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1. 发明授权

US09693453B2 Wiring board 有权
公开(公告)号：US09693453B2
公开(公告)日：2017-06-27
申请号：US14019863
申请日：2013-09-06
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Seiji Mori , Tatsuya Ito
IPC分类号： H05K1/00 , H05K1/09 , H01L23/00 , H05K3/28 , H05K3/40 , H01L21/56 , H05K3/24
CPC分类号： H05K1/092 , H01L21/563 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L24/81 , H01L2224/13101 , H01L2224/16238 , H01L2224/27013 , H01L2224/73204 , H01L2224/81193 , H01L2224/81411 , H01L2224/81455 , H01L2224/92125 , H05K3/243 , H05K3/28 , H05K3/4007 , H05K2201/0769 , H05K2201/10674 , H05K2201/10977 , H05K2203/0597 , H01L2924/014 , H01L2924/00014
摘要： A wiring board includes a base layer, a plurality of connection terminals and a surface layer. The base layer is electrically insulative. The plurality of connection terminals are conductive and formed on the base layer. The surface layer is electrically insulative, and fills gaps between the plurality of connection terminals on the base layer. The connection terminals include a base portion made of a conductive first metal and a coating portion made of a conductive second metal that is different from the first metal. The coating portion penetrates the surface layer, and coats the base portion to the base layer.

2. 发明授权

US09578743B2 Circuit board 有权
标题翻译：电路板
公开(公告)号：US09578743B2
公开(公告)日：2017-02-21
申请号：US14858409
申请日：2015-09-18
申请人： NGK SPARK PLUG CO., LTD.
发明人： Makoto Nagai , Seiji Mori , Tatsuya Ito
IPC分类号： H05K1/00 , H05K1/11 , H05K1/02 , H05K1/03
CPC分类号： H05K1/11 , H01L2224/16225 , H05K1/0298 , H05K1/0313 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K3/4069 , H05K3/4644 , Y02P70/611
摘要： A circuit board is provided that includes an outermost conductor layer including a plurality of terminals for flip-chip bonding and an outermost resin insulating layer defining a first opening and a second opening in an electronic-component mounting region. One of a power supply terminal and a ground terminal is exposed in the first opening. A plurality of signal terminals are exposed in the second opening. The resin insulating layer includes a reinforcing portion that defines an inner bottom surface of the second opening. A height of a portion of the terminal exposed in the first opening, the portion projecting from an inner bottom surface of the first opening, is greater than a height of portions of the terminals exposed in the second opening, the portions projecting from the inner bottom surface of the second opening.
摘要翻译：提供了一种电路板，其包括最外面的导体层，其包括用于倒装芯片接合的多个端子和限定电子部件安装区域中的第一开口和第二开口的最外层树脂绝缘层。电源端子和接地端子中的一个在第一开口中露出。多个信号端子在第二开口中露出。树脂绝缘层包括限定第二开口的内底面的加强部。在第一开口中暴露的端子的部分的高度，从第一开口的内底表面突出的部分的高度大于在第二开口中露出的端子的部分的高度，从内底部突出的部分第二个开口的表面。

3. 发明授权

US09516751B2 Wiring board and method for manufacturing same 有权
标题翻译：接线板及其制造方法
公开(公告)号：US09516751B2
公开(公告)日：2016-12-06
申请号：US14417751
申请日：2013-05-17
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Makoto Nagai , Seiji Mori , Tomohiro Nishida , Makoto Wakazono , Tatsuya Ito
IPC分类号： H05K1/11 , G03F7/20 , G03F7/30 , H05K1/02 , G03F7/038 , H01L23/498 , H05K3/34 , H05K3/46
CPC分类号： H05K1/111 , G03F7/038 , G03F7/20 , G03F7/2024 , G03F7/30 , H01L23/49822 , H01L2224/16237 , H05K1/0298 , H05K3/3436 , H05K3/3452 , H05K3/4644 , H05K2201/09409 , H05K2201/09427 , H05K2201/09709 , H05K2201/09845 , H05K2201/099 , H05K2201/10674 , H05K2203/058 , H05K2203/0594 , H05K2203/1476
摘要： To provide a wiring board excellent in connection reliability with a semiconductor chip. A first buildup layer 31 where resin insulating layers 21 and 22 and a conductor layer 24 are laminated is formed at a substrate main surface 11 side of an organic wiring board 10. The conductor layer 24 for an outermost layer in the first buildup layer 31 includes a plurality of connecting terminal portions 41 for flip-chip mounting a semiconductor chip. The plurality of connecting terminal portions 41 is exposed through an opening portion 43 of a solder resist layer 25. Each connecting terminal portion 41 includes a connection region 51 for a semiconductor chip and a wiring region 52 disposed to extend from the connection region 51 along the planar direction. The solder resist layer 25 includes, within the opening portion 43, a side-surface covering portion 55 that covers the side surface of the connecting terminal portion 41 and a projecting wall portion 56 that is integrally formed with the side-surface covering portion 55 and disposed to project so as to intersect with the connection region 51.
摘要翻译：提供与半导体芯片的连接可靠性优异的布线板。在有机布线板10的基板主表面11侧形成有树脂绝缘层21,22和导体层24层叠的第一堆积层31.第一堆积层31中的最外层的导体层24包括多个用于倒装芯片安装半导体芯片的连接端子部分41。多个连接端子部分41通过阻焊层25的开口部分43露出。每个连接端子部分41包括用于半导体芯片的连接区域51和从连接区域51延伸的布线区域52 平面方向。阻焊层25在开口部43内具有覆盖连接端子部41的侧面的侧面覆盖部55和与侧面覆盖部55一体形成的突出壁部56，被设置为突出以与连接区域51相交。

4. 发明申请

US20150216059A1 WIRING BOARD AND MANUFACTURING METHOD OF THE SAME 有权
标题翻译：接线板及其制造方法
公开(公告)号：US20150216059A1
公开(公告)日：2015-07-30
申请号：US14237065
申请日：2013-05-27
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Makoto Nagai , Tatsuya Ito , Seiji Mori , Makoto Wakazono , Tomohiro Nishida
IPC分类号： H05K3/40 , H05K1/03 , H05K3/46 , H05K1/02
CPC分类号： H05K3/4007 , H01L21/4846 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/81 , H01L2224/10175 , H01L2224/1134 , H01L2224/1146 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/8114 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81464 , H01L2224/81815 , H01L2924/12042 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K1/0298 , H05K1/0366 , H05K3/28 , H05K3/3452 , H05K3/4661 , H05K3/4688 , H05K2201/09845 , H05K2201/09881 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.
摘要翻译：为了提供布线基板，其中布线导体被形成在层压体的最外层上的精确且刚性的坝部可靠地保护，并且与半导体芯片的连接可靠性优异。构成该布线基板的层叠体具有作为最外层的导体层的多个连接端子部和布线导体。布线导体布置在预定位置，通过多个连接端子部分之间用于倒装芯片安装半导体芯片。层叠体的最外层的树脂绝缘层具有阻挡部和加强部。大坝部分覆盖布线导体。加强部分形成在布线导体和与布线导体相邻的连接端子部分之间，比坝部的高度低。加强部分与坝部分的侧表面连接。

5. 发明授权

US09538650B2 Wiring board having an opening with an angled surface 有权
标题翻译：接线板具有带有倾斜表面的开口
公开(公告)号：US09538650B2
公开(公告)日：2017-01-03
申请号：US14416116
申请日：2013-08-23
申请人： NGK SPARK PLUG CO., LTD.
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
IPC分类号： H05K1/11 , H01L21/56 , H01L23/14 , H01L23/498 , H01L23/12 , H01L23/13 , H01L23/00 , H05K3/34
CPC分类号： H05K1/11 , H01L21/563 , H01L23/12 , H01L23/13 , H01L23/145 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/1161 , H01L2224/131 , H01L2224/13113 , H01L2224/16238 , H01L2224/2919 , H01L2224/32237 , H01L2224/73204 , H01L2224/81193 , H01L2224/81385 , H01L2224/81447 , H01L2224/81815 , H01L2224/83102 , H01L2224/83385 , H01L2224/8385 , H01L2924/3512 , H01L2924/3841 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09018 , H05K2201/10977 , H05K2203/0594 , H05K2203/0597 , Y02P70/611 , H01L2924/00014 , H01L2924/014
摘要： In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.
摘要翻译：在布线基板中，由于底部填充不充分而形成空隙被抑制。布线基板包括绝缘基底层，层叠在基底层上的绝缘层和从开口内的绝缘层突出的导电连接端子。绝缘层具有带有开口的第一表面和位于开口内的第二表面，并且相对于第一表面朝向基底层凹陷。第二表面从开口内的第一表面延伸到连接端。在沿绝缘层层叠在基层上的层叠方向延伸的平坦面的切割面上，在从任意点延伸的法线之间形成大于0°但小于90°的角度在所述第二表面上朝向所述绝缘层的外侧，以及从所述任意点朝向所述连接端子平行于所述第一表面延伸的平行线。

6. 发明授权

US09420703B2 Wiring board and manufacturing method of the same 有权
标题翻译：接线板及其制造方法相同
公开(公告)号：US09420703B2
公开(公告)日：2016-08-16
申请号：US14237065
申请日：2013-05-27
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Makoto Nagai , Tatsuya Ito , Seiji Mori , Makoto Wakazono , Tomohiro Nishida
IPC分类号： H05K1/00 , H05K3/40 , H01L23/498 , H01L21/48 , H01L23/00 , H05K3/34 , H05K1/02 , H05K1/03 , H05K3/46 , H05K3/28
CPC分类号： H05K3/4007 , H01L21/4846 , H01L23/49822 , H01L23/49827 , H01L23/49894 , H01L24/81 , H01L2224/10175 , H01L2224/1134 , H01L2224/1146 , H01L2224/131 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/16227 , H01L2224/16237 , H01L2224/8114 , H01L2224/81411 , H01L2224/81444 , H01L2224/81455 , H01L2224/81464 , H01L2224/81815 , H01L2924/12042 , H01L2924/1517 , H01L2924/15311 , H01L2924/15312 , H01L2924/15313 , H01L2924/15787 , H01L2924/15788 , H01L2924/1579 , H01L2924/381 , H01L2924/3841 , H05K1/0298 , H05K1/0366 , H05K3/28 , H05K3/3452 , H05K3/4661 , H05K3/4688 , H05K2201/09845 , H05K2201/09881 , H05K2201/10674 , H01L2924/00015 , H01L2924/00014 , H01L2924/014 , H01L2924/00
摘要： To provide a wiring board in which wiring conductors are securely protected by a precise and rigid dam portion formed on an outermost layer of a laminate and that is excellent in connection reliability with a semiconductor chip. A laminate that configures this wiring board includes multiple connection terminal portions and wiring conductors as a conductor layer of the outermost layer. The wiring conductors are arranged at predetermined positions, passing through between multiple connection terminal portions for flip-chip mounting a semiconductor chip. A resin insulating layer of the outermost layer of the laminate has a dam portion and a reinforcement portion. The dam portion covers the wiring conductors. The reinforcement portion is formed, between the wiring conductor and the connection terminal portion that is adjacent to the wiring conductor, lower than a height of the dam portion. The reinforcement portion is concatenated with a side surface of the dam portion.
摘要翻译：为了提供布线基板，其中布线导体被形成在层压体的最外层上的精确且刚性的坝部可靠地保护，并且与半导体芯片的连接可靠性优异。构成该布线基板的层叠体具有作为最外层的导体层的多个连接端子部和布线导体。布线导体布置在预定位置，通过多个连接端子部分之间用于倒装芯片安装半导体芯片。层叠体的最外层的树脂绝缘层具有阻挡部和加强部。大坝部分覆盖布线导体。加强部分形成在布线导体和与布线导体相邻的连接端子部分之间，比坝部的高度低。加强部分与坝部分的侧表面连接。

7. 发明申请

US20150223332A1 WIRING BOARD 有权
标题翻译：接线板
公开(公告)号：US20150223332A1
公开(公告)日：2015-08-06
申请号：US14416116
申请日：2013-08-23
申请人： NGK SPARK PLUG CO., LTD.
发明人： Tomohiro Nishida , Seiji Mori , Makoto Wakazono
IPC分类号： H05K1/11
CPC分类号： H05K1/11 , H01L21/563 , H01L23/12 , H01L23/13 , H01L23/145 , H01L23/49894 , H01L24/11 , H01L24/13 , H01L24/16 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/81 , H01L24/83 , H01L2224/1161 , H01L2224/131 , H01L2224/13113 , H01L2224/16238 , H01L2224/2919 , H01L2224/32237 , H01L2224/73204 , H01L2224/81193 , H01L2224/81385 , H01L2224/81447 , H01L2224/81815 , H01L2224/83102 , H01L2224/83385 , H01L2224/8385 , H01L2924/3512 , H01L2924/3841 , H05K1/111 , H05K3/3436 , H05K3/3452 , H05K2201/09018 , H05K2201/10977 , H05K2203/0594 , H05K2203/0597 , Y02P70/611 , H01L2924/00014 , H01L2924/014
摘要： In a wiring substrate, formation of voids due to underfill filling failure is suppressed. A wiring substrate includes an insulating base layer, an insulating layer laminated on the base layer, and an electrically conductive connection terminal projecting from the insulating layer inside an opening. The insulating layer has a first surface with an opening, and a second surface located within the opening and being concave toward the base layer in relation to the first surface. The second surface extends from the first surface to the connection terminal inside the opening. On a cut surface which is a flat surface extending along a lamination direction in which the insulating layer is laminated on the base layer, an angle which is larger than 0° but smaller than 90° is formed between a normal line extending from an arbitrary point on the second surface toward the outside of the insulating layer and a parallel line extending from the arbitrary point toward the connection terminal in parallel to the first surface.
摘要翻译：在布线基板中，由于底部填充不充分而形成空隙被抑制。布线基板包括绝缘基底层，层叠在基底层上的绝缘层和从开口内的绝缘层突出的导电连接端子。绝缘层具有带有开口的第一表面和位于开口内的第二表面，并且相对于第一表面朝向基底层凹陷。第二表面从开口内的第一表面延伸到连接端。在沿绝缘层层叠在基层上的层叠方向延伸的平坦面的切割面上，在从任意点延伸的法线之间形成大于0°但小于90°的角度在所述第二表面上朝向所述绝缘层的外侧，以及从所述任意点朝向所述连接端子平行于所述第一表面延伸的平行线。

8. 发明授权

US10123415B2 Wiring substrate and production method therefor 有权
公开(公告)号：US10123415B2
公开(公告)日：2018-11-06
申请号：US14416254
申请日：2013-07-29
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Seiji Mori , Tatsuya Ito
IPC分类号： H05K1/11 , H05K3/40 , H05K1/03 , H05K1/09 , H05K3/20 , H05K3/34
摘要： A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.

9. 发明授权

US09699905B2 Wiring board 有权
公开(公告)号：US09699905B2
公开(公告)日：2017-07-04
申请号：US14236038
申请日：2013-07-12
申请人： NGK SPARK PLUG CO., LTD.
发明人： Tomohiro Nishida , Makoto Wakazono , Seiji Mori
IPC分类号： H05K1/18 , H05K3/28 , H05K3/40 , H01L23/498 , H05K1/11 , H05K3/34 , H05K3/46
CPC分类号： H05K1/181 , H01L23/498 , H01L23/49822 , H01L2924/0002 , H05K1/113 , H05K3/28 , H05K3/3436 , H05K3/4007 , H05K3/4602 , H05K2201/09672 , H05K2201/098 , H05K2201/2072 , H05K2203/0597 , H01L2924/00
摘要： To provide a wiring board ensuring adhesion strength of a connecting terminal to reduce the connecting terminal from being fallen over or peeled off under fabrication process. The wiring board according to the present invention includes a laminated body where one or more layer of each of an insulating layer and a conductor layer are laminated. The wiring board includes a plurality of connecting terminals formed separately from one another on the laminated body and a filling member filled up between the plurality of connecting terminals. The filling member is filled up to a position lower than a height of the plurality of connecting terminals. The connecting terminals has a cross section with a trapezoidal shape where a width of a first principal surface on a side contacting the laminated body is wider than a width of a second principal surface facing the first principal surface.

10. 发明申请

US20150189752A1 WIRING SUBSTRATE AND PRODUCTION METHOD THEREFOR 审中-公开
标题翻译：接线基板及其制作方法
公开(公告)号：US20150189752A1
公开(公告)日：2015-07-02
申请号：US14416254
申请日：2013-07-29
申请人： NGK SPARK PLUG CO., LTD.
发明人： Takahiro Hayashi , Seiji Mori , Tatsuya Ito
IPC分类号： H05K1/11 , H05K1/03 , H05K3/20 , H05K1/09
CPC分类号： H05K1/119 , H05K1/0326 , H05K1/0346 , H05K1/09 , H05K3/20 , H05K3/3452 , H05K3/3473 , H05K3/4007 , H05K2201/0367 , H05K2201/10674 , H05K2203/04
摘要： A wiring substrate includes a surface layer having electrical insulation properties and a connection terminal having electrical conduction properties and protruding from the surface layer. The connection terminal includes a base portion, a covering portion and a filling portion. The base portion of the connection terminal is made of an electrically conductive first metal and located adjacent to the surface layer so as to extend through the surface layer and protrude from the surface layer. The covering portion of the connection terminal is made of an electrically conductive second metal having a melting point lower than that of the first metal and located so as to cover the base portion. The filling portion of the connection terminal is made of at least one of the second metal and an alloy containing the first and second metals and located so as to fill a hollow in the base portion.
摘要翻译：布线基板包括具有电绝缘性的表面层和具有导电特性并从表面层突出的连接端子。连接端子包括基部，覆盖部和填充部。连接端子的基部由导电的第一金属制成，并且位于表面层附近，从而延伸穿过表面层并从表面层突出。连接端子的覆盖部分由具有低于第一金属的熔点的导电的第二金属制成，并且被定位成覆盖基部。连接端子的填充部分由第二金属和包含第一和第二金属的合金中的至少一个制成，并且被定位成填充基部中的中空部。

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