个散热片的厚度相比较窄。因此，由于液体冷却套管内的冷却剂流动确保多个通路，所以通过阻力低。此外，通过将用于冷却剂的入口和出口的每一个的尺寸设置为基本上等于所布置的散热片的高度，散热片上的流量可以是均匀的。

7. 发明申请

US20090301692A1 Electronic Apparatus Cooling Device 审中-公开
标题翻译：电子设备冷却装置
公开(公告)号：US20090301692A1
公开(公告)日：2009-12-10
申请号：US12421749
申请日：2009-04-10
申请人： Hironori Oikawa
发明人： Hironori Oikawa
IPC分类号： F28D15/00
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/3011 , H01L2924/00
摘要： A compact, low-cost electronic apparatus cooling device which provides a high heat receiving performance with less transfer of the heat of an exothermic body to a pump. In the device, a heat receiving part has fins in a given area of a plate-like base and the height of the fins is almost equal to the thickness of the base which surrounds them. A pressure member with an opening covers part of the top of the fins and part of the base. Refrigerant flows in from part of the top of the fins in contact with the opening of the pressure member and flow out from part of the top of the fins not covered by the pressure member.
摘要翻译：一种紧凑，低成本的电子设备冷却装置，其提供高的热接收性能，同时将放热体的热量较少地传递到泵。在该装置中，受热部在板状基部的给定区域具有翅片，翅片的高度几乎等于围绕它们的基部的厚度。具有开口的压力构件覆盖翅片的顶部和基部的一部分的一部分。制冷剂从与压力构件的开口接触的翅片的顶部的一部分流入，并从未被压力构件覆盖的翅片的顶部的一部分流出。

8. 发明申请

US20080216991A1 COOLING DEVICE FOR INFORMATION EQUIPMENT 审中-公开
标题翻译：信息设备冷却装置
公开(公告)号：US20080216991A1
公开(公告)日：2008-09-11
申请号：US12039962
申请日：2008-02-29
申请人： Hironori Oikawa
发明人： Hironori Oikawa
IPC分类号： F28F7/00
CPC分类号： G06F1/20 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling device for an information equipment, comprises a heat receiving member composed of a base member thermally connected to a heat generating element, and a casing member, which are defined therebetween a closes space in which a coolant can flow, the base member is integrally incorporated with fins in a predetermined zone of its planar surface on the side remote from the heat generating element thermally connected to the base member, and the base member has a thickness which is thinner in the zone where the fins are formed than in the other zone where no fins are formed. With this configuration, the heat receiving member which can enhance the heat-exchanging performance of a liquid cooling system, can be manufactured at a low cost.
摘要翻译：一种用于信息设备的冷却装置，包括由与发热元件热连接的基座构件和外壳构件构成的热接收构件，其间限定有冷却剂可流动的封闭空间，所述基座构件一体地在远离发热元件的与基座部件热连接的一侧的平坦表面的预定区域内装有散热片，并且基体部件的厚度在形成散热片的区域比在另一个区域中更薄其中没有翅片形成。通过这种结构，可以以低成本制造能够提高液体冷却系统的热交换性能的受热部件。

9. 发明授权

US06769045B2 PCI expansion adapter with PC card slot and electronic apparatus provided with the same 有权
标题翻译：具有PC卡插槽和电子设备的PCI扩展适配器
公开(公告)号：US06769045B2
公开(公告)日：2004-07-27
申请号：US09949823
申请日：2001-09-12
申请人： Mikihiro Tanaka , Kenichi Yoshida , Hiroyuki Inokuchi , Takashi Maruyama , Kazuma Kishi , Hironori Oikawa , Hiroshi Ito , Hitoshi Yokota
发明人： Mikihiro Tanaka , Kenichi Yoshida , Hiroyuki Inokuchi , Takashi Maruyama , Kazuma Kishi , Hironori Oikawa , Hiroshi Ito , Hitoshi Yokota
IPC分类号： G06F1300
CPC分类号： G06F1/185 , G06F1/181 , G06F1/184 , G06F1/186 , H01R12/52
摘要： There is provided a technology for realizing an PCI expansion adapter for a PC card which is connectable to a desktop type personal computer PCI expansion connector using a low profile PCI. The PCI expansion adapter includes an expansion unit which is provided with an electrical connector to a PCI bus, a low profile PCI expansion board provided with a PC card control element and an electrical connector to the PC card, wherein the low profile PCI expansion board and the expansion unit are connected by the electrical connectors mounted on the respective boards.

10. 发明授权

US08261813B2 Electronic device cooling apparatus and electronic device including the same 有权
标题翻译：电子装置冷却装置及其电子装置
公开(公告)号：US08261813B2
公开(公告)日：2012-09-11
申请号：US12233117
申请日：2008-09-18
申请人： Hironori Oikawa
发明人： Hironori Oikawa
IPC分类号： F28F7/00
CPC分类号： H05K7/20272 , H01L2924/0002 , H01L2924/00
摘要： As an electronic device cooling apparatus which allows refrigerant liquid to circulate and flow in a cooling system by using a pump so as to cool a heat generating portion of an electronic device, a heat generating portion cooling unit which is connected to the pump, which receives heat from the heat generating portion of the electronic device, and which releases the heat to the refrigerant liquid through a fin portion so as to cool the heat generating portion includes independently therein a first flow channel through which the refrigerant liquid discharged from a discharging port of the pump is drawn in to be guided to the outside of the heat generating portion cooling unit through the fin portion, and a second flow channel through which the refrigerant liquid cooled at the outside is drawn in to be guided towards a sucking port of the pump.
摘要翻译：作为使制冷剂液体通过使用泵在冷却系统中循环并流动以冷却电子设备的发热部的电子设备冷却装置，连接到泵的发热部冷却单元，其接收从电子设备的发热部分产生的热量通过翅片部分散热到制冷剂液体，以便冷却发热部分，独立地包括第一流动通道，从排出口排出的制冷剂液体通过翅片部将吸引引导到发热部冷却部的外部，将吸入外部冷却的制冷剂液体的第二流路引导到泵的吸入口。

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