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1. 发明申请

US20230138592A1 METHOD FOR MANUFACTURING LIGHT-EMITTING ELEMENT 有权
公开(公告)号：US20230138592A1
公开(公告)日：2023-05-04
申请号：US17964034
申请日：2022-10-12
申请人： NICHIA CORPORATION , HAMAMATSU PHOTONICS K.K.
发明人： Naoto INOUE , Minoru YAMAMOTO , Taichi OKUBO , Hiroaki TAMEMOTO , Ryota SUGIO , Yusuke SEKIMOTO
IPC分类号： H01L33/00
摘要： A method for manufacturing a light-emitting element includes preparing a wafer; a laser beam irradiation process; and a separation process. The laser beam irradiation process includes a first irradiation process of forming a plurality of first modified portions, and a second irradiation process of forming a plurality of second modified portions. The second modified portions are formed in the second irradiation process so that a length in a thickness direction of the sapphire substrate of the second modified portions is greater than a length in the thickness direction of the first modified portions.

2. 发明申请

US20220371130A1 LASER PROCESSING DEVICE, AND METHOD FOR MANUFACTURING CHIP 有权
公开(公告)号：US20220371130A1
公开(公告)日：2022-11-24
申请号：US17763379
申请日：2020-08-07
申请人： NICHIA CORPORATION , HAMAMATSU PHOTONICS K.K.
发明人： Hiroaki TAMEMOTO , Minoru YAMAMOTO , Yusuke SEKIMOTO , Ryota SUGIO , Tominori NAKAMURA
IPC分类号： B23K26/53 , B23K26/046 , B23K26/0622
摘要： This laser processing apparatus is for forming modified regions in an object, which includes a sapphire substrate having a C-plane as a main surface, along cutting lines by focusing laser light on the object, and is provided with a laser light source, a spatial light modulator, and a focusing optical system. The spatial light modulator performs aberration correction by a first aberration correction amount smaller than an ideal aberration correction amount when the modified region is formed along a first cutting line along an a-axis direction of the sapphire substrate, and performs aberration correction by a second aberration correction amount smaller than the ideal aberration correction amount and different from the first aberration correction amount when the modified region is formed along a second cutting line along an in-axis direction of the sapphire substrate.

3. 发明申请

US20160052085A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD 有权
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20160052085A1
公开(公告)日：2016-02-25
申请号：US14778746
申请日：2014-03-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： Daisuke KAWAGUCHI , Makoto NAKANO , Ryota SUGIO , Tsubasa HIROSE , Keisuke ARAKI
IPC分类号： B23K26/00 , B23K26/53 , B23K26/06
CPC分类号： B23K26/53 , B23K26/0643 , B23K26/0648 , B23K26/0736 , B23K26/40 , B23K2103/50 , B28D5/00 , C03B33/0222 , C03B33/07 , G02B3/08 , G02B5/001 , Y02P40/57
摘要： A laser processing device converges laser light at an object to be processed so as to form a modified region within the object along a line to cut. The laser processing device comprises a laser light source emitting the laser light, a spatial light modulator modulating the laser light emitted from the laser light source, and a converging optical system converging the laser light modulated by the spatial light modulator at the object. The spatial light modulator displays an axicon lens pattern as a modulation pattern so as to form converging points at a plurality of positions juxtaposed close to each other along a laser light irradiation direction.
摘要翻译：激光加工装置将激光会聚在待处理物体上，以沿着切割线在物体内形成改质区域。激光加工装置包括发射激光的激光光源，调制从激光光源发射的激光的空间光调制器，以及将由空间光调制器调制的激光会聚在物体处的会聚光学系统。空间光调制器将旋转透镜图案显示为调制图案，以便沿着激光照射方向在彼此靠近并列的多个位置处形成会聚点。

4. 发明申请

US20160052084A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD 审中-公开
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20160052084A1
公开(公告)日：2016-02-25
申请号：US14778621
申请日：2014-03-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： Daisuke KAWAGUCHI , Makoto NAKANO , Ryota SUGIO , Tsubasa HIROSE , Keisuke ARAKI
IPC分类号： B23K26/00 , B23K26/06 , B23K26/53 , B23K26/064
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/03 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0853 , B23K26/53 , B23K2103/52 , B23K2103/54 , B23K2103/56
摘要： The laser processing device comprises a laser light source emitting a laser light, a converging optical system converging the laser light at an object to be processed, and an aberration providing part for imparting an aberration to the laser light converged at the object by the converging optical system. In an optical axis direction of the laser light, letting a reference aberration range be a range of a converging-induced aberration as an aberration occurring at a position where the laser light is converged as a result of converging the laser light at the object, the aberration providing part imparts a first aberration to the laser light such that the laser light has an elongated range longer than the reference aberration range in the optical axis direction as an aberration range and an intensity distribution in the optical axis direction with a continuous undulation in the elongated range.
摘要翻译：激光加工装置包括发射激光的激光光源，将激光会聚在待处理对象的会聚光学系统，以及用于通过会聚光学会聚在物体上的激光赋予像差的像差提供部系统。在激光的光轴方向上，通过使参考像差范围成为会聚诱发像差的范围，作为在激光会聚在激光的对象的位置处发生的像差，像差提供部分给激光赋予第一像差，使得激光具有比光轴方向上的参考像差范围更长的细长范围，作为像差范围，并且在光轴方向上的强度分布与连续起伏伸长范围。

5. 发明申请

US20160052088A1 LASER MACHINING DEVICE AND LASER MACHINING METHOD 审中-公开
标题翻译：激光加工设备和激光加工方法
公开(公告)号：US20160052088A1
公开(公告)日：2016-02-25
申请号：US14778766
申请日：2014-03-13
申请人： HAMAMATSU PHOTONICS K.K.
发明人： Daisuke KAWAGUCHI , Makoto NAKANO , Ryota SUGIO , Tsubasa HIROSE , Keisuke ARAKI
IPC分类号： B23K26/0622 , B23K26/06 , B23K26/53 , B23K26/00
CPC分类号： B23K26/0624 , B23K26/0006 , B23K26/03 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0853 , B23K26/53 , B23K2103/52 , B23K2103/54 , B23K2103/56
摘要： A laser processing device forms a modified region in an object to be processed by converging ultrashort pulse laser light at the object and comprises a laser light source emitting the laser light, a converging optical system converging the laser light emitted from the laser light source at the object, and an aberration providing part imparting an aberration to the laser light converged at the object by the converging optical system. In an optical axis direction of the laser light, letting a reference aberration range be a range of a converging-induced aberration as an aberration occurring at a position where the laser light is converged as a result of converging the laser light at the object, the aberration providing part imparts a first aberration to the laser light such that the laser light has an elongated range longer than the reference aberration range in the optical axis direction as an aberration range and an intensity distribution in the optical axis direction with a continuous undulation in the elongated range.
摘要翻译：激光加工装置通过在物体上会聚超短脉冲激光来形成待处理物体中的改质区域，并且包括发射激光的激光光源，会聚光学系统，将从激光源射出的激光会聚在物体和通过会聚光学系统对会聚于物体的激光赋予像差的像差提供部。在激光的光轴方向上，通过使参考像差范围成为会聚诱发像差的范围，作为在激光会聚在激光的对象的位置处发生的像差，像差提供部分给激光赋予第一像差，使得激光具有比光轴方向上的参考像差范围更长的细长范围，作为像差范围，并且在光轴方向上的强度分布与连续起伏伸长范围。

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