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    • 1. 发明授权
    • Image sensor and image sensing system including the same
    • 图像传感器和图像传感系统包括相同的
    • US08487351B2
    • 2013-07-16
    • US12591632
    • 2009-11-25
    • Kyung Ho LeeDong-Yoon JangJung Chak AhnMoo Sup LimYong Jei LeeJong Eun Park
    • Kyung Ho LeeDong-Yoon JangJung Chak AhnMoo Sup LimYong Jei LeeJong Eun Park
    • H01L27/148
    • H01L27/14623H01L27/14621H01L27/14627H01L27/1464H01L27/14643
    • The image sensor and an image sensing system including the same are provided. The image sensor includes a semiconductor substrate, a pixel array formed at a pixel area located in the semiconductor substrate and comprising a plurality of photoelectric converts, a plurality of driver circuits formed at a circuit area defined in the semiconductor substrate. The image sensor includes at least one heat blocker or heat shield. The at least one heat blocker may be formed between the pixel area and the circuit area in the semiconductor substrate. The heat blocker or heat shield may block or dissipate heat generated at the circuit area from being transferred to the pixel area through the semiconductor substrate. The heat blocker or heat shield may be used in image sensors using a back-side illumination sensor (BIS) structure or image sensors using a silicon on insulator (SOI) semiconductor substrate.
    • 提供了图像传感器和包括其的图像感测系统。 图像传感器包括半导体衬底,形成在位于半导体衬底中的像素区域并包括多个光电转换器的像素阵列,形成在半导体衬底中限定的电路区域的多个驱动电路。 图像传感器包括至少一个阻热器或隔热罩。 可以在像素区域和半导体衬底中的电路区域之间形成至少一个热阻挡器。 热阻挡器或隔热罩可以阻挡或消散在电路区域产生的热量,以通过半导体衬底传送到像素区域。 使用背面照明传感器(BIS)结构的图像传感器或使用绝缘体上硅(SOI)半导体衬底的图像传感器)可以使用热阻挡器或隔热罩。
    • 6. 发明授权
    • Three-dimensional image sensor and mobile device including same
    • 三维图像传感器和包括其的移动设备
    • US09041916B2
    • 2015-05-26
    • US13615860
    • 2012-09-14
    • Min Seok OhHae Kyung KongTae Chan KimJung Chak AhnMoo Sup Lim
    • Min Seok OhHae Kyung KongTae Chan KimJung Chak AhnMoo Sup Lim
    • H04N13/02H01L27/146H04N5/3745G01S7/486
    • H04N13/271G01S7/4863H01L27/14656H04N5/37452
    • A 3D image sensor includes a depth pixel that includes; a photo detector generating photo-charge, first and second floating diffusion regions, a first transfer transistor transferring photo-charge to the first floating diffusion region during a first transfer period in response to a first transfer gate signal, a second transfer transistor transferring photo-charge to the second floating diffusion region during a second transfer period in response to a second transfer gate signal, and an overflow transistor that discharges surplus photo-charge in response to a drive gate signal. Control logic unit controlling operation of the depth pixel includes a first logic element providing the first transfer gate signal, a second logic element providing the second transfer gate signal, and another logic element providing the drive gate signal to the overflow transistor when the first transfer period overlaps, at least in part, the second transfer period.
    • 3D图像传感器包括深度像素,其包括: 产生光电荷,第一和第二浮动扩散区域的光电检测器,响应于第一传输栅极信号在第一传输周期期间将光电荷传输到第一浮动扩散区域的第一传输晶体管, 响应于第二传输门信号在第二传送周期期间向第二浮动扩散区域充电;以及溢流晶体管,其响应于驱动栅极信号而放电剩余的光电荷。 控制逻辑单元控制深度像素的操作包括提供第一传输门信号的第一逻辑元件,提供第二传输门信号的第二逻辑元件,以及当第一传输周期提供驱动栅信号给溢出晶体管时的另一逻辑元件 至少部分地与第二转移期重叠。