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1. 发明申请

US20090040654A1 ELECTRONIC APPARATUS 有权
标题翻译：电子设备
公开(公告)号：US20090040654A1
公开(公告)日：2009-02-12
申请号：US12136828
申请日：2008-06-11
申请人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
发明人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
IPC分类号： G11B33/14
CPC分类号： G11B33/1413
摘要： An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.
摘要翻译：一种电子设备1，其安装有具有至少包括第一发热部和第二发热部的多个发热部的电子单元，包括：用于保持电子单元的保持框架9，第一热量用于传递由第一发热部产生的热的导热部件11，用于传递由第二发热部产生的热的第二导热部件11和用于释放通过第一和第二发热部分传递的热的冷却单元8 发热段; 在该装置中，第一导热构件11被热连接到冷却单元8，并且第二导热构件11经由保持框架9被热连接到冷却单元8。

2. 发明授权

US08223454B2 Cooling system for an electronic unit with plural heat-generating sections 有权
标题翻译：具有多个发热部的电子单元的冷却系统
公开(公告)号：US08223454B2
公开(公告)日：2012-07-17
申请号：US12136828
申请日：2008-06-11
申请人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
发明人： Kazuaki Tanaka , Takeshi Hizono , Hironori Oikawa
IPC分类号： G11B33/14
CPC分类号： G11B33/1413
摘要： An electronic apparatus 1 in which is mounted an electronic unit having a plurality of heat-generating sections including at least a first heat-generating section and a second heat-generating section includes: a hold frame 9 for holding the electronic unit, a first heat-conducting member 11 for transmitting heat generated by the first heat-generating section, a second heat-conducting member 11 for transmitting heat generated by the second heat-generating section, and a cooling unit 8 for releasing the heat transmitted through the first and second heat-generating sections; in which apparatus, the first heat-conducting member 11 is heat-connected to the cooling unit 8, and the second heat-conducting member 11 is heat-connected to the cooling unit 8 via the hold frame 9.
摘要翻译：一种电子设备1，其安装有具有至少包括第一发热部和第二发热部的多个发热部的电子单元，包括：用于保持电子单元的保持框架9，第一热量用于传递由第一发热部产生的热的导热部件11，用于传递由第二发热部产生的热的第二导热部件11和用于释放通过第一和第二发热部分传递的热的冷却单元8 发热段; 在该装置中，第一导热构件11被热连接到冷却单元8，并且第二导热构件11经由保持框架9被热连接到冷却单元8。

3. 发明申请

US20070012423A1 Liquid cooling jacket and liquid cooling device 审中-公开
标题翻译：液体冷却套和液体冷却装置
公开(公告)号：US20070012423A1
公开(公告)日：2007-01-18
申请号：US11412971
申请日：2006-04-28
申请人： Koichiro Kinoshita , Hironori Oikawa , Shigeo Ohashi , Koichi Takahashi , Takeshi Hizono , Masato Nakanishi
发明人： Koichiro Kinoshita , Hironori Oikawa , Shigeo Ohashi , Koichi Takahashi , Takeshi Hizono , Masato Nakanishi
IPC分类号： H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A heat receiving jacket in a liquid cooling device for electronic equipment, for transferring a heat from a heating portion in the electronic equipment to liquid refrigerant, is composed of a fin piece having a base portion formed thereon with thin fins which rise up from one surface of the base portion, being curved, and a casing accommodating therein the fin piece in its center part so as to cause the liquid refrigerant to flow between the thin fins. Further, the cooling device includes a plurality of heat receiving jackets and a plurality of heat radiating portions which are alternately connected so as to constitute a passage for the liquid refrigerant, a part of the passage being connected with a circulation pump so as to constitute a closed circulation passage for the liquid refrigerant. With this configuration, it is possible to provide a liquid cooling device capable of decreasing the temperature rise of a heating element such as a CPU, having a high performance and being excellent in costs.
摘要翻译：一种用于电子设备的液体冷却装置中的热接收套管，用于将热量从电子设备中的加热部分传送到液体制冷剂，由具有形成有基部的翅片组成，薄片从一个表面起升的基部弯曲，以及在其中心部分容纳翅片的壳体，以使液体制冷剂在薄翅片之间流动。此外，冷却装置包括多个热接收夹套和多个热辐射部分，其交替地连接成构成用于液体制冷剂的通道，所述通道的一部分与循环泵连接以构成一个用于液体制冷剂的封闭循环通道。根据该结构，能够提供能够降低CPU等加热元件的温度上升的液体冷却装置，其性能高，成本优异。

4. 发明授权

US06639797B2 Computer having cooling device 有权
标题翻译：电脑有冷却装置
公开(公告)号：US06639797B2
公开(公告)日：2003-10-28
申请号：US10196145
申请日：2002-07-17
申请人： Masayuki Saeki , Hironori Oikawa , Takeshi Hizono
发明人： Masayuki Saeki , Hironori Oikawa , Takeshi Hizono
IPC分类号： H05K720
CPC分类号： G06F1/20 , G06F2200/201
摘要： In an information processing apparatus with a cooling structure using a heat transport measure such as a heat pipe and a liquid-cooling system, a heat radiation unit has reduced thickness and noise and an improved efficiency. Heat generated by a CPU is transmitted through a heat receiving header and a flexible tube to the heat radiation unit by liquid coolant transported by a pump. The heat radiation unit comprises a propeller, a wall surface in contact with the propeller, and a cooling pipe spirally wound around a propeller shaft in a plane perpendicular to the propeller shaft. Hot coolant is circulated so as to enter the central portion of the cooling pipe and to be discharged from the outer peripheral portion of the pipe. The cooling air from the propeller is made to flow from the central portion of the cooling pipe toward its peripheral portion. The cooling pipe is thermally connected to the wall surface so that the wall surface works as a heat spreader.
摘要翻译：在具有使用诸如热管和液冷系统之类的传热措施的冷却结构的信息处理设备中，散热单元具有减小的厚度和噪声并提高效率。由CPU产生的热量通过由泵输送的液体冷却剂通过热接收头和柔性管传递到散热单元。散热单元包括螺旋桨，与螺旋桨接触的壁表面，以及在与螺旋桨轴垂直的平面中螺旋地缠绕在传动轴上的冷却管。热冷却剂循环进入冷却管的中心部分并从管的外周部排出。来自螺旋桨的冷却空气从冷却管的中心部分向其周边部分流动。冷却管与壁面热连接，使得壁面作为散热器工作。

5. 发明授权

US06778394B2 Electronic device having a heat dissipation member 有权
标题翻译：具有散热构件的电子装置
公开(公告)号：US06778394B2
公开(公告)日：2004-08-17
申请号：US10414152
申请日：2003-04-16
申请人： Hironori Oikawa , Takeshi Hizono , Katsuya Sato
发明人： Hironori Oikawa , Takeshi Hizono , Katsuya Sato
IPC分类号： H05K720
CPC分类号： H05K7/20154 , F28D15/0266 , F28F3/12
摘要： In order to efficiently cool highly heat generating components mounted on an electronic device, it is necessary to provide a large heat sink, which is the heat dissipation member, and this entails the problem of an enlarged device size and accordingly an increased installation space. A heat receiving member is attached to a heat generating component installed in a housing, a fan for discharging air within the housing out of the housing is attached on a part of a wall of the housing, a heat sink having a base and fins arranged on the base is attached opposite the fan on an outer face of the wall of the housing or protruding out of the wall with the fins facing the housing, and the heat sink and the heat receiving member are connected by heat transport means.
摘要翻译：为了有效地冷却安装在电子设备上的高发热元件，需要提供作为散热构件的大型散热器，这就造成设备尺寸增大，安装空间增大的问题。将热接收部件安装在安装在壳体中的发热部件上，将壳体内的空气排出外壳的风扇安装在壳体的壁的一部分上，散热器具有基部和翅片，该散热器布置在基座与壳体的外壁上的风扇相对地安装，或者突出到壁的外面，翅片面向壳体，散热器和热接收构件通过热传递装置连接。

6. 发明授权

US09812676B2 Prismatic secondary battery 有权
公开(公告)号：US09812676B2
公开(公告)日：2017-11-07
申请号：US14422938
申请日：2012-08-31
申请人： Kouichi Kajiwara , Hayato Koguchi , Takeshi Hizono , Hiroaki Egawa
发明人： Kouichi Kajiwara , Hayato Koguchi , Takeshi Hizono , Hiroaki Egawa
IPC分类号： H01M2/02 , H01M2/04 , H01M10/04 , H01M10/0587
CPC分类号： H01M2/024 , H01M2/0217 , H01M2/0426 , H01M2/0439 , H01M2/0473 , H01M10/0431 , H01M10/0587 , H01M2220/20
摘要： A prismatic secondary battery includes a battery case in a prismatic shape and a battery cover which seals up an opening part of the battery case. The battery cover has a convex part which projects toward the inside of the battery case, faces an inner surface of a side wall part of the battery case, and extends continuously along the entire periphery of the side wall part. Cover thickness of a contact part of the battery cover which is in contact with the upper end of the side wall part of the battery case at a position outside the convex part is greater than ½ of cover thickness of a blockage part blocking up an opening part at a position inside the convex part and is less than the cover thickness of the blockage part.

7. 发明申请

US20090133852A1 COOLING APPARATUS FOR ELECTRONIC EQUIPMENT 审中-公开
标题翻译：电子设备冷却装置
公开(公告)号：US20090133852A1
公开(公告)日：2009-05-28
申请号：US12260110
申请日：2008-10-29
申请人： Kenji Ogiro , Nobuo Masuoka , Takeshi Hizono , Kenichi Shiode
发明人： Kenji Ogiro , Nobuo Masuoka , Takeshi Hizono , Kenichi Shiode
IPC分类号： F28F7/00 , H05K7/20
CPC分类号： H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： A cooling apparatus for use in electronic equipment, being small in sizes and simple in the structures thereof, for achieving an increasing cooling capacity, comprises: a heat receiving member, which is thermally connected with a heat generating body, and which is configured to receive heat by means of a coolant flowing within an inside thereof; and a heat radiating member, which is configured to radiate the heat received within the heat receiving member, wherein the heat receiving member has a plate-like heat receiving base body, which is thermally connected with the heat generating body, and a heat receiving case body, which covers over the heat receiving base body, wherein the body members are joined with, so as to define a sealed space for running the coolant therein. The heat receiving base body is a plate-like member, being made of a metallic material, and being formed with fins, as a unit, for building up flow passages of the coolant, on a plane thereof on a side opposite to a plane, which is thermally connected with the heat generating body. The heat receiving case body is formed with a flow inlet and a flow outlet for running the coolant therein and out, on an upper surface or a side surface thereof, and a plural number of flange-like attaching portions extending nearly perpendicular to the side surface at a lower end portion of the side surface, as a unit. And, the heat receiving member is held opposite to the heat generating body of the electronic equipment, and is thermally connected with the heat generating body, by pressing the heat receiving member onto the heat generating body through an elastic deformation within the attaching portions of the heat receiving case body and the heat receiving case body, thereby achieving the thermal connection therebetween.
摘要翻译：一种用于电子设备的冷却装置，尺寸小，结构简单，用于实现增加的冷却能力，包括：热接收构件，其与发热体热连接，并且被配置为接收通过在其内部流动的冷却剂进行加热; 以及散热构件，其被配置为辐射接收在所述受热构件内的热量，其中所述受热构件具有与所述发热体热连接的板状受热基体和热接收壳体主体，其覆盖在受热基体上，其中主体构件接合，以便限定用于在其中运行冷却剂的密封空间。受热基体是由金属材料制成的板状构件，并且在与平面相反的一侧的平面上形成有用于构成冷却剂的流路的单元的翅片，其与发热体热连接。热接收壳体形成有流入口和流出口，用于使其中的冷却剂在其上表面或侧表面上移出，并且多个凸缘状的附接部分几乎垂直于侧表面延伸在侧面的下端部，作为一个单元。并且，受热构件与电子设备的发热体相对地保持，并且与发热体热连接，通过在发热体的附接部分内的弹性变形将热接收构件压在发热体上热接收壳体和热接收壳体，从而实现其间的热连接。

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