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1. 发明授权

US10558204B2 System and method for scalable real-time micro-object position control with the aid of a digital computer 有权
公开(公告)号：US10558204B2
公开(公告)日：2020-02-11
申请号：US15469433
申请日：2017-03-24
申请人： Palo Alto Research Center Incorporated
发明人： Ion Matei , Jeng Ping Lu , Saigopal Nelaturi , Julie A. Bert , Lara S. Crawford , Armin R. Volkel , Eugene M. Chow
IPC分类号： G05D3/14 , G05B19/418 , G05B17/02 , G06T7/194 , G06T7/73 , G06T7/155 , H04N7/18
摘要： The system and method described below allow for real-time control over positioning of a micro-object. A movement of at least one micro-object suspended in a medium can be induced by a generation of one or more forces by electrodes proximate to the micro-object. Prior to inducing the movement, a simulation is used to develop a model describing a parameter of an interaction between each of the electrodes and the micro-object. A function describing the forces generated by an electrode and an extent of the movement induced due to the forces is generated using the model. The function is used to design closed loop policy control scheme for moving the micro-object towards a desired position. The position of the micro-object is tracked and taken into account when generating control signals in the scheme.

2. 发明授权

US10519037B2 Multipass transfer surface for dynamic assembly 有权
公开(公告)号：US10519037B2
公开(公告)日：2019-12-31
申请号：US14997680
申请日：2016-01-18
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： Sourobh Raychaudhuri , Jeng Ping Lu , David K. Biegelsen
IPC分类号： B81C99/00 , H01L21/683 , H02N13/00
摘要： An intermediate transfer surface includes a substrate, a two-dimensional array of electrodes, a dielectric spacer layer on the two-dimensional array of electrodes, and a voltage controller electrically connected to the array of electrodes. A method of manufacturing an intermediate transfer surface, depositing an array of etch stops on a conductive surface, etching the conductive surface to form mesas of the conductive surface separated by gaps, and coating the mesas with a dielectric coating. A microassembly system includes an assembly surface having a first two dimensional array of potential wells on a first surface, a first voltage source electrically connected to the first array of potential wells, an intermediate transfer surface having a second two dimensional array of potential wells on a second surface arranged to face the first surface, and a second voltage source electrically connected to the second array of potential wells.

3. 发明授权

US10224297B2 Sensor and heater for stimulus-initiated fracture of a substrate 有权
$Sensor and heater for stimulus-initiated fracture of a substrate$
公开(公告)号：US10224297B2
公开(公告)日：2019-03-05
申请号：US15220221
申请日：2016-07-26
申请人： Palo Alto Research Center Incorporated
发明人： Christopher L. Chua , Jeng Ping Lu , Gregory Whiting , Scott J. Limb , Rene A. Lujan , Qian Wang
IPC分类号： H03K17/78 , H01L23/00 , H01L23/15 , H01L23/34 , H01L23/525 , H01L23/64 , H01L31/20 , H03K19/177 , H01L29/74 , H01L31/0224
摘要： A self-destructing device includes a stressed substrate with a heater thermally coupled to the stressed substrate. The device includes a power source and trigger circuitry comprising a sensor and a switch. The sensor generates a trigger signal when exposed to a trigger stimulus. The switch couples the power source to the heater in response to the trigger signal When energized by the power source, the heater generates heat sufficient to initiate self-destruction of the stressed substrate.

4. 发明申请

US20180282150A1 HIERARCHICAL MICRO ASSEMBLER SYSTEM 审中-公开
公开(公告)号：US20180282150A1
公开(公告)日：2018-10-04
申请号：US15476830
申请日：2017-03-31
申请人： Palo Alto Research Center Incorporated
发明人： Jeng Ping Lu , Eugene M. Chow , David K. Biegelsen , Sourobh Raychaudhuri
IPC分类号： B81C1/00 , B82Y30/00 , B82Y40/00 , H01L21/027 , H01L21/06 , H01L29/06 , H01L31/0236 , H01L31/0352
CPC分类号： H01L29/0665 , B01J2219/00648 , B01J2219/00653 , B01J2219/00659 , B81B2203/04 , B81B2207/056 , B81C3/005 , B81C2201/0149 , B82Y30/00 , B82Y40/00 , H01L21/06 , H01L24/06 , H01L31/0352 , Y02E10/50
摘要： An electrode array including a substrate. The electrode array includes a first plurality of electrodes disposed above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The electrode array further includes a second plurality of electrodes disposed above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing.

5. 发明申请

US20180081347A1 System and Method for Scalable Real-Time Micro-Object Position Control with the Aid of a Digital Computer 审中-公开
公开(公告)号：US20180081347A1
公开(公告)日：2018-03-22
申请号：US15469433
申请日：2017-03-24
申请人： Palo Alto Research Center Incorporated
发明人： Ion Matei , Jeng Ping Lu , Saigopal Nelaturi , Julie A. Bert , Lara S. Crawford , Armin R. Volkel , Eugene M. Chow
IPC分类号： G05B19/418 , G06T7/73 , G06T7/194 , G06T7/155 , H04N7/18
CPC分类号： G05B19/41885 , G05B17/02 , G05B2219/32359 , G06T7/155 , G06T7/194 , G06T7/74 , G06T2207/20021 , G06T2207/30164 , H04N7/183
摘要： The system and method described below allow for real-time control over positioning of a micro-object. A movement of at least one micro-object suspended in a medium can be induced by a generation of one or more forces by electrodes proximate to the micro-object. Prior to inducing the movement, a simulation is used to develop a model describing a parameter of an interaction between each of the electrodes and the micro-object. A function describing the forces generated by an electrode and an extent of the movement induced due to the forces is generated using the model. The function is used to design closed loop policy control scheme for moving the micro-object towards a desired position. The position of the micro-object is tracked and taken into account when generating control signals in the scheme.

6. 发明申请

US20130235698A1 ULTRASONIC IMAGING USING THIN FILM TRANSISTOR BACKPLANE 有权
标题翻译：超薄成像使用薄膜晶体管背板
公开(公告)号：US20130235698A1
公开(公告)日：2013-09-12
申请号：US13867946
申请日：2013-04-22
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： Serena Han Ying Wong , Jeng Ping Lu , Raj B. Apte
IPC分类号： G01S15/89
CPC分类号： G01S15/89 , B06B1/02 , G01S15/8915 , G01S15/8977
摘要： An embodiment is a method and apparatus for coherent ultrasonic imaging. A receiver array has a plurality of receiver elements on a substrate to detect in-phase and quadrature components of a received signal corresponding to a transmit signal. Each of the receiver elements includes a receiver transducer and a thin-film transistor (TFT) receiver circuit. The TFT receiver circuit includes a quadrature detector having a mixer to mix a received signal with a reference signal in a composite bias signal that is distributed across the plurality of receiver elements. A transmitter is acoustically coupled to the plurality of receiver elements to generate the transmit signal through an imaging medium.
摘要翻译：一个实施例是用于相干超声成像的方法和装置。接收器阵列在衬底上具有多个接收器元件，以检测对应于发射信号的接收信号的同相和正交分量。每个接收器元件包括接收器换能器和薄膜晶体管（TFT）接收器电路。 TFT接收器电路包括正交检测器，该正交检测器具有混合器，以将接收的信号与分布在多个接收器元件上的复合偏置信号中的参考信号进行混合。发射机声耦合到多个接收机元件以通过成像介质产生发射信号。

7. 发明申请

US20230101148A1 EJECTOR DEVICE, 3D PRINTER EMPLOYING THE EJECTOR DEVICE AND METHOD OF 3D PRINTING 有权
公开(公告)号：US20230101148A1
公开(公告)日：2023-03-30
申请号：US17449043
申请日：2021-09-27
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： David K. Biegelsen , Jeng Ping Lu
IPC分类号： B22D23/00 , B33Y10/00 , B33Y30/00
摘要： A 3D printer includes an ejector device for mixing and ejecting print material, the ejector device comprising a substrate and a plurality of ejector conduits on the substrate. The ejector conduits are arranged in an array, each ejector conduit comprising: a first passageway fluidly connecting a first end of the ejector conduit to a conduit junction, the first end configured to accept a first print material; a second passageway fluidly connecting a second end of the ejector conduit to the conduit junction, the second end configured to accept a second print material; and a third passageway fluidly connecting a third end of the ejector conduit to the conduit junction. The third end comprises an ejector nozzle, the ejector nozzle comprising a first electrode and a second electrode, at least one surface of the first electrode being exposed in the third passageway and at least one surface of the second electrode being exposed in the third passageway. A current pulse generating system is in electrical connection with the first electrode and the second electrode of the plurality of ejector conduits. A magnetic field source is sufficiently proximate the second end of the plurality of ejector conduits so as to generate a flux region disposed within the ejector nozzle of the plurality of ejector conduits during operation of the 3D printer. The 3D printer further comprises a positioning system for controlling the relative position of the ejector device with respect to a print substrate in a manner that would allow the print substrate to receive print material jettable from the ejector nozzle of the plurality of ejector conduits during operation of the 3D printer.

8. 发明申请

US20230097711A1 METHOD OF JETTING PRINT MATERIAL USING EJECTOR DEVICES AND METHODS OF MAKING THE EJECTOR DEVICES 有权
公开(公告)号：US20230097711A1
公开(公告)日：2023-03-30
申请号：US17449046
申请日：2021-09-27
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： David K. Biegelsen , Jeng Ping Lu
IPC分类号： B22D23/00 , B33Y10/00 , B33Y30/00
摘要： A method of making an ejector device. The method includes providing a substrate and forming one or more ejector conduits on the substrate. The one or more ejector conduits comprise: a first end configured to accept a print material; a second end comprising an ejector nozzle, the ejector nozzle comprising a first electrode pair that includes a first electrode and a second electrode, at least one surface of the first electrode being exposed in the ejector nozzle and at least one surface of the second electrode being exposed in the ejector nozzle; and at least one passageway for allowing the print material to flow from the first end to the second end. A method of printing a three-dimensional object and a method for jetting print material from a printer jetting mechanism are also disclosed.

9. 发明申请

US20230095803A1 PRINTER JETTING MECHANISM AND PRINTER EMPLOYING THE PRINTER JETTING MECHANISM 有权
公开(公告)号：US20230095803A1
公开(公告)日：2023-03-30
申请号：US17449028
申请日：2021-09-27
申请人： PALO ALTO RESEARCH CENTER INCORPORATED
发明人： David K. Biegelsen , Jeng Ping Lu
IPC分类号： B29C64/112 , B29C64/135 , B29C64/209
摘要： A 3D printer includes an ejector device comprising a substrate and a plurality of ejector conduits on the substrate, the ejector conduits being arranged in an array. Each ejector conduit includes: a first end positioned to accept a print material, a second end comprising an ejector nozzle, the ejector nozzle comprising a first electrode and a second electrode, and a passageway for allowing the print material to flow from the first end to the second end, at least one surface of the first electrode being exposed in the passageway and at least one surface of the second electrode being exposed in the passageway. A current pulse generating system is in electrical connection with the first electrode and the second electrode of the plurality of ejector conduits. A magnetic field source is sufficiently proximate the second end of the plurality of ejector conduits so as to generate a flux region disposed within the ejector nozzle of the plurality of ejector conduits during operation of the 3D printer. The 3D printer further comprises a positioning system for controlling the relative position of the ejector device with respect to a print substrate in a manner that would allow the print substrate to receive print material jettable from the ejector nozzle of the plurality of ejector conduits during operation of the 3D printer.

10. 发明申请

US20180282151A1 HIERARCHICAL MICRO ASSEMBLER SYSTEM 审中-公开
公开(公告)号：US20180282151A1
公开(公告)日：2018-10-04
申请号：US15476843
申请日：2017-03-31
申请人： Palo Alto Research Center Incorporated
发明人： Jeng Ping Lu , Eugene M. Chow , David K. Biegelsen , Sourobh Raychaudhuri
IPC分类号： B81C1/00 , B82Y30/00 , B82Y40/00 , H01L21/027 , H01L21/06 , H01L29/06 , H01L31/0236 , H01L31/0352
CPC分类号： B81C1/00031 , B81B2207/05 , B81B2207/056 , B81C1/00015 , B81C2201/0149 , B82Y30/00 , B82Y40/00 , H01L21/027 , H01L21/06 , H01L29/0665 , Y02E10/50
摘要： A method of manufacturing and using micro assembler systems are described. A method of manufacturing includes disposing a first plurality of electrodes above a first zone of the substrate, wherein the first plurality of electrodes has a first range of spacing. The method further includes disposing a second plurality of electrodes above a second zone of the substrate, wherein the second plurality of electrodes has a second range of spacing that is less than the first range of spacing. A method of using micro assembler systems includes disposing a mobile particle at least partially submersed in an assembly medium above a substrate, a first plurality of electrodes and a second plurality of electrodes. The method further includes conducting a field through individual electrodes of the first plurality of electrodes and the second plurality of electrodes to generate electrophoretic forces or dielectrophoretic forces on the mobile particle.

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