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1. 发明授权

US08693203B2 Method of making an electronic device having a liquid crystal polymer solder mask laminated to an interconnect layer stack and related devices 有权
标题翻译：制造具有叠层在互连层堆叠上的液晶聚合物焊料掩模的电子器件及其相关器件的方法
公开(公告)号：US08693203B2
公开(公告)日：2014-04-08
申请号：US13007035
申请日：2011-01-14
申请人： Louis Joseph Rendek, Jr. , Michael Weatherspoon , Casey Philip Rodriguez , David Nicol
发明人： Louis Joseph Rendek, Jr. , Michael Weatherspoon , Casey Philip Rodriguez , David Nicol
IPC分类号： H05K1/00
CPC分类号： H01L24/83 , H01L23/3157 , H01L23/49822 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/33 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05647 , H01L2224/11422 , H01L2224/1148 , H01L2224/13021 , H01L2224/131 , H01L2224/16145 , H01L2224/16237 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2225/06513 , H01L2225/06568 , H01L2924/00013 , H01L2924/01029 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K3/281 , H05K3/3436 , H05K3/3452 , H05K2201/0141 , H05K2201/10674 , H05K2203/063 , Y10T29/49144 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/31721 , H01L2924/00014 , H01L2224/81 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00
摘要： A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.
摘要翻译：制造电子器件的方法包括在刚性晶片衬底上形成互连层堆叠，所述刚性晶片衬底具有多个图案化电导体层，相邻图案化电导体层之间的介电层，以及位于最上图案化电导体层上的至少一个焊盘。形成具有与至少一个焊盘对准的至少一个孔的LCP焊接掩模。将LCP焊接掩模和互连层堆叠对齐并层压在一起。焊料定位在至少一个孔中。使用焊料将至少一个电路部件连接到至少一个焊盘。

2. 发明申请

US20120182703A1 METHOD OF MAKING AN ELECTRONIC DEVICE HAVING A LIQUID CRYSTAL POLYMER SOLDER MASK LAMINATED TO AN INTERCONNECT LAYER STACK AND RELATED DEVICES 有权
标题翻译：制造具有层压于互连层堆叠的液晶聚合物焊盘的电子设备的方法及相关设备
公开(公告)号：US20120182703A1
公开(公告)日：2012-07-19
申请号：US13007035
申请日：2011-01-14
申请人： Louis Joseph Rendek, JR. , Michael Weatherspoon , Casey Philip Rodriguez , David Nicol
发明人： Louis Joseph Rendek, JR. , Michael Weatherspoon , Casey Philip Rodriguez , David Nicol
IPC分类号： H05K1/18 , H01L21/58
CPC分类号： H01L24/83 , H01L23/3157 , H01L23/49822 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/33 , H01L24/81 , H01L24/94 , H01L25/0657 , H01L2224/0401 , H01L2224/05647 , H01L2224/11422 , H01L2224/1148 , H01L2224/13021 , H01L2224/131 , H01L2224/16145 , H01L2224/16237 , H01L2224/81191 , H01L2224/81815 , H01L2224/94 , H01L2225/06513 , H01L2225/06568 , H01L2924/00013 , H01L2924/01029 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H05K1/0306 , H05K3/281 , H05K3/3436 , H05K3/3452 , H05K2201/0141 , H05K2201/10674 , H05K2203/063 , Y10T29/49144 , Y10T29/49156 , Y10T29/49165 , Y10T428/24917 , Y10T428/25 , Y10T428/31721 , H01L2924/00014 , H01L2224/81 , H01L2224/13099 , H01L2224/13599 , H01L2224/05599 , H01L2224/05099 , H01L2224/29099 , H01L2224/29599 , H01L2924/014 , H01L2924/00
摘要： A method for making an electronic device includes forming an interconnect layer stack on a rigid wafer substrate having a plurality of patterned electrical conductor layers, a dielectric layer between adjacent patterned electrical conductor layers, and at least one solder pad on an uppermost patterned electrical conductor layer. An LCP solder mask having at least one aperture therein alignable with the at least one solder pad is formed. The LCP solder mask and interconnect layer stack are aligned and laminated together. Solder is positioned in the at least one aperture. At least one circuit component is attached to the at least one solder pad using the solder.
摘要翻译：制造电子器件的方法包括在刚性晶片衬底上形成互连层堆叠，所述刚性晶片衬底具有多个图案化电导体层，相邻图案化电导体层之间的介电层，以及位于最上图案化电导体层上的至少一个焊盘。形成具有与至少一个焊盘对准的至少一个孔的LCP焊接掩模。将LCP焊接掩模和互连层堆叠对齐并层压在一起。焊料定位在至少一个孔中。使用焊料将至少一个电路部件连接到至少一个焊盘。

3. 发明授权

US08867219B2 Method of transferring and electrically joining a high density multilevel thin film to a circuitized and flexible organic substrate and associated devices 有权
标题翻译：将高密度多层薄膜转移和电连接到电路化和柔性的有机衬底和相关器件的方法
公开(公告)号：US08867219B2
公开(公告)日：2014-10-21
申请号：US13006973
申请日：2011-01-14
申请人： Michael Weatherspoon , David Nicol , Louis Joseph Rendek, Jr.
发明人： Michael Weatherspoon , David Nicol , Louis Joseph Rendek, Jr.
IPC分类号： H05K1/00 , H01L25/00 , H01L23/538 , H01L25/065 , H01L23/498 , H01L21/683 , H05K1/18 , H01L23/00 , H05K3/46 , H05K3/34
CPC分类号： H01L23/4985 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/5383 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2221/68381 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48 , H01L2224/48091 , H01L2224/48106 , H01L2224/48229 , H01L2224/73204 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/01029 , H01L2924/0105 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1511 , H01L2924/1579 , H05K1/036 , H05K1/0393 , H05K1/115 , H05K1/181 , H05K1/189 , H05K3/32 , H05K3/3436 , H05K3/4038 , H05K3/4602 , H05K3/4632 , H05K3/467 , H05K3/4688 , H05K2201/0133 , H05K2201/0141 , H05K2201/10674 , Y10T29/4913 , Y10T29/49224 , Y10T428/24917 , H01L2924/00 , H01L2924/00012
摘要： A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
摘要翻译：一种用于制造电子器件的方法，包括在牺牲衬底上形成互连层堆叠并且具有多个图案化的导电层，以及在相邻的图案化电导体层之间的介电层。该方法还包括通过液晶聚合物（LCP）衬底的金属间键合层叠和电连接到与牺牲衬底相对的一侧上的互连层堆叠。该方法还包括去除牺牲衬底以暴露最下图案化电导体层，并将至少一个第一器件电耦合到最下图案化电导体层。

4. 发明申请

US20120182701A1 METHOD OF TRANSFERRING AND ELECTRICALLY JOINING A HIGH DENSITY MULTILEVEL THIN FILM TO A CIRCUITIZED AND FLEXIBLE ORGANIC SUBSTRATE AND ASSOCIATED DEVICES 有权
标题翻译：传输和电连接高密度多层薄膜到电路和柔性有机基板及相关器件的方法
公开(公告)号：US20120182701A1
公开(公告)日：2012-07-19
申请号：US13006973
申请日：2011-01-14
申请人： Michael Weatherspoon , David Nicol , Louis Joseph Rendek, JR.
发明人： Michael Weatherspoon , David Nicol , Louis Joseph Rendek, JR.
IPC分类号： H05K1/18 , H01L21/58
CPC分类号： H01L23/4985 , H01L21/4853 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49822 , H01L23/49827 , H01L23/49838 , H01L23/49894 , H01L23/5383 , H01L24/16 , H01L24/17 , H01L24/81 , H01L25/0652 , H01L25/0655 , H01L25/0657 , H01L25/50 , H01L2221/68345 , H01L2221/68359 , H01L2221/68363 , H01L2221/68381 , H01L2224/16225 , H01L2224/16227 , H01L2224/32225 , H01L2224/48 , H01L2224/48091 , H01L2224/48106 , H01L2224/48229 , H01L2224/73204 , H01L2224/81191 , H01L2225/0651 , H01L2225/06517 , H01L2225/06548 , H01L2225/06572 , H01L2924/01029 , H01L2924/0105 , H01L2924/01327 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1431 , H01L2924/1511 , H01L2924/1579 , H05K1/036 , H05K1/0393 , H05K1/115 , H05K1/181 , H05K1/189 , H05K3/32 , H05K3/3436 , H05K3/4038 , H05K3/4602 , H05K3/4632 , H05K3/467 , H05K3/4688 , H05K2201/0133 , H05K2201/0141 , H05K2201/10674 , Y10T29/4913 , Y10T29/49224 , Y10T428/24917 , H01L2924/00 , H01L2924/00012
摘要： A method is for making an electronic device and includes forming an interconnect layer stack on a sacrificial substrate and having a plurality of patterned electrical conductor layers, and a dielectric layer between adjacent patterned electrical conductor layers. The method also includes laminating and electrically joining through an intermetallic bond a liquid crystal polymer (LCP) substrate to the interconnect layer stack on a side thereof opposite the sacrificial substrate. The method further includes removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at least one first device to the lowermost patterned electrical conductor layer.
摘要翻译：一种用于制造电子器件的方法，包括在牺牲衬底上形成互连层堆叠并且具有多个图案化的导电层，以及在相邻的图案化电导体层之间的介电层。该方法还包括通过液晶聚合物（LCP）衬底的金属间键合层叠和电连接到与牺牲衬底相对的一侧上的互连层堆叠。该方法还包括去除牺牲衬底以暴露最下图案化电导体层，并将至少一个第一器件电耦合到最下图案化电导体层。

5. 发明申请

US20120098129A1 METHOD OF MAKING A MULTI-CHIP MODULE HAVING A REDUCED THICKNESS AND RELATED DEVICES 审中-公开
标题翻译：制造具有减小厚度的多芯片模块的方法及相关设备
公开(公告)号：US20120098129A1
公开(公告)日：2012-04-26
申请号：US12910131
申请日：2010-10-22
申请人： Thomas Reed , David Herndon , David Nicol , Michael Weatherspoon
发明人： Thomas Reed , David Herndon , David Nicol , Michael Weatherspoon
IPC分类号： H01L23/48 , H01L23/52 , H01L21/50
CPC分类号： H01L21/563 , H01L21/4857 , H01L21/6835 , H01L24/17 , H01L25/0652 , H01L25/50 , H01L2221/68345 , H01L2224/13099 , H01L2224/16225 , H01L2224/32225 , H01L2224/73204 , H01L2224/81005 , H01L2924/14 , H01L2924/15788 , H05K3/4682 , H05K2201/0154 , H05K2201/10674 , H01L2924/00014 , H01L2924/00
摘要： A method of making a multi-chip module may include forming an interconnect layer stack on a sacrificial substrate. The interconnect layer stack may include patterned electrical conductor layers and a dielectric layer between adjacent patterned electrical conductor layers. The method may further include electrically coupling a first integrated circuit (IC) die in a flip chip arrangement to an uppermost patterned electrical conductor layer, and forming a first underfill dielectric layer between the first IC die and adjacent portions of the interconnect layer stack. The method further may include removing the sacrificial substrate to expose a lowermost patterned electrical conductor layer, and electrically coupling at a second integrated circuit die in a flip chip arrangement to the lowermost patterned electrical conductor layer. Still further, the method may include forming a second underfill dielectric layer between the second IC die and adjacent portions of the interconnect layer stack.
摘要翻译：制造多芯片模块的方法可以包括在牺牲衬底上形成互连层堆叠。互连层堆叠可以包括图案化的导电层和相邻图案化的导电层之间的介电层。该方法还可以包括将倒装芯片布置中的第一集成电路（IC）管芯电耦合到最上面的图案化导电体层，以及在第一IC管芯和互连层堆叠的相邻部分之间形成第一底部填充介电层。该方法还可以包括去除牺牲基板以暴露最下图案化的导电层，并且将第二集成电路管芯以倒装芯片布置电耦合到最下图案化导电层。此外，该方法可以包括在第二IC管芯和互连层堆叠的相邻部分之间形成第二底部填充介电层。

6. 发明授权

US09078033B2 Coax and IP hybrid digital TV and VOD system 有权
标题翻译：同轴电缆和IP混合数字电视和VOD系统
公开(公告)号：US09078033B2
公开(公告)日：2015-07-07
申请号：US12463993
申请日：2009-05-11
申请人： David Nicol , Stuart Clark , Mark Bryars , David Hulse
发明人： David Nicol , Stuart Clark , Mark Bryars , David Hulse
IPC分类号： H04N21/434 , H04N21/442 , H04N21/239 , H04N21/266 , H04N21/238 , H04N21/24 , H04N21/647 , H04N21/262 , H04N21/2385 , H04N7/10 , H04N7/173 , H04N21/214 , H04N21/472 , H04N21/61 , H04N21/643 , H04H20/77
CPC分类号： H04N21/47202 , H04H20/77 , H04N7/10 , H04N7/17318 , H04N7/17336 , H04N21/2143 , H04N21/238 , H04N21/2385 , H04N21/239 , H04N21/24 , H04N21/2402 , H04N21/26216 , H04N21/26616 , H04N21/4345 , H04N21/442 , H04N21/44209 , H04N21/6118 , H04N21/6168 , H04N21/64322 , H04N21/64738
摘要： Methods and apparatus are described for providing digital information and/or data services over hybrid network infrastructures including both IP and coax transmission media.
摘要翻译：描述了用于通过包括IP和同轴电缆传输介质的混合网络基础设施提供数字信息和/或数据服务的方法和装置。

7. 发明授权

US07858044B2 Multi-well plate providing a high-density storage and assay platform 有权
标题翻译：多孔板提供高密度存储和测定平台
公开(公告)号：US07858044B2
公开(公告)日：2010-12-28
申请号：US10837219
申请日：2004-04-30
申请人： Peter J. Coassin , Todd Bennett , Brian Grot , David Nicol
发明人： Peter J. Coassin , Todd Bennett , Brian Grot , David Nicol
IPC分类号： B01L3/00
CPC分类号： B01L3/50851 , B01L9/523 , B01L2200/025 , B01L2200/142 , B01L2300/0829 , B01L2300/12
摘要： A dual-use, high density plate for storage and assays includes a frame including a matrix of wells. The matrix includes preferably 3456 wells with top portions being arranged preferably approximately flush with a plane of the frame. A solvent-resistant material such as cyclo-olefin polymer forms at least the bottom portions of the wells, and preferably the same solvent resistant material forms the frame, although varying from the bottoms of the wells by being rendered opaque. Evaporation control wells are preferably included at the periphery of the matrix for reducing effects of evaporation on edge wells.
摘要翻译：用于储存和测定的双重用途的高密度板包括包括孔的矩阵的框架。该基质优选包括3456个孔，顶部优选地与框架的平面大致齐平。耐溶剂材料如环烯烃聚合物至少形成孔的底部，并且优选地，相同的耐溶剂材料形成框架，尽管通过变得不透明而从孔的底部变化。蒸发控制孔优选包含在基质的周边，以减少边缘孔蒸发的影响。

8. 发明申请

US20100305982A1 SYSTEM AND METHOD FOR DISPLAYING, SELECTING AND PURCHASING SERVICES 审中-公开
标题翻译：用于显示，选择和购买服务的系统和方法
公开(公告)号：US20100305982A1
公开(公告)日：2010-12-02
申请号：US12601675
申请日：2008-05-26
申请人： David Hulse , David Nicol
发明人： David Hulse , David Nicol
IPC分类号： G06Q30/00 , G06Q10/00 , H04N7/18 , G06F7/04 , G06F3/048 , G06F17/30
CPC分类号： G06Q20/12 , G06Q10/02 , G06Q20/20 , G06Q30/06
摘要： The system comprises a user interface (3) and middleware (5) which, in turn, comprises control software (7), a database (9) and application programming interfaces (API) (6 and 11a 11d). The middleware (5) is connected to an electronic point of sale device or system (EPOS) (13) as well as sub-systems (15,17,19) such as dedicated booking systems which allow hotel guests to book, for example, the spa (15), the restaurant (17) and the golf course (19). The information provided to the middleware (5) from the sub-systems can be either static information or dynamic information. The system and method allow a hotel guest to access a range of goods and services available in the hotel through a single user interface (3), typically the graphical user interface (GUI) provided on a television or other visual display unit (VDU) that is available to the hotel guest in their room.
摘要翻译：该系统包括用户接口（3）和中间件（5），其又包括控制软件（7），数据库（9）和应用编程接口（API）（6和11a 11d）。中间件（5）连接到电子销售点设备或系统（EPOS）（13）以及子系统（15,17,19），例如允许酒店客人预订的专用预订系统，水疗中心（15），餐厅（17）和高尔夫球场（19）。从子系统提供给中间件（5）的信息可以是静态信息或动态信息。该系统和方法允许酒店客人通过单个用户界面（3）访问酒店可用的一系列商品和服务，通常是在电视机或其他视觉显示单元（VDU）上提供的图形用户界面（GUI）可在客房内的酒店客人使用。

9. 发明授权

US07258253B2 Method and system for precise dispensation of a liquid 有权
标题翻译：精确分配液体的方法和系统
公开(公告)号：US07258253B2
公开(公告)日：2007-08-21
申请号：US10837221
申请日：2004-04-30
申请人： David Nicol , Binh Nguyen , Peter J. Coassin
发明人： David Nicol , Binh Nguyen , Peter J. Coassin
IPC分类号： B67D5/08
CPC分类号： B01L3/0241 , B01L3/0275 , B01L2300/0838 , B01L2400/0439 , B01L2400/0487
摘要： Devices, systems, and methods for the precise dispensation of small volumes of liquids are presented. A fluid microdispenser comprises a liquid-filled tube, an actuator coupled to the tube, and a tip at one end of the tube. When the actuator applies an actuation pressure, a precise volume of liquid is ejected from the orifice of the tip. The orifice is manufactured to control the volume of liquid ejected by each actuation and, therefore, may have a diameter smaller than that of the liquid-filled tube. The invention comprises systems, methods, and devices so that the inner diameter of the liquid-filled tube is decreased (tapered) to that of the orifice so as to maximize transmission to the orifice of the pressure generated by the actuation stimulus. This enables the volume of liquid ejected by each stimulus to be reproducibly controlled by the amplitude of the actuation stimulus.
摘要翻译：提出了用于精确分配少量液体的装置，系统和方法。流体微分配器包括充满液体的管，耦合到管的致动器和管的一端的尖端。当致动器施加致动压力时，精确体积的液体从尖端的孔喷出。制造孔口以控制由每次致动喷射的液体的体积，因此可以具有比液体填充管的直径更小的直径。本发明包括系统，方法和装置，使得充满液体的管的内径减小（锥形）到孔口的内径，从而最大程度地使通过致动刺激产生的压力对孔的传递。这使得可以通过致动刺激的振幅可再现地控制由每个刺激喷射的液体的体积。

10. 发明申请

US20050032241A1 Reagent dispenser and dispensing method 审中-公开
标题翻译：试剂分配器和分配方法
公开(公告)号：US20050032241A1
公开(公告)日：2005-02-10
申请号：US10789183
申请日：2004-02-26
申请人： Peter Coassin , Javier Flores , David Nicol , Troy Peterson , Philip Salzmann , T. Vuong
发明人： Peter Coassin , Javier Flores , David Nicol , Troy Peterson , Philip Salzmann , T. Vuong
IPC分类号： B01D20060101 , B01J4/00 , B01L3/02 , G01N35/10
CPC分类号： B01L3/0241 , B01J4/001 , G01N35/1002 , G01N35/1009 , G01N35/1074 , Y10T436/2575
摘要： A method and apparatus is disclosed for automated on-the-fly dispensing of reagents. The apparatus includes a detachable reagent dispensing module supported by a support frame. The dispensing module includes a self-contained pressurized fluid delivery subsystem that facilitates efficient attachment and detachment of the module, including pressurized reagent containers and associated accessories arranged such that each reagent container has a discrete fluid path terminating at a corresponding discrete reagent dispensing tip. The dispensing tips are supported in a common dispensing head, and are arranged geometrically such that the centers of the dispensing tips are separated by distances corresponding to relevant dimensions of particular assay plates to be used therewith. Such a geometric arrangement allows for dispensing of multiple reagents substantially simultaneously into multiple corresponding target wells of the assay plate, efficiently and precisely.
摘要翻译：公开了用于自动化的试剂分配的方法和装置。该装置包括由支撑框架支撑的可拆卸的试剂分配模块。分配模块包括独立的加压流体递送子系统，其有助于模块的有效附接和分离，包括加压的试剂容器和相关联的附件，其布置成使得每个试剂容器具有终止于相应的分立的试剂分配尖端的离散流体路径。分配尖端被支撑在共同的分配头中，并且几何地布置成使得分配尖端的中心与对应于要与其一起使用的特定测定板的相关尺寸相对应的距离分开。这种几何布置允许基本上同时将多个试剂分配到分析板的多个相应的目标孔中，并且被有效和准确地分配。

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