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1. 发明授权

US09349130B2 Generating relative and absolute positioned resources using a single editor having a single syntax 有权
标题翻译：使用具有单一语法的单个编辑器生成相对和绝对定位的资源
公开(公告)号：US09349130B2
公开(公告)日：2016-05-24
申请号：US13298977
申请日：2011-11-17
申请人： Michael Ball , Evin Grano
发明人： Michael Ball , Evin Grano
IPC分类号： G06F17/00 , G06Q30/02 , G06F17/21
CPC分类号： G06Q30/02 , G06F8/38 , G06F17/212
摘要： Both a relative positioned resource and an absolute positioned resource may be generated using a single editor having a single syntax for both the relative and absolute positioned elements. A layout module generates an intermediate data structure based on element information. The element information includes content of at least one element, Cartesian coordinates of the at least one element, and dimensional information of the at least one element. A unified processing module generates a first resource having absolute positioned elements by processing the intermediate data structure, and generates a second resource having relative positioned elements by processing the same intermediate data structure.
摘要翻译：相对定位的资源和绝对定位的资源都可以使用具有用于相对和绝对定位的元素的单一语法的单个编辑器来生成。布局模块基于元素信息生成中间数据结构。元素信息包括至少一个元素的内容，至少一个元素的笛卡尔坐标和至少一个元素的尺寸信息。统一处理模块通过处理中间数据结构生成具有绝对定位元素的第一资源，并通过处理相同的中间数据结构生成具有相对定位元素的第二资源。

2. 发明申请

US20120185764A1 SYSTEMS AND METHODS FOR CONTENT DEVELOPMENT AND MANAGEMENT 有权
标题翻译：内容开发与管理系统与方法
公开(公告)号：US20120185764A1
公开(公告)日：2012-07-19
申请号：US13298977
申请日：2011-11-17
申请人： Michael Ball , Evin Grano
发明人： Michael Ball , Evin Grano
IPC分类号： G06F17/00
CPC分类号： G06Q30/02 , G06F8/38 , G06F17/212
摘要： Both a relative positioned resource and an absolute positioned resource may be generated using a single editor having a single syntax for both the relative and absolute positioned elements. A layout module generates an intermediate data structure based on element information. The element information includes content of at least one element, Cartesian coordinates of the at least one element, and dimensional information of the at least one element. A unified processing module generates a first resource having absolute positioned elements by processing the intermediate data structure, and generates a second resource having relative positioned elements by processing the same intermediate data structure.
摘要翻译：相对定位的资源和绝对定位的资源都可以使用具有用于相对和绝对定位的元素的单一语法的单个编辑器来生成。布局模块基于元素信息生成中间数据结构。元素信息包括至少一个元素的内容，至少一个元素的笛卡尔坐标和至少一个元素的尺寸信息。统一处理模块通过处理中间数据结构生成具有绝对定位元素的第一资源，并通过处理相同的中间数据结构生成具有相对定位元素的第二资源。

3. 发明申请

US20050142835A1 Method of disposing conductive bumps onto a semiconductor device and semiconductor devices so formed 审中-公开
标题翻译：在半导体器件和如此形成的半导体器件上设置导电凸块的方法
公开(公告)号：US20050142835A1
公开(公告)日：2005-06-30
申请号：US11068676
申请日：2005-03-01
申请人： Michael Ball , Chad Cobbley
发明人： Michael Ball , Chad Cobbley
IPC分类号： H01L21/60 , H05K3/00 , H05K3/28 , H05K3/34 , H01L21/44
CPC分类号： H01L24/12 , H01L24/11 , H01L2224/05572 , H01L2224/05573 , H01L2224/056 , H01L2224/1147 , H01L2224/11472 , H01L2224/13023 , H01L2224/13099 , H01L2924/01006 , H01L2924/01013 , H01L2924/01033 , H01L2924/01042 , H01L2924/01051 , H01L2924/01078 , H01L2924/01082 , H01L2924/014 , H01L2924/12042 , H05K3/0041 , H05K3/28 , H05K3/3452 , H05K3/3457 , H05K2201/0125 , H05K2201/0191 , H01L2924/00 , H01L2924/00014
摘要： A method of forming conductive structures on the contact pads of a substrate, such as a semiconductor die or a printed circuit board. A solder mask is secured to an active surface of the substrate. Apertures through the solder mask are aligned with contact pads on the substrate. The apertures may be preformed or formed after a layer of the material of which the solder mask is comprised has been disposed on the substrate. Conductive material is disposed in and shaped by the apertures of the solder mask to form conductive structures in communication with the contact pads exposed to the apertures. Sides of the conductive structures are exposed through the solder mask, either by removing the solder mask from the substrate or by reducing the thickness of the solder mask. The present invention also includes semiconductor devices formed during different stages of the method of the present invention.
摘要翻译：在诸如半导体管芯或印刷电路板的衬底的接触焊盘上形成导电结构的方法。焊接掩模固定到基板的有效表面。通过焊接掩模的孔径与衬底上的接触焊盘对准。可以在其包含焊料掩模的材料层已经布置在基底上之后预先形成或形成孔。导电材料设置在焊接掩模的孔中并由其形成，以形成与暴露于孔的接触焊盘相连通的导电结构。通过焊接掩模暴露出导电结构的侧面，通过从衬底去除焊接掩模或通过减小焊接掩模的厚度。本发明还包括在本发明方法的不同阶段形成的半导体器件。

4. 发明申请

US20050056681A1 Method of locating conductive spheres utilizing screen and hopper of solder balls 失效
标题翻译：使用焊球的筛网和料斗定位导电球的方法
公开(公告)号：US20050056681A1
公开(公告)日：2005-03-17
申请号：US10977301
申请日：2004-10-29
申请人： Chad Cobbley , Michael Ball , Marjorie Waddel
发明人： Chad Cobbley , Michael Ball , Marjorie Waddel
IPC分类号： H01L21/60 , H01L21/68 , H05K3/34 , B23K35/12
CPC分类号： H01L24/12 , H01L21/6835 , H01L24/11 , H01L2224/05568 , H01L2224/05573 , H01L2224/11003 , H01L2224/11005 , H01L2224/11334 , H01L2224/13099 , H01L2924/00014 , H01L2924/01013 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H05K3/3478 , H05K2203/0126 , H05K2203/041 , H05K2203/0557 , Y10T29/49144 , Y10T29/49149 , Y10T29/49211 , Y10T29/49222 , Y10T29/53178 , Y10T29/532 , H01L2224/05599
摘要： Apparatus and methods for placing conductive spheres on prefluxed bond pads of a substrate using a stencil plate with a pattern of through-holes positioned over the bond pads. Conductive spheres are placed in the through-holes by a moving feed mechanism and the spheres drop through the through-holes onto the bond pads. In one embodiment, the feed mechanism is a sphere hopper which crosses the entire through-hole pattern. In another embodiment, a shuttle plate fed spheres from a reservoir and reversibly moves about one-half of the pitch, moving from a non-discharge position to a discharge position.
摘要翻译：使用具有定位在接合焊盘上方的通孔图案的模板将导电球放置在衬底的预先焊接的焊盘上的装置和方法。导电球通过移动进给机构放置在通孔中，并且球体通过通孔落到接合垫上。在一个实施例中，进给机构是穿过整个通孔图案的球形料斗。在另一个实施例中，梭板从储存器供给球体并可逆地移动约一半的间距，从非排放位置移动到排出位置。

5. 发明授权

US5253161A Method for routing data in a near-optimal manner in a distributed data communications network 失效
标题翻译：在分布式数据通信网络中以近乎最佳的方式路由数据的方法
公开(公告)号：US5253161A
公开(公告)日：1993-10-12
申请号：US475872
申请日：1990-02-06
申请人： Paul Nemirovsky , Michael Ball , Michael Post
发明人： Paul Nemirovsky , Michael Ball , Michael Post
IPC分类号： H04L12/56 , H04Q3/66 , G06F15/20 , H04J3/24 , H04Q11/00 , H04Q11/04
CPC分类号： H04L45/04 , H04L45/121 , H04Q3/66
摘要： A method to produce near-optimal routes for the flow of data between clusters in a distributed data communications network. A backbone traffic matrix and a backbone topology at the cluster level are used to produce minimum hop routes, minimum delay routes, or routes which maximize throughput. The inputs of the system are the number of requirements, the number of backbone links, and the number of backbone nodes.
摘要翻译：一种用于为分布式数据通信网络中的群集之间的数据流提供近似最佳路由的方法。集群级骨干流量矩阵和骨干网拓扑结构用于产生最大吞吐量的最小跳数路由，最小延迟路由或路由。系统的输入是要求的数量，骨干链路的数量和骨干节点的数量。

6. 发明授权

US07175194B2 Anti-jackknife system 失效
标题翻译：防折刀系统
公开(公告)号：US07175194B2
公开(公告)日：2007-02-13
申请号：US10959390
申请日：2004-10-06
申请人： Michael Ball
发明人： Michael Ball
IPC分类号： B60T7/12
CPC分类号： B60D1/30 , B62D53/0878
摘要： An anti-jackknifing device adapted for engagement between a tractor having a fifth wheel engaged with a trailer. The device features a pair of catch arms rotationally engaged to a mount with the tractor. The distal ends of the catch arms move between an engaged position in a horizontal path between two trailer mounted engaging components adapted to engage the distal end and a disengaged position out of the path. The distal ends of the catch arms may be pivotally mounted. The distal ends of the catch arms and the engaging components may also be shaped to cooperatively engage on contact. A control causes the catch arms to rotate thereby engaging the distal ends of the arms between the engaging components either automatically above a threshold speed or manually. This engagement limits the angle of the trailer to the tractor to a predetermined angle when trailer rotates on the fifth wheel causing the engaging components to contact the distal ends of the catch arms.
摘要翻译：一种适于在具有与拖车接合的第五轮的拖拉机之间接合的防夹紧装置。该装置具有一对夹紧臂，其与拖拉机旋转地接合到安装件。卡止臂的远端在适于接合远端的两个拖车安装的接合部件之间的水平路径中的接合位置和离开路径的脱离位置之间移动。止动臂的远端可枢转地安装。夹臂和接合部件的远端也可以成形为在接触时配合接合。控制器使得卡爪臂旋转，从而使接合部件之间的臂的远端自动地高于阈值速度或手动地接合。当拖车在第五轮上旋转时，该接合将拖车的拖车的角度限制到预定角度，从而使接合部件接触抓持臂的远端。

7. 发明授权

US06283358B1 System for forming contacts on a semiconductor component by aligning and attaching ferromagnetic balls 失效
标题翻译：通过对准和附着铁磁球在半导体部件上形成接触的系统
公开(公告)号：US06283358B1
公开(公告)日：2001-09-04
申请号：US09650304
申请日：2000-08-29
申请人： Michael Ball
发明人： Michael Ball
IPC分类号： B23K3524
CPC分类号： B23K35/0244 , B23K3/0623 , B23K2101/40 , H01L24/11 , H01L24/13 , H01L24/742 , H01L2224/0401 , H01L2224/05568 , H01L2224/05624 , H01L2224/05647 , H01L2224/11003 , H01L2224/1111 , H01L2224/11334 , H01L2224/11823 , H01L2224/11849 , H01L2224/13124 , H01L2224/13155 , H01L2224/13157 , H01L2224/1316 , H01L2224/13166 , H01L2224/1329 , H01L2224/13324 , H01L2224/13355 , H01L2224/13357 , H01L2224/1336 , H01L2224/13366 , H01L2224/13561 , H01L2224/13611 , H01L2224/13616 , H01L2224/1379 , H01L2224/13839 , H01L2224/13844 , H01L2224/48091 , H01L2224/4824 , H01L2224/81024 , H01L2924/0002 , H01L2924/01006 , H01L2924/01029 , H01L2924/01047 , H01L2924/01072 , H01L2924/01078 , H01L2924/014 , H01L2924/09701 , H01L2924/14 , H05K3/3436 , H05K3/3478 , H05K2201/0215 , H05K2201/083 , H05K2201/10234 , H05K2203/041 , H05K2203/104 , H01L2924/00014 , H01L2924/0105 , H01L2924/00012 , H01L2924/01082 , H01L2924/0665 , H01L2224/05552 , H01L2924/00
摘要： A method and system for forming contacts on semiconductor components, such as wafers, dice and packages, are provided. The method employs magnets to align and hold ferromagnetic balls on bonding sites of a component substrate. The system includes a holder for holding the component substrate, and magnets on the holder aligned with bonding sites on the component. The system also includes a ball placement mechanism for placing the ferromagnetic balls on the bonding sites, and a bonding mechanism, such as an oven, or a focused energy source, for bonding the ferromagnetic balls to the bonding sites. The ferromagnetic balls can be provided as a ferromagnetic core having an outer solder layer, as a solid ferromagnetic material with a conductive adhesive outer layer, or as ferromagnetic particles embedded in a bondable matrix material. An alternate embodiment system includes a focused magnetic source for dynamically aligning the ferromagnetic balls to the bonding sites.
摘要翻译：提供了一种用于在半导体部件上形成接触的方法和系统，例如晶片，芯片和封装。该方法采用磁体来对准和保持组件衬底的结合位置上的铁磁性球。该系统包括用于保持组件衬底的保持器，并且保持器上的磁体与构件上的结合位置对准。该系统还包括用于将铁磁球放置在接合位置上的球放置机构，以及用于将铁磁球结合到接合位置的接合机构，例如烘箱或聚焦能量源。铁磁球可以作为具有外部焊料层的铁磁芯提供，作为具有导电粘合剂外层的固体铁磁材料，或者作为嵌入可结合基质材料中的铁磁性颗粒。替代实施例系统包括用于将铁磁球动态对准到结合位置的聚焦磁源。

8. 发明授权

US08256297B2 Systems and methods for measuring turbine blade vibratory response 有权
标题翻译：用于测量涡轮叶片振动响应的系统和方法
公开(公告)号：US08256297B2
公开(公告)日：2012-09-04
申请号：US12652153
申请日：2010-01-05
申请人： Peter Ping-Liang Sue , Holly Davis , Michael Ball
发明人： Peter Ping-Liang Sue , Holly Davis , Michael Ball
IPC分类号： G01H9/00 , G01N29/24 , G01N29/04
CPC分类号： G01H1/006 , G01H9/00 , G01H9/004 , G01H9/006
摘要： Certain embodiments of the invention may include systems and methods for measuring turbine blade vibratory responses. According to an example embodiment of the invention, a method is provided for measuring a vibratory response of a plurality of turbine blades. The method can include mounting an optical probe comprising at least one probe tip optical surface, wherein the at least one probe tip optical surface is substantially parallel to within about +15 or about −15 degrees with respect to a trailing edge surface of at least one of the plurality of turbine blades, directing light towards a trailing edge surface of at least one of the plurality of turbine blades, receiving reflected light from the at least one of the plurality of turbine blades, and determining relative position of the at least one of the plurality of blades based at least in part on the reflected light.
摘要翻译：本发明的某些实施例可以包括用于测量涡轮叶片振动响应的系统和方法。根据本发明的示例性实施例，提供了一种用于测量多个涡轮叶片的振动响应的方法。该方法可以包括安装包括至少一个探针尖端光学表面的光学探针，其中所述至少一个探针末端光学表面相对于至少一个的后缘表面基本上平行于约+15或约-15度将多个涡轮机叶片中的至少一个涡轮机叶片的后缘表面引导到多个涡轮机叶片中的至少一个涡轮机叶片的后缘表面，接收来自多个涡轮机叶片中的至少一个的反射光，以及确定至少一个所述多个叶片至少部分地基于所述反射光。

9. 发明申请

US20070117266A1 Method of fabricating a multi-die semiconductor package assembly 审中-公开
标题翻译：制造多芯片半导体封装组件的方法
公开(公告)号：US20070117266A1
公开(公告)日：2007-05-24
申请号：US11656686
申请日：2007-01-23
申请人： Michael Ball
发明人： Michael Ball
IPC分类号： H01L21/50
CPC分类号： H01L25/50 , H01L24/45 , H01L25/0657 , H01L29/0657 , H01L2224/274 , H01L2224/32145 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48145 , H01L2224/48227 , H01L2224/85205 , H01L2225/06506 , H01L2225/0651 , H01L2225/06517 , H01L2225/06555 , H01L2225/06562 , H01L2225/06575 , H01L2924/01013 , H01L2924/01079 , H01L2924/14 , H01L2924/19041 , H01L2924/00014 , H01L2924/00 , H01L2924/00012
摘要： An apparatus and method for increasing integrated circuit density comprising an upper die and a lower die, the latter preferably a flip chip, which are connected to a conductor-carrying substrate or a leadframe. The upper die is attached back-to-back to the lower die with a layer of adhesive applied over the back side of the lower die. Bond wires or TAB leads are attached between bond pads on the upper die and corresponding conductive trace or lead ends on the substrate. The upper die may be smaller than the lower die such that a small discrete component such as a resistor, capacitor, or the like can be attached to the adhesive not covered by the upper die. Bond wires can be attached between the upper die and the component, as well as between the component and the substrate. One or more additional die may be stacked on the upper die and electrically connected to the substrate. Furthermore, multiple lower dice can be arranged on the substrate to support upper dice bridged between the lower dice.
摘要翻译：一种用于提高集成电路密度的装置和方法，包括上模和下模，后者优选为倒装芯片，其连接到导体承载基板或引线框架。上模具背对背地附接到下模具，其中一层粘合剂施加在下模的背面上。键合线或TAB引线连接在上模的接合焊盘和衬底上的相应导电迹线或引线端之间。上模可以小于下模，使得诸如电阻器，电容器等的小分立部件可以附接到未被上模覆盖的粘合剂。键合线可以连接在上模和元件之间，以及元件与基板之间。一个或多个另外的管芯可以堆叠在上模具上并电连接到衬底。此外，可以在基板上布置多个下骰子以支撑桥接在下骰子之间的上骰子。

10. 发明申请

US20060121645A1 Method of fabrication of stacked semiconductor devices 失效
标题翻译：层叠半导体器件的制造方法
公开(公告)号：US20060121645A1
公开(公告)日：2006-06-08
申请号：US11337617
申请日：2006-01-23
申请人： Michael Ball
发明人： Michael Ball
IPC分类号： H01L21/50
CPC分类号： H01L21/6836 , H01L24/27 , H01L24/45 , H01L24/73 , H01L25/0657 , H01L25/50 , H01L29/0657 , H01L2221/68327 , H01L2224/05568 , H01L2224/05573 , H01L2224/16225 , H01L2224/274 , H01L2224/32145 , H01L2224/32225 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73253 , H01L2224/73265 , H01L2225/0651 , H01L2225/06517 , H01L2225/06551 , H01L2225/06555 , H01L2225/06589 , H01L2924/00014 , H01L2924/01013 , H01L2924/01079 , H01L2924/14 , H01L2924/181 , H01L2924/00 , H01L2924/3512 , H01L2924/00012 , H01L2224/05599
摘要： A method for increasing integrated circuit density is disclosed comprising stacking an upper wafer and a lower wafer, each of which having fabricated circuitry in specific areas on their respective face surfaces. The upper wafer is attached back-to-back with the lower wafer with a layer of adhesive applied over the back side of the lower wafer. The wafers are aligned so as to bring complementary circuitry on each of the wafers into perpendicular alignment. The adhered wafer pair is then itself attached to an adhesive film to immobilize the wafer during, dicing. The adhered wafer pair may be diced into individual die pairs or wafer portions containing more than one die pair.
摘要翻译：公开了一种用于提高集成电路密度的方法，其包括堆叠上晶片和下晶片，每个晶片和下晶片在其相应的表面上的特定区域中具有制造的电路。上部晶片与下部晶片背靠背连接，并且在下部晶片的背面上施加一层粘合剂。将晶片对准以便使每个晶片上的互补电路成垂直对准。然后，粘附的晶片对本身连接到粘合剂膜，以在切割期间固定晶片。粘附的晶片对可以切成单个管芯对或包含多于一个管芯对的晶片部分。

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