专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20130342308A1 CHIP RESISTOR 审中-公开
标题翻译：芯片电阻
公开(公告)号：US20130342308A1
公开(公告)日：2013-12-26
申请号：US13778732
申请日：2013-02-27
申请人： RALEC ELECTRONIC CORPORATION
发明人： Full Chen
IPC分类号： H01C1/084
CPC分类号： H01C1/084 , H01C1/08 , H01C7/003
摘要： A chip resistor includes a resistor main body, an insulating layer, a heat dissipating layer, and two electrodes. The resistor main body is formed with plural longitudinally extending slits arranged and spaced apart from one another. The resistor main body has transversely opposite ends connected electrically and respectively to the electrodes. The heat dissipating layer dissipates heat generated by the resistor main body and is formed with a dividing slot extending across one of the slits and dividing the heat dissipating layer into two transversely spaced-apart portions. The insulating layer is sandwiched between the resistor main body and the heat dissipating layer and electrically insulates the heat dissipating layer from the resistor main body.
摘要翻译：芯片电阻器包括电阻器主体，绝缘层，散热层和两个电极。电阻器主体形成有彼此间隔开设置的多个纵向延伸的狭缝。电阻器主体具有电连接并分别连接到电极的横向相对端。散热层消散由电阻器主体产生的热量，并且形成有分隔槽，该分隔槽延伸穿过狭缝之一并将散热层分成两个横向间隔开的部分。绝缘层夹在电阻器主体和散热层之间，并使散热层与电阻器主体电绝缘。

2. 发明申请

US20130341301A1 METHOD FOR MANUFACTURING A CHIP RESISTOR 审中-公开
标题翻译：制造芯片电阻的方法
公开(公告)号：US20130341301A1
公开(公告)日：2013-12-26
申请号：US13783931
申请日：2013-03-04
申请人： RALEC ELECTRONIC CORPORATION
发明人： Full Chen
IPC分类号： H01C17/00 , H01C7/00
CPC分类号： H01C17/006 , H01C7/00 , H01C17/22 , Y10T156/108
摘要： In a method of manufacturing a chip resistor, a semi-product is formed by sandwiching an electric-insulating material layer between an electric-conducting material layer and a heat-dissipating material layer. Resistor sections arranged in an array on the semi-product are formed by forming longitudinal first slots and transverse second slots through the semi-product. Slits are formed on a first layer of each resistor section to form a resistor main body. A dividing slot is formed on a second layer of each resistor section. Two electrodes are formed to be electrically connected to opposite ends of the resistor main body. The resistor sections are trimmed from the semi-product to obtain the chip resistors.
摘要翻译：在制造片状电阻器的方法中，通过在导电材料层和散热材料层之间夹有电绝缘材料层而形成半成品。通过在半成品上形成纵向的第一槽和横向的第二槽而形成在半成品上排列成阵列的电阻部分。在每个电阻器部分的第一层上形成狭缝以形成电阻器主体。分隔槽形成在每个电阻器部分的第二层上。两个电极形成为电连接到电阻器主体的相对端。电阻器部分从半成品中调整以获得芯片电阻。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式