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1. 发明授权

US06486543B1 Packaged semiconductor device having bent leads 有权
标题翻译：具有弯曲引线的封装半导体器件
公开(公告)号：US06486543B1
公开(公告)日：2002-11-26
申请号：US09700631
申请日：2000-11-17
申请人： Masashi Sano , Nobuaki Suzuki , Shinishi Suzuki
发明人： Masashi Sano , Nobuaki Suzuki , Shinishi Suzuki
IPC分类号： H01L2306
CPC分类号： H01L33/486 , H01L21/565 , H01L23/3107 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/97 , H01L33/62 , H01L2224/32245 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/85181 , H01L2224/97 , H01L2924/00014 , H01L2924/01039 , H01L2924/01079 , H01L2924/12041 , H01L2924/12043 , H01L2924/13055 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor device (X1) including a semiconductor chip (3), a first lead (1) connected to an electrode of the semiconductor chip (3), a second lead (2) connected to another electrode of the semiconductor chip (3), and a resin package (4) sealing the semiconductor chip (3), an inner terminal (10) of the first lead (1), and an inner terminal (20) of the second lead (2). The resin package (4) includes a first to a fourth side surfaces (41-44), an upper surface (47) and a bottom surface (45). Each of the first and the second leads (1, 2) includes at least one outer terminal (11, 21) extending along the first side surface (41) and the bottom surface (45) of the resin package (4).
摘要翻译：一种半导体器件（X1），包括半导体芯片（3），连接到半导体芯片（3）的电极的第一引线（1），连接到半导体芯片（3）的另一个电极的第二引线（2）以及密封半导体芯片（3），第一引线（1）的内部端子（10）和第二引线（2）的内部端子（20）的树脂封装（4）。树脂封装（4）包括第一至第四侧表面（41-44），上表面（47）和底表面（45）。第一和第二引线（1,2）中的每一个包括沿树脂封装（4）的第一侧表面（41）和底表面（45）延伸的至少一个外部端子（11,21）。

2. 发明授权

US06677580B1 Photo-interrupter and semiconductor device using it 有权
标题翻译：光电断路器和使用它的半导体器件
公开(公告)号：US06677580B1
公开(公告)日：2004-01-13
申请号：US10089801
申请日：2002-04-04
申请人： Masashi Sano , Nobuaki Suzuki
发明人： Masashi Sano , Nobuaki Suzuki
IPC分类号： H01J4014
CPC分类号： H01L31/16 , H05K1/18 , H05K3/301
摘要： To provide a photo-interrupter which can anchor a light-emitting device and a light-receiving device to a concave case in an expensive configuration. The photo-interrupter (1) includes a light-emitting device (6) and a light-receiving device (7) each with a lens projected forward being housed oppositely to each other within an concave case (2) of an opaque resin mold. The sides of the lenses (6a) and (7a) of the light-emitting device (6) and the light-receiving device (7) are secured onto the end faces 5x and 5y of openings (5a) and (5b) formed on the opposite inner surfaces of the case (2). The left and right outer surfaces (2x) and (2y) of the case (2) are bent to form pressing portions (2u) and (2v) The backs of the light-emitting device (6) and the light-receiving device (7) are pressed by the pressing portions so that they are anchored to the case (2).
摘要翻译：为了提供一种能够以昂贵的配置将发光装置和光接收装置固定到凹形盒的光断续器。光断续器（1）包括发光装置（6）和光接收每个具有向前突出的透镜的装置（7）彼此相对容纳在不透明树脂模具的凹形壳体（2）内。发光装置（6）和光接收装置（7）的透镜（6a）和（7a）的侧面被固定到形成在其上的开口（5a）和（5b）的端面5x和5y上壳体（2）的相对的内表面。弯曲外壳（2）的左右外表面（2x）和（2y）以形成按压部分（2u）和（2v）。发光装置（6）和光接收装置 7）被按压部按压使其固定在壳体（2）上。

3. 发明授权

US06596986B1 Reflective sensor 有权
标题翻译：反光传感器
公开(公告)号：US06596986B1
公开(公告)日：2003-07-22
申请号：US09700634
申请日：2000-11-16
申请人： Masashi Sano , Nobuaki Suzuki , Shinichi Suzuki
发明人： Masashi Sano , Nobuaki Suzuki , Shinichi Suzuki
IPC分类号： H01I502
CPC分类号： H01L31/0203 , H01L31/125 , H01L31/167 , H01L2224/48091 , H01L2224/48247 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00012
摘要： A reflection sensor (1) for detecting presence of a detection object is provided. The reflection sensor comprises a light emitting element (31), a light receiving element (32) cooperative with the light emitting element, a first resin body (21) enclosing the light emitting element and including a first surface and a second surface away from the first surface, a second resin body (22) enclosing the light receiving element and including a third surface and a fourth surface away from the third surface, and a third resin body (25) holding the first and the second resin bodies. The reflection sensor further comprises a first pair of leads (5a, 5b) electrically connected to the light emitting element via a wire (4a) for example, and a second pair of leads (5c, 5d) electrically connected to the light receiving element via another wire (4b) for example. The leads of the first pair and the second pair extend out of one side surface (2a) or another side surface (2b) of the third resin body. The leads of the first pair and the second pair have respective free end portions (51a, 51b, 51c, 51d) connected to connecting pads P on a substrate S via solder H. The first resin body and the second resin body have respective upper surfaces and bottom surfaces exposed to outside.
摘要翻译：提供一种用于检测检测对象的存在的反射传感器（1）。反射传感器包括发光元件（31），与发光元件配合的光接收元件（32），包围发光元件的第一树脂体（21），并且包括第一表面和远离该发光元件的第二表面第一树脂体，第二树脂体和第三树脂体，第二树脂体包围光接收元件，第二树脂体包括第三表面和离开第三表面的第四表面;第三树脂体，保持第一和第二树脂体。反射传感器还包括经由导线（4a）例如电连接到发光元件的第一对引线（5a，5b）和与光接收元件电连接的第二对引线（5c，5d）另一根线（4b）例如。第一对和第二对的引线从第三树脂体的一个侧表面（2a）或另一个侧表面（2b）延伸出来。第一对和第二对的引线具有经由焊料H连接到基板S上的连接焊盘P的各自自由端部（51a，51b，51c，51d）。第一树脂体和第二树脂体具有各自的上表面底面暴露在外面。

4. 发明授权

US06344689B1 Optical semiconductor device for surface mounting 失效
标题翻译：用于表面安装的光学半导体器件
公开(公告)号：US06344689B1
公开(公告)日：2002-02-05
申请号：US09680444
申请日：2000-10-06
申请人： Nobuaki Suzuki , Masashi Sano , Shinichi Suzuki
发明人： Nobuaki Suzuki , Masashi Sano , Shinichi Suzuki
IPC分类号： H01L2312
CPC分类号： H01L33/486 , H01L31/02005 , H01L31/0203 , H01L33/62 , H01L2924/0002 , H05K3/3426 , Y02P70/613 , H01L2924/00
摘要： An optical semiconductor device for surface mounting includes a semiconductor chip having a light emitting function or a light receiving function and two electrodes of the semiconductor chip sealed into a light-permeable resin package. The electrodes have tip surfaces externally exposed from the sides at the four corners of the resin package. The tip surfaces 4 of the electrodes are located on only the sides 4a of the resin package, but not located on the bottom thereof. In this configuration, when the optical semiconductor device for surface mounting is arranged on the solder paste on a board, its stand-up due to the contraction of the solder paste after the reflow can be avoided.
摘要翻译：用于表面安装的光学半导体器件包括具有发光功能或光接收功能的半导体芯片以及密封在透光树脂封装中的半导体芯片的两个电极。电极具有从树脂封装的四个角处从侧面向外露出的尖端表面。电极的前端表面4仅位于树脂封装的侧面4a上，但不位于其底部。在这种结构中，当将用于表面安装的光学半导体器件布置在板上的焊膏上时，可以避免由于焊料在回流之后的收缩而引起的立起。

5. 发明授权

US06927486B2 Photo-interrupter and semiconductor device using the same 有权
标题翻译：光电断路器和使用其的半导体器件
公开(公告)号：US06927486B2
公开(公告)日：2005-08-09
申请号：US10630657
申请日：2003-07-31
申请人： Masashi Sano , Nobuaki Suzuki
发明人： Masashi Sano , Nobuaki Suzuki
IPC分类号： G02B27/00 , H01J5/02 , H01J40/14 , H01L23/48 , H01L23/52 , H01L27/15 , H01L31/0203 , H01L31/12 , H01L31/16 , H05K1/18 , H05K3/30
CPC分类号： H01L31/16 , H05K1/18 , H05K3/301
摘要： To provide a photo-interrupter which can anchor a light-emitting device and a light-receiving device to a concave case in an expensive configuration.The photo-interrupter (1) includes a light-emitting device (6) and a light-receiving device (7) each with a lens projected forward being housed oppositely to each other within an concave case (2) of an opaque resin mold. The sides of the lenses (6a) and (7a) of the light-emitting device (6) and the light-receiving device (7) are secured onto the end faces 5x and 5y of openings (5a) and (5b) formed on the opposite inner surfaces of the case (2). The left and right outer surfaces (2x) and (2y) of the case (2) are bent to form pressing portions (2u) and (2v). The backs of the light-emitting device (6) and the light-receiving device (7) are pressed by the pressing portions so that they are anchored to the case (2).
摘要翻译：提供一种能够以昂贵的结构将发光装置和光接收装置固定在凹形外壳上的光电断路器。光断续器（1）包括发光装置（6）和光接收装置（7），每个发光装置（7）具有在不透明树脂模具的凹形壳体（2）内彼此相对地向前突出的透镜。发光装置（6）和光接收装置（7）的透镜（6a）和（7a）的侧面被固定到开口（5a）的端面5x和5y上（5b）形成在所述壳体（2）的相对的内表面上。壳体（2）的左右外表面（2 x）和（2 y）被弯曲以形成按压部分（2u）和（2v）。发光装置（6）和光接收装置（7）的背部被按压部按压，使得它们被固定到壳体（2）。

6. 发明授权

US06717256B1 Mounting structure for semiconductor device having entirely flat leads 有权
标题翻译：具有完全扁平引线的半导体器件的安装结构
公开(公告)号：US06717256B1
公开(公告)日：2004-04-06
申请号：US09763573
申请日：2001-02-26
申请人： Shinichi Suzuki , Nobuaki Suzuki , Masashi Sano
发明人： Shinichi Suzuki , Nobuaki Suzuki , Masashi Sano
IPC分类号： H01L2352
CPC分类号： H01L33/62 , H01L24/97 , H01L33/54 , H01L2224/32245 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/73265 , H01L2224/78301 , H01L2224/85181 , H01L2224/92247 , H01L2224/97 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01074 , H01L2924/01082 , H01L2924/12041 , H01L2924/1815 , H01L2924/3025 , H01S5/02216 , H01S5/02244 , H01S5/02288 , H01S5/183 , H01L2924/00014 , H01L2224/85 , H01L2924/00012 , H01L2924/00
摘要： The semiconductor device (A) comprises a semiconductor chip (3), a protective package (4) covering the semiconductor chip (3), a first lead (1), and a second lead (2). The semiconductor chip (3) is placed at an inner end (10a) of the first lead (1). Further, the semiconductor chip (3) is connected to an inner end (20a) of the second lead (2) via a wire (W). The first lead (1) includes an outer portion (11) extending out of the protective package (4) whereas the second lead (2) includes an outer portion (21) extending out of the protective package (4). These two outer portions (11, 21) are flat.
摘要翻译：半导体器件（A）包括半导体芯片（3），覆盖半导体芯片（3）的保护封装（4），第一引线（1）和第二引线（2）。半导体芯片（3）被放置在第一引线（1）的内端（10a）处。此外，半导体芯片（3）经由导线（W）连接到第二引线（2）的内端（20a）。第一引线（1）包括从保护封装（4）延伸出的外部部分（11），而第二引线（2）包括延伸出保护封装（4）的外部部分（21）。这两个外部部分（11,21）是平坦的。

7. 发明授权

US06603148B1 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US06603148B1
公开(公告)日：2003-08-05
申请号：US09701239
申请日：2000-11-27
申请人： Masashi Sano , Nobuaki Suzuki , Shinichi Suzuki
发明人： Masashi Sano , Nobuaki Suzuki , Shinichi Suzuki
IPC分类号： H01L3300
CPC分类号： H01L33/62 , H01L23/3107 , H01L24/48 , H01L31/0203 , H01L33/486 , H01L33/54 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2924/00014 , H01L2924/01029 , H01L2924/12041 , H01L2924/12043 , H01L2924/181 , H01L2924/1815 , H01L2924/3025 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207 , H01L2224/45099 , H01L2224/05599 , H01L2224/85399
摘要： A semiconductor device (A) includes a first lead (4) to which a semiconductor chip (1) is bonded, a second lead (5) connected to the semiconductor chip (1) via a wire (W), and a resin package (2) sealing the semiconductor chip (1) and the wire (W). Of the first and the second leads (4, 5), at least one of inner terminals (4a, 5b) enclosed in the resin package (2) is bent in a direction of a thickness of the resin package (2).
摘要翻译：半导体器件（A）包括与半导体芯片（1）接合的第一引线（4），经由线（W）连接到半导体芯片（1）的第二引线（5）和树脂封装 2）密封半导体芯片（1）和导线（W）。在第一和第二引线（4,5）中，封装在树脂封装（2）中的至少一个内部端子（4a，5b）在树脂封装（2）的厚度方向上弯曲。

8. 发明授权

US08529777B2 Method of making a mask, method of patterning by using this mask and method of manufacturing a micro-device 有权
标题翻译：制造掩模的方法，使用该掩模的图案化方法和制造微型器件的方法
公开(公告)号：US08529777B2
公开(公告)日：2013-09-10
申请号：US13230261
申请日：2011-09-12
申请人： Hisayoshi Watanabe , Hideyuki Yatsu , Takayuki Nishizawa , Masashi Sano , Hiromichi Umehara , Takayasu Kanaya , Tetsuji Hori
发明人： Hisayoshi Watanabe , Hideyuki Yatsu , Takayuki Nishizawa , Masashi Sano , Hiromichi Umehara , Takayasu Kanaya , Tetsuji Hori
IPC分类号： B44C1/22 , C03C15/00 , C03C25/68 , C23F1/00
CPC分类号： G11B5/3163
摘要： The present invention relates to a method of making a mask for patterning a thin film. The method includes a step of forming an inorganic material, which is resolvable into alkali solution, on a substrate; a step of forming the inorganic material in a predetermined pattern; and a step of narrowing the inorganic material with the alkali solution to form the mask.
摘要翻译：本发明涉及一种制造用于图案化薄膜的掩模的方法。该方法包括在基板上形成可分解成碱溶液的无机材料的步骤; 以预定图案形成无机材料的步骤; 以及用碱溶液使无机材料变窄以形成掩模的步骤。

9. 发明授权

US07983001B2 Slider mounted magnetic head having a perpendicular recording head with a main pole having a ruthenium(Ru) electrode film 有权
标题翻译：滑块安装磁头具有垂直记录头，其主极具有钌（Ru）电极膜
公开(公告)号：US07983001B2
公开(公告)日：2011-07-19
申请号：US11940772
申请日：2007-11-15
申请人： Makoto Sato , Atsushi Yamaguchi , Masashi Sano , Shingo Miyata , Kenzo Makino
发明人： Makoto Sato , Atsushi Yamaguchi , Masashi Sano , Shingo Miyata , Kenzo Makino
IPC分类号： G11B5/127
CPC分类号： G11B5/3116 , G11B5/1278 , G11B5/314 , G11B5/3163
摘要： The present invention relates to a perpendicular recording magnetic head. A main magnetic pole film includes an electrode film and a plated magnetic film. The electrode film includes a Ru film and a conductive magnetic film, and the Ru film, which follows the shape of an inner wall surface of a recess formed in a first non-magnetic film, is adhered to the inner wall surface of the recess or a surface of a second non-magnetic film adhered thereto. The conductive magnetic film is adhered to a surface of the Ru film, thereby following the shape of the inner wall surface of the recess. The plated magnetic film is disposed adjacent the conductive magnetic film, thereby filling up the recess.
摘要翻译：本发明涉及一种垂直记录磁头。主磁极膜包括电极膜和镀覆磁性膜。该电极膜包括Ru膜和导电磁性膜和Ru膜，它遵循形成在第一非磁性膜的凹部的内壁面的形状，附着于凹部的或内壁表面附着在其上的第二非磁性膜的表面。导电性磁性膜粘合到Ru膜的表面，由此跟随凹部的内壁表面的形状。电镀磁性膜与导电性磁性膜相邻配置，从而填充凹部。

10. 发明授权

US07508957B2 Method of registration of authorized agent information for a biometrics authentication device, authentication method for a biometrics authentication device, and biometrics authentication device 有权
标题翻译：用于生物特征认证装置的授权代理信息的注册方法，生物特征认证装置的认证方法和生物特征认证装置
公开(公告)号：US07508957B2
公开(公告)日：2009-03-24
申请号：US11169898
申请日：2005-06-30
申请人： Kiyotaka Awatsu , Takahiro Kudoh , Masashi Sano , Masanori Ohkoshi
发明人： Kiyotaka Awatsu , Takahiro Kudoh , Masashi Sano , Masanori Ohkoshi
IPC分类号： G06K9/00
CPC分类号： G06F21/34 , G06F21/32 , G07C9/00087
摘要： A biometrics authentication device uses biometrics information for individual authentication, and securely registers biometrics information for an authorized agent other than the principal. Biometrics information for the principal, registered in an IC card, is verified against biometrics information detected by a detection unit, and when biometrics authentication of the principal is satisfactory, biometrics information registration for an authorized agent is performed using the detection unit. Biometrics information for the authorized agent can be registered securely in the card in which is registered the biometrics information for the principal.
摘要翻译：生物特征认证设备使用生物特征信息进行个体认证，并且为委托人以外的授权代理安全地注册生物识别信息。根据检测单元检测到的生物特征信息，对登记在IC卡中的主体的生物特征信息进行验证，并且当主体的生物特征认证令人满意时，使用检测单元执行授权代理的生物特征信息登记。授权代理人的生物识别信息可以安全地登记在注册了委托人的生物识别信息的卡中。

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