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1. 发明申请

US20130200439A1 MICRO-ELECTROMECHANICAL SEMICONDUCTOR COMPONENT 有权
标题翻译：微电子半导体元件
公开(公告)号：US20130200439A1
公开(公告)日：2013-08-08
申请号：US13521168
申请日：2011-01-10
申请人： Michael Doelle
发明人： Michael Doelle
IPC分类号： B81B3/00
CPC分类号： B81C1/00158 , B81B3/0018 , B81B3/0021 , B81B3/007 , B81B3/0072 , B81B3/0081 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81C1/00626 , B81C99/0035 , B81C2201/019 , G01L9/0047 , H01L29/4916 , H01L29/84
摘要： A micro-electromechanical semiconductor component is provided with a semiconductor substrate, a reversibly deformable bending element made of semiconductor material, and at least one transistor that is sensitive to mechanical stresses. The transistor is designed as an integrated component in the bending element.
摘要翻译：微机电半导体元件设置有半导体衬底，由半导体材料制成的可逆变形的弯曲元件以及对机械应力敏感的至少一个晶体管。晶体管被设计为弯曲元件中的集成元件。

2. 发明授权

US09013015B2 Micro-electromechanical semiconductor component 有权
标题翻译：微机电半导体元件
公开(公告)号：US09013015B2
公开(公告)日：2015-04-21
申请号：US13521168
申请日：2011-01-10
申请人： Michael Doelle
发明人： Michael Doelle
IPC分类号： H01L21/18 , G01L19/04 , G01L9/00 , B81B3/00 , B81C1/00
CPC分类号： B81C1/00158 , B81B3/0018 , B81B3/0021 , B81B3/007 , B81B3/0072 , B81B3/0081 , B81B2201/0235 , B81B2201/0264 , B81B2203/0127 , B81C1/00626 , B81C99/0035 , B81C2201/019 , G01L9/0047 , H01L29/4916 , H01L29/84
摘要： A micro-electromechanical semiconductor component is provided with a semiconductor substrate, a reversibly deformable bending element made of semiconductor material, and at least one transistor that is sensitive to mechanical stresses. The transistor is designed as an integrated component in the bending element.
摘要翻译：微机电半导体元件设置有半导体衬底，由半导体材料制成的可逆变形的弯曲元件以及对机械应力敏感的至少一个晶体管。晶体管被设计为弯曲元件中的集成元件。

3. 发明授权

US08916944B2 Stress-sensitive micro-electromechanical device and use thereof 有权
标题翻译：应力敏感微机电装置及其应用
公开(公告)号：US08916944B2
公开(公告)日：2014-12-23
申请号：US13583392
申请日：2011-03-15
申请人： Bernd Burchard , Michael Doelle , Zhou Ningning
发明人： Bernd Burchard , Michael Doelle , Zhou Ningning
IPC分类号： H01L33/00 , B81B3/00
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2201/0264
摘要： The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.
摘要翻译：微机电装置具有基板。集成到衬底中的是一种微机械部件，其具有可逆地弯曲的弯曲元件，并且其具有连接到衬底的第一端并且在第一端部在自由空间上延伸。弯曲元件具有至少一个腹板，该腹板具有两个侧边缘，其边缘由通过弯曲元件并靠近侧边缘的凹陷限定。为了形成位于纤维网内的均质化区域，其中在弯曲元件的弯曲期间发生的机械应力基本上相等，从弯曲元件的第一端看，幅材的侧边缘的相互间隔减小。该装置还包括至少一个对机械应力敏感的微电子部件，并且嵌入在后者的均匀化区域中的网中。

4. 发明申请

US20130305804A1 MICROELECTROMECHANICAL COMPONENT AND METHOD FOR TESTING A MICROELECTROMECHANICAL COMPONENT 有权
标题翻译：微电子元件和微电子元件测试方法
公开(公告)号：US20130305804A1
公开(公告)日：2013-11-21
申请号：US13981506
申请日：2012-01-27
申请人： Bernd Burchard , Michael Doelle
发明人： Bernd Burchard , Michael Doelle
IPC分类号： B81B3/00 , G01L25/00
CPC分类号： B81B3/0018 , B81B2201/0264 , B81C99/0045 , G01L25/00 , G01L27/007
摘要： The microelectromechanical component has a semiconductor substrate (1), which has a cavity (2a) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane (2). A sensor (17) for detecting a deformation of the membrane (2) is formed within the region of the membrane (2). A test actuator (28, 29, 30) for deforming the membrane (2) for testing purposes is also arranged within the region of the membrane (2). Finally, the microelectromechanical component has an evaluation and activation unit (41) connected to the sensor (17) and the test actuator (28, 29, 30) for activating the test actuator (28, 29, 30) in order to deform the membrane (2) as a test and for evaluating a measurement signal of the sensor (17) as a sensor detection of a deformation of the membrane (2) as a result of the activation of the test actuator (28, 29, 30).
摘要翻译：微电子部件具有半导体基板（1），该半导体基板具有在半导体基板中形成的空腔（2a）。空腔被可逆变形的膜（2）覆盖。用于检测膜（2）的变形的传感器（17）形成在膜（2）的区域内。用于使膜（2）变形以用于测试目的的测试致动器（28,29,30）也布置在膜（2）的区域内。最后，微电子部件具有连接到传感器（17）的评估和激活单元（41）和用于启动测试致动器（28,29,30）的测试致动器（28,29,30），以使膜变形（2）作为测试，并且用于作为由于测试致动器（28,29,30）的激活而导致的膜（2）的变形的传感器检测来评估传感器（17）的测量信号。

5. 发明申请

US20050123119A1 Telephone call processing 有权
标题翻译：电话呼叫处理
公开(公告)号：US20050123119A1
公开(公告)日：2005-06-09
申请号：US10953076
申请日：2004-09-30
申请人： Michael Doelle , Thomas Hasenfratz
发明人： Michael Doelle , Thomas Hasenfratz
IPC分类号： H04M3/436 , H04M3/54 , H04Q3/00 , H04M3/42
CPC分类号： H04M3/54 , H04M3/42102 , H04M3/436 , H04M3/546 , H04M2203/2011 , H04M2242/22 , H04Q3/0016 , H04Q2213/13173 , H04Q2213/1322 , H04Q2213/13282
摘要： A telephone call processing method comprising the steps of: (i) receiving a telephone call for transfer to a first telephone number; (ii) determining whether the first telephone number has been set to divert calls to a second telephone number; and (iii) processing the call in dependence upon the determination of step (ii).
摘要翻译：一种电话呼叫处理方法，包括以下步骤：（i）接收用于转移到第一电话号码的电话呼叫; （ii）确定所述第一电话号码是否被设置为将呼叫转移到第二电话号码; 和（iii）根据步骤（ii）的确定处理该呼叫。

6. 发明申请

US20130193535A1 MICRO-ELECTROMECHANICAL DEVICE AND USE THEREOF 有权
标题翻译：微机电设备及其应用
公开(公告)号：US20130193535A1
公开(公告)日：2013-08-01
申请号：US13583392
申请日：2011-03-15
申请人： Bernd Burchard , Michael Doelle , Zhou Ningning
发明人： Bernd Burchard , Michael Doelle , Zhou Ningning
IPC分类号： B81B3/00
CPC分类号： B81B3/0072 , B81B2201/0257 , B81B2201/0264
摘要： The micro-electromechanical device has a substrate. Integrated into the substrate is a micromechanical component that has a bending element which can be bent reversibly and which has a first end connected to the substrate and extends from the first end over a free space. The bending element has at least one web having two side edges, the course of which is defined by depressions introduced into the bending element and adjacent to the side edges. In order to form a homogenization region located within the web, in which mechanical stresses occurring during bending of the bending element are substantially equal, the mutual spacing of the side edges of the web decreases, as viewed from the first end of the bending element. The device further comprises at least one microelectronic component that is sensitive to mechanical stresses and embedded in the web in the homogenization region of the latter.
摘要翻译：微机电装置具有基板。集成到衬底中的是具有可逆地弯曲的弯曲元件的微机械部件，其具有连接到衬底的第一端并且在第一端部上延伸自由空间。弯曲元件具有至少一个腹板，该腹板具有两个侧边缘，其边缘由通过弯曲元件并靠近侧边缘的凹陷限定。为了形成位于纤维网内的均质化区域，其中在弯曲元件的弯曲期间发生的机械应力基本上相等，从弯曲元件的第一端看，幅材的侧边缘的相互间隔减小。该装置还包括至少一个对机械应力敏感的微电子部件，并且嵌入在后者的均匀化区域中的网中。

7. 发明授权

US07567663B2 Telephone call processing 有权
标题翻译：电话呼叫处理
公开(公告)号：US07567663B2
公开(公告)日：2009-07-28
申请号：US10953076
申请日：2004-09-30
申请人： Michael Doelle , Thomas Hasenfratz
发明人： Michael Doelle , Thomas Hasenfratz
IPC分类号： H04M3/42
CPC分类号： H04M3/54 , H04M3/42102 , H04M3/436 , H04M3/546 , H04M2203/2011 , H04M2242/22 , H04Q3/0016 , H04Q2213/13173 , H04Q2213/1322 , H04Q2213/13282
摘要： A telephone call processing method comprising the steps of: (i) receiving a telephone call for transfer to a first telephone number; (ii) determining whether the first telephone number has been set to divert calls to a second telephone number; and (iii) processing the call in dependence upon the determination of step (ii).
摘要翻译：一种电话呼叫处理方法，包括以下步骤：（i）接收用于转移到第一电话号码的电话呼叫; （ii）确定所述第一电话号码是否被设置为将呼叫转移到第二电话号码; 和（iii）根据步骤（ii）的确定处理该呼叫。

8. 发明授权

US09399572B2 Microelectromechanical component and method for testing a microelectromechanical component 有权
标题翻译：微机电元件和微机电元件测试方法
公开(公告)号：US09399572B2
公开(公告)日：2016-07-26
申请号：US13981506
申请日：2012-01-27
申请人： Bernd Burchard , Michael Doelle
发明人： Bernd Burchard , Michael Doelle
IPC分类号： G01L27/00 , B81B3/00 , B81C99/00 , G01L25/00
CPC分类号： B81B3/0018 , B81B2201/0264 , B81C99/0045 , G01L25/00 , G01L27/007
摘要： The microelectromechanical component has a semiconductor substrate (1), which has a cavity (2a) formed in the semiconductor substrate. The cavity is covered by a reversibly deformable membrane (2). A sensor (17) for detecting a deformation of the membrane (2) is formed within the region of the membrane (2). A test actuator (28, 29, 30) for deforming the membrane (2) for testing purposes is also arranged within the region of the membrane (2). Finally, the microelectromechanical component has an evaluation and activation unit (41) connected to the sensor (17) and the test actuator (28, 29, 30) for activating the test actuator (28, 29, 30) in order to deform the membrane (2) as a test and for evaluating a measurement signal of the sensor (17) as a sensor detection of a deformation of the membrane (2) as a result of the activation of the test actuator (28, 29, 30).
摘要翻译：微电子部件具有半导体基板（1），该半导体基板具有在半导体基板中形成的空腔（2a）。空腔被可逆变形的膜（2）覆盖。用于检测膜（2）的变形的传感器（17）形成在膜（2）的区域内。用于使膜（2）变形以用于测试目的的测试致动器（28,29,30）也布置在膜（2）的区域内。最后，微电子部件具有连接到传感器（17）的评估和激活单元（41）和用于启动测试致动器（28,29,30）的测试致动器（28,29,30），以使膜变形（2）作为测试，并且用于作为由于测试致动器（28,29,30）的激活而导致的膜（2）的变形的传感器检测来评估传感器（17）的测量信号。

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