会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 1. 发明授权
    • Method of controlling internal voltage and multi-chip package memory prepared using the same
    • 控制内部电压的方法和使用其制备的多芯片封装存储器
    • US07957217B2
    • 2011-06-07
    • US12266716
    • 2008-11-07
    • Moon-sook ParkHoe-ju ChungJung-bae Lee
    • Moon-sook ParkHoe-ju ChungJung-bae Lee
    • G11C8/00
    • G11C5/147G11C5/04
    • The invention relates generally to a multi-chip package (MCP) memory device, and more particularly, but without limitation, to a MCP memory device having a reduced size. In one embodiment, the MCP memory device includes: a transfer memory chip; and a plurality of memory chips coupled to the transfer memory chip, each of the plurality of memory chips including an internal voltage generating circuit, the transfer memory chip configured to receive a plurality of command signals from outside the MCP memory device, the transfer memory chip further configured to output a plurality of control signals to the plurality of memory chips based on the plurality of command signals. Embodiments of the invention also relate to a method of controlling an internal voltage of the MCP memory device.
    • 本发明一般涉及一种多芯片封装(MCP)存储器件,尤其涉及但不限于具有减小尺寸的MCP存储器件。 在一个实施例中,MCP存储器件包括:传送存储器芯片; 以及多个存储器芯片,其耦合到所述传送存储器芯片,所述多个存储器芯片中的每一个包括内部电压产生电路,所述传送存储器芯片被配置为从所述MCP存储器设备的外部接收多个命令信号,所述传送存储器芯片 还被配置为基于所述多个命令信号将多个控制信号输出到所述多个存储器芯片。 本发明的实施例还涉及一种控制MCP存储器件的内部电压的方法。