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1. 发明申请

US20140335633A1 SEPARATION METHOD, COMPUTER STORAGE MEDIUM, AND SEPARATION SYSTEM 有权
标题翻译：分离方法，计算机存储介质和分离系统
公开(公告)号：US20140335633A1
公开(公告)日：2014-11-13
申请号：US14343598
申请日：2012-08-22
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： H01L21/66 , H01L21/67
CPC分类号： H01L22/12 , H01L21/02068 , H01L21/67017 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1911
摘要： A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.
摘要翻译：叠加的晶片在被加热的同时被分离成处理目标晶片和支撑晶片。然后，通过向处理目标晶片的接合表面上提供有机溶剂，去除处理目标晶片的接合表面上的粘合剂。然后，通过向处理目标晶片的接合表面供给乙酸，去除在处理目标晶片的接合表面上形成在预定图案上的氧化膜。然后，检查处理目标晶片的接合表面。然后，基于检查结果，去除处理目标晶片的接合面上的粘合剂，去除在处理对象晶片的接合面上形成在规定图案上的氧化膜。

2. 发明申请

US20140224414A1 JOINING METHOD AND JOINING SYSTEM 有权
标题翻译：加工方法和加工系统
公开(公告)号：US20140224414A1
公开(公告)日：2014-08-14
申请号：US14342704
申请日：2012-08-30
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： B32B38/10 , B32B38/00
CPC分类号： B32B38/10 , B32B37/12 , B32B38/0012 , B32B2457/14 , C09J5/00 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834 , Y10T156/14
摘要： The present disclosure is a joining method that joins a target substrate and a support substrate, wherein the method has: a joining operation that includes pressing and joining the target substrate and the support substrate by interposing an adhesive therebetween; and an adhesive removing operation that includes supplying a solvent of the adhesive to the outer adhesive that is the adhesive between the target substrate and the support substrate protruding in the joining operation from the outer lateral surface of the stacked substrate made by joining the target substrate and the support substrate, and to remove the surface of the outer adhesive so that the outer adhesive is formed at a predetermined size.
摘要翻译：本公开是连接目标基板和支撑基板的接合方法，其中，所述方法具有：连接操作，其包括通过在其间插入粘合剂来挤压和接合所述目标基板和所述支撑基板; 以及粘合剂去除操作，其包括将粘合剂的溶剂供应到作为在接合操作中突出的目标基板和支撑基板之间的粘合剂的外部粘合剂，所述粘合剂从通过连接目标基板制成的层叠基板的外侧表面和支撑基板，并且去除外部粘合剂的表面，使得外部粘合剂形成为预定尺寸。

3. 发明授权

US10008419B2 Separation method, computer storage medium, and separation system 有权
公开(公告)号：US10008419B2
公开(公告)日：2018-06-26
申请号：US14343598
申请日：2012-08-22
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi , Xavier Francois Brun , Charles Wayne Singleton, Jr. , Kabirkumar Mirpuri
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi , Xavier Francois Brun , Charles Wayne Singleton, Jr. , Kabirkumar Mirpuri
IPC分类号： H01L21/00 , H01L21/66 , H01L21/67 , H01L21/02 , H01L21/683
CPC分类号： H01L22/12 , H01L21/02068 , H01L21/67017 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L2221/68327 , H01L2221/6834 , H01L2221/68381 , Y10T156/1911
摘要： A superposed wafer is separated to a processing target wafer and a supporting wafer while being heated. Then, an adhesive on a joint surface of the processing target wafer is removed by supplying an organic solvent onto the joint surface of the processing target wafer. Then, an oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed by supplying acetic acid to the joint surface of the processing target wafer. Then, the joint surface of the processing target wafer is inspected. Then, based on an inspection result, the adhesive on the joint surface of the processing target wafer is removed and the oxide film formed on the predetermined pattern on the joint surface of the processing target wafer is removed.

4. 发明授权

US09484236B2 Joining method and joining system 有权
标题翻译：加盟方式和加盟制度
公开(公告)号：US09484236B2
公开(公告)日：2016-11-01
申请号：US14342941
申请日：2012-08-03
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： C03C15/00 , H01L21/683 , B81C1/00 , B32B38/10 , H01L21/67 , H01L21/687
CPC分类号： H01L21/683 , B32B38/10 , B81C1/00238 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834
摘要： This joining method of joining a target substrate and a support substrate includes: an adhesive coating operation that includes coating the target substrate or the support substrate with an adhesive; an adhesive removing operation that includes supplying a solvent for removing the adhesive onto an outer peripheral portion of the target substrate or the support substrate, which is coated with the adhesive in the adhesive coating operation, to thereby remove the adhesive on the outer peripheral portion; and a joining operation that includes pressing and joining the target substrate and the support substrate together, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the support substrate coated with no adhesive, or pressing and joining the support substrate, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the target substrate coated with no adhesive.
摘要翻译：该接合目标基板和支撑基板的接合方法包括：粘合剂涂布操作，其包括用粘合剂涂覆目标基板或支撑基板; 一种粘合剂去除操作，其包括在粘合剂涂覆操作中将用于除去粘合剂的溶剂供给到涂覆有粘合剂的目标基材或支撑基材的外周部分上，从而除去外周部分上的粘合剂; 以及接合操作，其包括将粘合剂去除操作中除去外周部分上的粘合剂并且没有粘合剂涂覆的支撑基板，或者将支撑体基板，其中在粘合剂去除操作中去除外周部分上的粘合剂，并且没有粘合剂涂覆的目标基板。

5. 发明授权

US08899289B2 Joint method, joint apparatus and joint system 有权
标题翻译：联合方法，联合装置和联合系统
公开(公告)号：US08899289B2
公开(公告)日：2014-12-02
申请号：US13613050
申请日：2012-09-13
申请人： Masatoshi Deguchi , Masatoshi Shiraishi , Shinji Okada
发明人： Masatoshi Deguchi , Masatoshi Shiraishi , Shinji Okada
IPC分类号： B29C65/00 , G05G15/00 , B23K31/00 , H01L21/30 , H01L21/687 , H01L21/67 , H01L21/18 , B32B38/00 , H01L21/683 , B32B38/18
CPC分类号： H01L21/6715 , B32B38/0036 , B32B2038/1891 , B32B2309/02 , B32B2309/62 , B32B2457/14 , B32B2457/20 , H01L21/187 , H01L21/67109 , H01L21/67126 , H01L21/6719 , H01L21/6838 , H01L21/68707 , H01L21/68742
摘要： When joining a processing target substrate and a supporting substrate together by suction-holding the processing substrate and the supporting substrate respectively on a first holding unit and a second holding unit arranged to face each other and pressing the second holding unit toward the first holding unit while heating the substrates by heating mechanisms of the holding units, the present invention preheats at least the processing target substrate before suction-holding the processing target substrate on the first holding unit to suppress generation of particles when joining the processing target substrate and the supporting substrate together so as to properly perform the joining of the processing target substrate and the supporting substrate.
摘要翻译：通过将处理基板和支撑基板分别吸附在第一保持单元和第二保持单元上而将处理目标基板和支撑基板接合在一起，第一保持单元和第二保持单元被布置成彼此面对并且将第二保持单元朝向第一保持单元按压，同时通过加热保持单元的加热机构来加热基板，本发明在将处理对象基板吸附到第一保持单元之前至少预热处理对象基板，以抑制在将处理对象基板与支撑基板接合在一起时产生粒子从而适当地执行处理目标基板和支撑基板的接合。

6. 发明申请

US20140224763A1 JOINING METHOD AND JOINING SYSTEM 有权
标题翻译：加工方法和加工系统
公开(公告)号：US20140224763A1
公开(公告)日：2014-08-14
申请号：US14342941
申请日：2012-08-03
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： H01L21/683
CPC分类号： H01L21/683 , B32B38/10 , B81C1/00238 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834
摘要： This joining method of joining a target substrate and a support substrate includes: an adhesive coating operation that includes coating the target substrate or the support substrate with an adhesive; an adhesive removing operation that includes supplying a solvent of the adhesive onto an outer peripheral portion of the target substrate or the support substrate, which is coated with the adhesive in the adhesive coating operation, to thereby remove the adhesive on the outer peripheral portion; and a joining operation that includes pressing and joining the target substrate and the support substrate together, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the support substrate coated with no adhesive, or pressing and joining the support substrate, in which the adhesive on the outer peripheral portion is removed in the adhesive removing operation, and the target substrate coated with no adhesive.
摘要翻译：该接合目标基板和支撑基板的接合方法包括：粘合剂涂布操作，其包括用粘合剂涂覆目标基板或支撑基板; 一种粘合剂去除操作，其包括在粘合剂涂覆操作中将粘合剂的溶剂供给到涂覆有粘合剂的目标基材或支撑基材的外周部分上，从而除去外周部分上的粘合剂; 以及接合操作，其包括将粘合剂去除操作中除去外周部分上的粘合剂并且没有粘合剂涂覆的支撑基板，或者将支撑体基板，其中在粘合剂去除操作中去除外周部分上的粘合剂，并且没有粘合剂涂覆的目标基板。

7. 发明授权

US09463612B2 Joining method and joining system 有权
标题翻译：加盟方式和加盟制度
公开(公告)号：US09463612B2
公开(公告)日：2016-10-11
申请号：US14342704
申请日：2012-08-30
申请人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
发明人： Shinji Okada , Masatoshi Shiraishi , Masatoshi Deguchi
IPC分类号： C09J5/00 , B32B38/10 , H01L21/67 , H01L21/687 , H01L21/683 , B32B38/00 , B32B37/12
CPC分类号： B32B38/10 , B32B37/12 , B32B38/0012 , B32B2457/14 , C09J5/00 , H01L21/6708 , H01L21/67092 , H01L21/6715 , H01L21/6835 , H01L21/68707 , H01L2221/68327 , H01L2221/6834 , Y10T156/14
摘要： The present disclosure is a joining method that joins a target substrate and a support substrate, wherein the method has: a joining operation that includes pressing and joining the target substrate and the support substrate by interposing an adhesive therebetween; and an adhesive removing operation that includes supplying a solvent of the adhesive to the outer adhesive that is the adhesive between the target substrate and the support substrate protruding in the joining operation from the outer lateral surface of the stacked substrate made by joining the target substrate and the support substrate, and to remove the surface of the outer adhesive so that the outer adhesive is formed at a predetermined size.
摘要翻译：本公开是连接目标基板和支撑基板的接合方法，其中，所述方法具有：连接操作，其包括通过在其间插入粘合剂来挤压和接合所述目标基板和所述支撑基板; 以及粘合剂去除操作，其包括将粘合剂的溶剂供应到作为在接合操作中突出的目标基板和支撑基板之间的粘合剂的外部粘合剂，所述粘合剂从通过连接目标基板制成的层叠基板的外侧表面和支撑基板，并且去除外部粘合剂的表面，使得外部粘合剂形成为预定尺寸。

8. 发明授权

US06821550B2 Apparatus and method for applying process solution 有权
标题翻译：装置和方法应用过程溶液
公开(公告)号：US06821550B2
公开(公告)日：2004-11-23
申请号：US09905504
申请日：2001-07-12
申请人： Masatoshi Deguchi , Kosuke Yoshihara
发明人： Masatoshi Deguchi , Kosuke Yoshihara
IPC分类号： B05D312
CPC分类号： H01L21/6715 , B05C11/08 , G03F7/162
摘要： A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
摘要翻译：一种处理液施加装置，包括用于保持基板的基板保持机构，用于将规定量的处理液施加到由基板保持机构保持的基板的处理液供给系统，所述处理液供给系统具有供给机构，提供工艺溶液的速率，以及用于旋转衬底保持机构的衬底旋转机构，从而以预定速度旋转衬底，以通过离心力扩散处理溶液并且用工艺溶液涂覆衬底。

9. 发明授权

US06281145B1 Apparatus and method for applying process solution 有权
标题翻译：装置和方法应用过程溶液
公开(公告)号：US06281145B1
公开(公告)日：2001-08-28
申请号：US09312542
申请日：1999-05-14
申请人： Masatoshi Deguchi , Kosuke Yoshihara
发明人： Masatoshi Deguchi , Kosuke Yoshihara
IPC分类号： H01L2131
CPC分类号： H01L21/6715 , B05C11/08 , G03F7/162
摘要： A process solution applying apparatus comprising a substrate holding mechanism for holding a substrate, a process solution supplying system for applying process solution in a prescribed amount to the substrate held by the substrate holding mechanism, the process solution supplying system having a supplying mechanism for changing a rate at which the process solution is supplied, and a substrate rotating mechanism for rotating the substrate holding mechanism, thus rotating the substrate at a predetermined speed to spread the process solution by virtue of centrifugal force and to coat the substrate with the process solution.
摘要翻译：一种处理液施加装置，包括用于保持基板的基板保持机构，用于将规定量的处理液施加到由基板保持机构保持的基板的处理液供给系统，所述处理液供给系统具有供给机构，提供工艺溶液的速率，以及用于旋转衬底保持机构的衬底旋转机构，从而以预定速度旋转衬底，以通过离心力扩散处理溶液并且用工艺溶液涂覆衬底。

10. 发明授权

US5942035A Solvent and resist spin coating apparatus 失效
标题翻译：溶剂和抗旋涂装置
公开(公告)号：US5942035A
公开(公告)日：1999-08-24
申请号：US686910
申请日：1996-07-26
申请人： Keizo Hasebe , Akihiro Fujimoto , Hiroichi Inada , Hiroyuki Iino , Shinzi Kitamura , Masatoshi Deguchi , Mitsuhiro Nambu
发明人： Keizo Hasebe , Akihiro Fujimoto , Hiroichi Inada , Hiroyuki Iino , Shinzi Kitamura , Masatoshi Deguchi , Mitsuhiro Nambu
IPC分类号： B05C11/08 , G03F7/16 , B05C5/00
CPC分类号： B05C11/08 , G03F7/162
摘要： An apparatus for forming a coating film, comprises a spin chuck for supporting a substrate with one surface facing upward and rotating the substrate about a vertical axis, a first nozzle for supplying a solvent of a coating solution on the substrate, and a second nozzle for supplying the coating solution on a central portion of the substrate. The first and second nozzles are supported by a head such that the supported nozzle moves between a dropping position above the substrate and a waiting position offset from the substrate. The solvent and coating solution are diffused along the surface of the substrate by rotating the spin chuck.
摘要翻译：一种用于形成涂膜的装置，包括：旋转卡盘，用于将一个表面朝上并使基板围绕垂直轴旋转的基板支撑;第一喷嘴，用于在基板上供应涂布溶剂的溶剂;第二喷嘴，将涂布溶液供应到基材的中心部分。第一和第二喷嘴由头部支撑，使得支撑的喷嘴在基板上方的下落位置和偏离基板的等待位置之间移动。通过旋转旋转卡盘，溶剂和涂布溶液沿着基板的表面扩散。

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