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1. 发明授权

US08008767B2 Semiconductor device 失效
标题翻译：半导体器件
公开(公告)号：US08008767B2
公开(公告)日：2011-08-30
申请号：US12094775
申请日：2007-09-05
申请人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
发明人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
IPC分类号： H01L23/18 , H01L23/498
CPC分类号： H01L21/563 , H01L23/145 , H01L23/498 , H01L23/49894 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/3011 , H05K1/0271 , H05K3/305 , H05K3/4602 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes.
摘要翻译：本发明提供了用于抑制由于温度变化引起的半导体器件损坏的技术。当将硅芯片倒装安装在具有减薄芯的结构的积层型多层基板上时，在多层基板中使用具有小的热膨胀系数的芯，并且热膨胀系数和玻璃化转变点底部填充物根据芯的厚度和热膨胀系数进行适当设计。通过这样做，可以减轻由于温度变化而导致的多层基板的变形引起的半导体封装内的应力，从而抑制由于温度变化导致的半导体封装的损坏。

2. 发明申请

US20090267212A1 Semiconductor Device 失效
标题翻译：半导体器件
公开(公告)号：US20090267212A1
公开(公告)日：2009-10-29
申请号：US12094775
申请日：2007-09-05
申请人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
发明人： Masahiro Wada , Hiroyuki Tanaka , Hiroshi Hirose , Teppei Itoh , Kenya Tachibana
IPC分类号： H01L23/18 , H01L23/498
CPC分类号： H01L21/563 , H01L23/145 , H01L23/498 , H01L23/49894 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01019 , H01L2924/0102 , H01L2924/01057 , H01L2924/01078 , H01L2924/01079 , H01L2924/10253 , H01L2924/3011 , H05K1/0271 , H05K3/305 , H05K3/4602 , H01L2924/00 , H01L2924/014 , H01L2224/0401
摘要： The invention offers technology for suppressing damage to semiconductor devices due to temperature changes. When flip-chip mounting a silicon chip on a buildup type multilayer substrate having a structure with a thinned core, a core having a small coefficient of thermal expansion is used in the multilayer substrate, and the coefficient of thermal expansion and glass transition point of the underfill are appropriately designed in accordance with the thickness and coefficient of thermal expansion of the core. By doing so, it is possible to relieve stresses inside the semiconductor package caused by deformation of the multilayer substrate due to temperature changes, and thereby to suppress damage to the semiconductor package due to temperature changes.
摘要翻译：本发明提供了用于抑制由于温度变化引起的半导体器件损坏的技术。当将硅芯片倒装安装在具有减薄芯的结构的积层型多层基板上时，在多层基板中使用具有小的热膨胀系数的芯，并且热膨胀系数和玻璃化转变点底部填充物根据芯的厚度和热膨胀系数进行适当设计。通过这样做，可以减轻由于温度变化而导致的多层基板的变形引起的半导体封装内的应力，从而抑制由于温度变化导致的半导体封装的损坏。

3. 发明申请

US20080036097A1 SEMICONDUCTOR PACKAGE, METHOD OF PRODUCTION THEREOF AND ENCAPSULATION RESIN 审中-公开
标题翻译：半导体封装，其生产方法和封装树脂
公开(公告)号：US20080036097A1
公开(公告)日：2008-02-14
申请号：US11835774
申请日：2007-08-08
申请人： Teppei Ito , Masahiro Wada , Hiroshi Hirose
发明人： Teppei Ito , Masahiro Wada , Hiroshi Hirose
IPC分类号： H01L23/29 , H01L21/58 , H01L23/48
CPC分类号： H01L21/563 , C08L63/00 , H01L23/293 , H01L24/31 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2224/83951 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01009 , H01L2924/01011 , H01L2924/01012 , H01L2924/01013 , H01L2924/01015 , H01L2924/0102 , H01L2924/01023 , H01L2924/01027 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01038 , H01L2924/01041 , H01L2924/01047 , H01L2924/0105 , H01L2924/01056 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01087 , H01L2924/10253 , H01L2924/181 , H01L2924/351 , H01L2924/00 , H01L2924/3512
摘要： A flip-chip semiconductor package and method of manufacture thereof, the flip-chip semiconductor being highly reliable due to suppression of cracking. The flip-chip semiconductor package is formed by flip-chip bonding of a semiconductor chip-connecting electrode surface of a circuit board 1 and an electrode surface of a semiconductor chip 2, dispensing of an encapsulation resin 4 between the circuit board 1 and the semiconductor chip 2, and formation of fillet 4b by providing the encapsulation resin 4 on peripheral side portions of the semiconductor chip, the fillet 4b having inclined surfaces extending from upper edges 2a of the peripheral side portions of the semiconductor chip 2 outward toward the circuit board, wherein the angle of inclination formed between the inclined surfaces and the peripheral side portions of the semiconductor chip 2 is 50 degrees or less in the vicinity of the upper edges of the peripheral side portions 2a of the semiconductor chip.
摘要翻译：一种倒装芯片半导体封装及其制造方法，由于抑制裂纹，倒装芯片半导体是高度可靠的。倒装芯片半导体封装通过电路板1的半导体芯片连接电极表面和半导体芯片2的电极表面的倒装焊接形成，在电路板1和半导体芯片2之间分配封装树脂4 芯片2，并通过在半导体芯片的周边部分上设置密封树脂4形成圆角4b，圆角4b具有从半导体芯片2的周边侧部分的上边缘2a向外延伸的倾斜表面电路基板，其中，所述半导体芯片2的所述倾斜面与所述周边侧部之间形成的倾斜角在所述半导体芯片的周边部2a的上边缘附近为50度以下。

4. 发明授权

US07859110B2 Solder resist material, wiring board using the solder resist material, and semiconductor package 有权
标题翻译：阻焊材料，使用阻焊材料的接线板和半导体封装
公开(公告)号：US07859110B2
公开(公告)日：2010-12-28
申请号：US12298706
申请日：2007-04-26
申请人： Kensuke Nakamura , Hiroshi Hirose
发明人： Kensuke Nakamura , Hiroshi Hirose
IPC分类号： H01L21/00
CPC分类号： H05K3/281 , B32B3/263 , B32B5/022 , B32B5/024 , B32B27/10 , B32B27/12 , B32B27/18 , B32B27/20 , B32B27/28 , B32B27/38 , B32B2260/021 , B32B2260/028 , B32B2260/046 , B32B2262/0238 , B32B2262/0246 , B32B2262/0253 , B32B2262/0261 , B32B2262/0276 , B32B2262/0292 , B32B2262/101 , B32B2307/30 , B32B2307/306 , B32B2307/3065 , B32B2307/308 , B32B2307/402 , B32B2307/50 , B32B2307/718 , B32B2457/08 , C08G2650/56 , C08L63/00 , C08L65/00 , C08L71/00 , H05K1/0269 , H05K2201/0191 , H05K2201/0195 , H05K2203/161 , Y10T428/24612 , Y10T428/2495 , Y10T428/31504 , Y10T428/31511 , Y10T428/31525 , C08L2666/14
摘要： The present invention provides a solder resist material, which can suppress the warpage of a semiconductor package upon exposure to heat or impact even when used in a thin wiring board and meets a demand for size reduction in electronic devices and a higher level of integration, and a wiring board comprising the solder resist material and a semiconductor package. The solder resist material of the present invention can effectively suppress the warpage of a semiconductor package through a fiber base material-containing layer interposed between resin layers. The fiber base material-containing layer is preferably unevenly distributed in the thickness direction of the solder resist material.
摘要翻译：本发明提供一种阻焊材料，其即使在薄的布线板中使用也能够抑制暴露于热或冲击时的半导体封装的翘曲，并且满足电子器件的尺寸减小和更高的集成度的需求，以及包括阻焊材料和半导体封装的布线板。本发明的阻焊材料能够有效地抑制通过设置在树脂层之间的含有纤维基材的层的半导体封装的翘曲。含有纤维基材的层优选在阻焊材料的厚度方向上不均匀地分布。

5. 发明申请

US20090215943A1 EPOXY RESIN COMPOSITION AND SEMICONDUCTOR DEVICE 失效
标题翻译：环氧树脂组合物和半导体器件
公开(公告)号：US20090215943A1
公开(公告)日：2009-08-27
申请号：US12088053
申请日：2006-09-27
申请人： Hiroshi Hirose , Hideaki Sasajima , Hitoshi Kawaguchi
发明人： Hiroshi Hirose , Hideaki Sasajima , Hitoshi Kawaguchi
IPC分类号： C08K3/38 , C08L63/00 , C08K3/10
CPC分类号： H01L23/293 , C08G59/32 , C08G59/4014 , C08G59/62 , H01L2924/0002 , H01L2924/00
摘要： There are provided an epoxy resin composition exhibiting less warpage after molding and during a solder treatment process as well as during a low temperature process of, for example, a temperature cycle test, and excellent in flame retardancy, solder crack resistance, and flowability; and a semiconductor device using the same. The epoxy resin composition used in the semiconductor device contains at least one type of epoxy resin (A) selected from a trifunctional epoxy resin and a tetrafunctional epoxy resin, a curing agent (B) having at least two hydroxyl groups per molecule, a compound (C) having at least two cyanate groups per molecule, and an inorganic filler (D), as essential components.
摘要翻译：提供了在成型后和焊接处理过程中以及在例如温度循环试验的低温过程中表现出较小的翘曲性，阻燃性，耐焊料龟裂性和流动性优异的环氧树脂组合物。以及使用该半导体装置的半导体装置。在半导体装置中使用的环氧树脂组合物含有选自三官能环氧树脂和四官能环氧树脂中的至少一种环氧树脂（A），每分子具有至少两个羟基的固化剂（B），化合物 C）每分子具有至少两个氰酸酯基，和无机填料（D）作为必需组分。

6. 发明授权

US07442729B2 Composition of epoxy resin, polyphenolic compound and trisubstituted phosphonionphenolate salt 失效
标题翻译：环氧树脂，多酚化合物和三取代膦酸酯盐的组成
公开(公告)号：US07442729B2
公开(公告)日：2008-10-28
申请号：US11410266
申请日：2006-04-25
申请人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
发明人： Akiko Okubo , Yoshiyuki Goh , Yoshihito Akiyama , Hiroshi Hirose , Hirotaka Nonaka , Maki Sugawara
IPC分类号： C08K3/36 , C08L63/02 , C08L63/04
CPC分类号： H01L23/293 , C07F9/5442 , C08G59/688 , C08K5/50 , C08L63/00 , C08L85/00 , H01L2924/0002 , Y10T428/31511 , C08L2666/22 , H01L2924/00
摘要： A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy groups in one molecule, a compound (B) having two or more phenolic hydroxyl groups in one molecule, trisubstituted phosphoniophenolate or a salt thereof as a curing accelerator (C), and an inorganic filler (D).
摘要翻译：提供了适用于各种固化性树脂组合物的固化促进剂，具有优异的固化性，保存稳定性和流动性的环氧树脂组合物，以及具有优异的耐焊料龟裂性和耐湿可靠性的半导体装置。环氧树脂组合物包括一分子中具有两个以上环氧基的化合物（A），一分子中具有2个以上酚羟基的化合物（B），作为固化促进剂（C）的三取代膦酰基酚盐或其盐，和无机填料（D）。

7. 发明授权

US5770861A Apparatus for working a specimen 失效
标题翻译：用于加工样品的装置
公开(公告)号：US5770861A
公开(公告)日：1998-06-23
申请号：US733839
申请日：1996-10-18
申请人： Hiroshi Hirose , Setsuo Nomura
发明人： Hiroshi Hirose , Setsuo Nomura
IPC分类号： C23F4/02 , H01J37/305 , H01L21/302 , H01L21/3065 , H01J37/26
CPC分类号： H01J37/3056 , H01J2237/28 , H01J2237/31745
摘要： An apparatus for producing a highly accurate three-dimensional image of a solid in the micro order is provided. The apparatus is composed of an ion column, an electron column, a specimen chamber, a specimen stage, a diluent gas ion column, a control system, and so on. The apparatus has the following advantages: (1) correct three-dimensional information can be provided even if a specimen is composed of composite materials; (2) since a worked dimension can be accurately measured, highly accurate three-dimensional observation can be achieved in the micron order; (3) since a plurality of images can be stored for an observed surface, a plurality of three-dimensional images can be produced from a single specimen; and (4) since a side entry stage is employed as a specimen stage, a working column and an observation column can be positioned close to a specimen, so that beams from the respective columns can be well converged, thus making it possible to produce highly accurate three-dimensional images.
摘要翻译：提供了一种用于以微观顺序制造固体的高精度三维图像的装置。该装置由离子柱，电子柱，样品室，样品台，稀释气体离子柱，控制系统等组成。该设备具有以下优点：（1）即使样品由复合材料组成，也可提供正确的三维信息; （2）由于可以精确地测量加工尺寸，可以以微米级获得高精度的三维观察; （3）由于可以存储观察表面的多个图像，所以可以从单个样本产生多个三维图像; 和（4）由于采用侧进入台作为试样台，所以可以将工作柱和观察柱定位在靠近试样的位置，从而能够使来自各列的梁良好地会聚，从而能够高度地准确的三维图像。

8. 发明授权

US5646403A Scanning electron microscope 失效
标题翻译：扫描电子显微镜
公开(公告)号：US5646403A
公开(公告)日：1997-07-08
申请号：US540032
申请日：1995-10-06
申请人： Futoshi Mori , Kazuhiko Fukazawa , Hiroshi Hirose , Yoshiaki Kohama
发明人： Futoshi Mori , Kazuhiko Fukazawa , Hiroshi Hirose , Yoshiaki Kohama
IPC分类号： H01J37/20 , H01J37/28
CPC分类号： H01J37/20 , H01J2237/20285 , H01J2237/28
摘要： A stage on which a sample is placed is driven through feed screws rotated by pulse motors which are controlled by a micro-step drive control method. Backlash quantities and feed screw pitch errors have previously been obtained and stored in a memory, and when the stage is to be driven, a stage controller corrects the backlash and pitch errors.
摘要翻译：通过由微步驱动控制方法控制的脉冲电机旋转的进给螺杆驱动放置样品的阶段。之前已经获得了间隙数量和进给螺杆螺距误差并将其存储在存储器中，并且当级被驱动时，级控制器校正齿隙和螺距误差。

9. 发明授权

US5484140A Catch type sheet tray for an image forming apparatus 失效
标题翻译：用于图像形成装置的捕捉型纸盘
公开(公告)号：US5484140A
公开(公告)日：1996-01-16
申请号：US149560
申请日：1993-11-09
申请人： Hiroshi Hirose , Kenji Hiratani , Masashi Kimijima
发明人： Hiroshi Hirose , Kenji Hiratani , Masashi Kimijima
IPC分类号： B65H31/22 , G03G15/00 , H04N1/00 , B65H31/00
CPC分类号： G03G15/6552 , B65H31/22 , H04N1/0057 , H04N1/00591 , H04N1/00602 , H04N1/00612 , H04N1/00633 , G03G2215/00421
摘要： A catch type sheet tray for accommodating sheets sequentially driven out of an image forming apparatus by catching the leading edges of the sheets. The tray has a transport unit for transporting the sheet driven out through the outlet downward. A holder receives the sheet conveyed by the transport unit by catching the leading edge of the sheet while causing the trailing edge of the sheet to hand down to the outside. A mounting section mounts the transport unit on a portion of the apparatus from which the horizontal tray has been removed. The catch type tray is mounted on the apparatus in place of the horizontal tray.
摘要翻译：一种卡扣式纸张托盘，用于通过抓住纸张的前缘来容纳顺序地从图像形成装置驱动的纸张。托盘具有用于运送通过出口向下驱动的片材的运送单元。保持器通过抓住片材的前缘同时使片材的后缘向下移动到外部而接收由传送单元传送的片材。安装部分将运输单元安装在已经从其移除水平托盘的设备的一部分上。捕捉式托盘代替水平托盘安装在设备上。

10. 发明授权

US4602778A Copying machine equipped with a correction apparatus for draft 失效
标题翻译：复印机装备有用于吃水的校正装置
公开(公告)号：US4602778A
公开(公告)日：1986-07-29
申请号：US692491
申请日：1985-01-18
申请人： Hiroshi Hirose , Tokuzo Kaneda , Tomio Sasaki , Kunio Hibi , Hitoshi Hoshi
发明人： Hiroshi Hirose , Tokuzo Kaneda , Tomio Sasaki , Kunio Hibi , Hitoshi Hoshi
IPC分类号： B65H9/00 , G03B27/62 , B65H7/02
CPC分类号： G03B27/625 , B65H9/00
摘要： A copying machine which takes copies of a draft sheet by slit exposure while it is being conveyed. This copying machine includes a draft correction apparatus. This draft correction apparatus is provided with holding bars attached to a copying machine body so as to turn round the center line of a convey way for the draft, a pair of curved guide plates leaving therebetween a distance sufficient for forming a curved convey way constituting a part of said convey way, at least a pair of solenoids which are attached to the copying machine body on both sides of the draft convey way for turning said holding bars, draft sensors which are provided corresponding to said solenoids on both sides of the center line of the draft convey way this side of the solenoids, and a control means which inputs detection signals from the draft sensors and outputs working signals corresponding thereto against solenoids.
摘要翻译：一种复印机，其在传送时通过狭缝曝光来接受稿纸的副本。该复印机包括一个草稿修正装置。该牵伸修正装置具有附接到复印机主体的保持杆，以便绕着用于牵伸的输送方式的中心线转动，一对弯曲的导向板离开它们之间的距离足以形成构成弯曲的输送方式所述传送方式的一部分，至少一对螺线管，其在用于转动所述保持杆的通气道两侧的复印机主体上，在中心线的两侧对应于所述螺线管设置的通风传感器输送方式为螺线管的这一侧，以及控制装置，其输入来自牵伸传感器的检测信号，并输出与螺线管对应的工作信号。

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