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    • 7. 发明授权
    • Method of packaging high voltage components with low voltage components
in a small space
    • 在小空间内用高压元件封装高压元件的方法
    • US5699231A
    • 1997-12-16
    • US562615
    • 1995-11-24
    • Abdul M. ElHatemMohammad M. Mojarradi
    • Abdul M. ElHatemMohammad M. Mojarradi
    • H05K1/02H05K3/28H05K5/06H05K5/00
    • H05K5/064H05K1/0256H05K1/0262H05K3/284H05K2201/09063H05K2201/09072H05K2201/10689
    • An electronic circuit package in which several high voltage components are packaged along with low voltage components using standard circuit boards and minimizing the space needed for the entire assembly. A miniature circuit board, constructed of standard circuit board material, is used to mount several electronic components, some of which require high voltages. To meet isolation requirements, requiring a dielectric strength more than that provided by the board itself, between the high and low voltage nodes the circuit board incorporates slots or other cut out shapes in the board. The slots or other cut out shapes provide two functions. The first use for the slots or other cut out shapes is to prevent charge migration on the surface of the board between high and low voltage nodes. This is accomplished by placing the slots or other cut out shapes between high and low voltage nodes. The circuit board is then encapsulated within a potting material. The slots or other cut out shapes perform a second function of allowing the potting material to flow around and through the board to facilitate full encapsulation of the board and the electronic devices on the board. Several of the slots or other cut out shapes are placed in the board directly underneath the electronic devices mounted on the board to aid in allowing the potting material to completely surround and encapsulate the electronic devices.
    • 一种电子电路封装,其中使用标准电路板将几个高压部件与低电压部件一起封装,并使整个组件所需的空间最小化。 由标准电路板材料构成的小型电路板用于安装几个电子部件,其中一些需要高电压。 为了满足隔离要求,要求绝缘强度大于电路板本身提供的绝缘强度,在高压节点和低电压节点之间,电路板在板中集成了槽或其他切割形状。 槽或其他切割形状提供两个功能。 插槽或其他切割形状的第一个用途是防止电池在高压节点和低压节点之间的表面上的电荷迁移。 这通过在高电压节点和低电压节点之间放置槽或其他切割形状来实现。 然后将电路板封装在灌封材料内。 槽或其他切割形状执行允许灌封材料绕过板并流过板的第二功能,以便板和板上的电子器件完全封装。 几个槽或其他切割形状被放置在板上直接位于安装在板上的电子装置下面,以帮助灌封材料完全包围和封装电子装置。
    • 10. 发明授权
    • Multiple driver power supply
    • 多驱动电源
    • US08446741B1
    • 2013-05-21
    • US13190261
    • 2011-07-25
    • Laurence P. SadwickRuey-Jen HwuMohammad M. Mojarradi
    • Laurence P. SadwickRuey-Jen HwuMohammad M. Mojarradi
    • H02M5/27
    • H02M3/335H02M3/33561H02M7/12
    • A power supply includes a power source having at least one power source output, and a plurality of drivers connected to the at least one power source output. At least one of the plurality of drivers includes a bridge network having a first switch, a second switch and a bridge network output. The first switch is connected between the at least one power source output and the bridge network output. The second switch is connected between the bridge network output and a ground. The bridge network further includes at least one control input connected to the second switch. The bridge network is adapted to change a state of the first switch based on a state of the second switch.
    • 电源包括具有至少一个电源输出的电源和连接到所述至少一个电源输出的多个驱动器。 多个驱动器中的至少一个包括具有第一开关,第二开关和桥接网络输出的桥接网络。 第一开关连接在至少一个电源输出端和桥接网络输出端之间。 第二个开关连接在桥网输出和地之间。 桥接网络还包括连接到第二交换机的至少一个控制输入。 桥接网络适于基于第二交换机的状态来改变第一交换机的状态。