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1. 发明授权

US08531042B2 Technique for fabricating microsprings on non-planar surfaces 有权
标题翻译：在非平面表面上制造微球的技术
公开(公告)号：US08531042B2
公开(公告)日：2013-09-10
申请号：US12495057
申请日：2009-06-30
申请人： Robert J. Drost , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Robert J. Drost , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： H01L29/41
CPC分类号： B81C3/008 , B81C1/0019 , H01L21/4846 , H01L23/36 , H01L23/49811 , H01L24/72 , H01L24/73 , H01L24/81 , H01L24/90 , H01L25/0652 , H01L2224/81192 , H01L2924/14 , H01L2924/351 , Y10T29/49217 , Y10T29/49218 , H01L2924/00
摘要： A processing technique facilitating the fabrication of the integrated circuit with microsprings at different vertical positions relative to a surface of a substrate is described. During the fabrication technique, microsprings are lithographically defined on surfaces of a first substrate and a second substrate. Then, a hole is created through a first substrate. Moreover, the integrated circuit may be created by rigidly mechanically coupling the two substrates to each other such that the microsprings on the surface of the second substrate are within a region defined at least in part by an edge around the hole. Subsequently, photoresist that constrains the microsprings on the surfaces of the two substrates may be removed. In this way, microsprings at the different vertical positions can be fabricated.
摘要翻译：描述了一种有助于在相对于衬底的表面在不同垂直位置处形成具有微球的集成电路的处理技术。在制造技术期间，在第一基板和第二基板的表面上光刻地限定微弹簧。然后，通过第一基板产生孔。此外，集成电路可以通过将两个基板彼此刚性地机械耦合而形成，使得第二基板的表面上的微弹簧在至少部分地由孔周围的边缘限定的区域内。随后，可以除去限制两个基板表面上的微球的光致抗蚀剂。以这种方式，可以制造在不同垂直位置的微球。

2. 发明授权

US08195990B2 Misalignment compensation for proximity communication 有权
标题翻译：邻近通信的对准补偿
公开(公告)号：US08195990B2
公开(公告)日：2012-06-05
申请号：US13212900
申请日：2011-08-18
申请人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
发明人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
IPC分类号： G11B5/00
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译：在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。可以通过可控地降低系统的性能来补偿未对准。例如，可以增加发射信号强度。可以增加用于偏置每个位的位周期或时间段，从而降低带宽。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。

3. 发明申请

US20100115349A1 MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION 有权
标题翻译：缺席通信补偿
公开(公告)号：US20100115349A1
公开(公告)日：2010-05-06
申请号：US12263713
申请日：2008-11-03
申请人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
发明人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
IPC分类号： G06K5/04 , G06F11/00
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译：在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。可以通过可控地降低系统的性能来补偿未对准。例如，可以增加发射信号强度。可以增加用于偏置每个位的位周期或时间段，从而降低带宽。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。

4. 发明申请

US20110302465A1 MISALIGNMENT COMPENSATION FOR PROXIMITY COMMUNICATION 有权
标题翻译：缺席通信补偿
公开(公告)号：US20110302465A1
公开(公告)日：2011-12-08
申请号：US13212900
申请日：2011-08-18
申请人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
发明人： Ronald Ho , Ashok V. Krishnamoorthy , John E. Cunningham , Robert J. Drost
IPC分类号： G06F11/07
CPC分类号： H04B5/0075 , H01L25/065 , H01L2924/0002 , H04B17/318 , H04L1/0009 , Y10T29/49133 , H01L2924/00
摘要： In a proximity communication system, transmit elements on one chip are aligned with receive elements on a second chip juxtaposed with the first chip. However, if the elements are misaligned, either statically or dynamically, the coupling between chips is degraded. The misalignment may be compensated by controllably degrading performance of the system. For example, the transmit signal strength may be increased. The bit period or the time period for biasing each bit may be increased, thereby decreasing the bandwidth. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels. The granularity of symbols, such as images, may be increased by decreasing the number of bits per symbol. Multiple coupling elements, such as capacitors, may be ganged together, thereby decreasing the number of channels.
摘要翻译：在接近通信系统中，一个芯片上的发射元件与与第一芯片并置的第二芯片上的接收元件对齐。然而，如果元件是静态的或动态的，则芯片之间的耦合会降低。可以通过可控地降低系统的性能来补偿未对准。例如，可以增加发射信号强度。可以增加用于偏置每个位的位周期或时间段，从而降低带宽。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。可以通过减少每个符号的比特数来增加诸如图像的符号的粒度。诸如电容器的多个耦合元件可以组合在一起，从而减少通道数量。

5. 发明申请

US20110233789A1 ADHESIVE-BONDED SUBSTRATES IN A MULTI-CHIP MODULE 有权
标题翻译：多芯片模块中粘合的基板
公开(公告)号：US20110233789A1
公开(公告)日：2011-09-29
申请号：US12730823
申请日：2010-03-24
申请人： Robert J. Drost , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Robert J. Drost , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/538
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/5389 , H01L2224/16145 , H01L2224/16225 , H01L2225/06531 , H01L2225/06555 , H01L2924/15153
摘要： A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces.
摘要翻译：描述了一种多芯片模块（MCM），其中至少两个基板通过粘合剂层机械耦合，所述粘合剂层在基板的表面上的接近连接器之间保持对准和零（或接近零）的间隔，从而有利于高信号质量基板之间的接近连接。为了提供足够的剪切强度，粘合剂层的厚度大于间隔。这可以使用衬底上的一个或多个正和/或负特征来实现。例如，粘合剂可以结合到：一个表面和在另一个表面下方凹进的通道的内表面; 在两个表面下凹陷的通道的内表面; 或两个表面。在最后一种情况下，零（或接近零）的间距可以通过将接近连接器设置在突出在至少一个衬底表面上的台面上来实现。

6. 发明授权

US07646984B1 Clocking of integrated circuits using photonics 有权
标题翻译：使用光子学的集成电路的时钟
公开(公告)号：US07646984B1
公开(公告)日：2010-01-12
申请号：US11728915
申请日：2007-03-26
申请人： Ronald Ho , John E. Cunningham , Ashok V. Krishnamoorthy , Robert J. Drost
发明人： Ronald Ho , John E. Cunningham , Ashok V. Krishnamoorthy , Robert J. Drost
IPC分类号： H04B10/12
CPC分类号： G06F1/105
摘要： Embodiments of an integrated circuit are described. This integrated circuit includes: a clock-generator circuit configured to provide a clock signal; an optical clock path coupled to the clock-generator circuit; and a latch coupled to the optical clock path. This optical clock path is configured to distribute an optical signal corresponding to the clock signal. Furthermore, the optical clock path is configured to optically set a skew value for the optical signal, and is configured to selectively gate distribution of the optical signal to the latch based on activity of the latch. Note that the selective gating is performed optically.
摘要翻译：描述集成电路的实施例。该集成电路包括：时钟发生器电路，被配置为提供时钟信号; 耦合到时钟发生器电路的光时钟通路; 以及耦合到光时钟路径的锁存器。该光时钟路径被配置为分配对应于时钟信号的光信号。此外，光时钟路径被配置为光学地设置光信号的偏斜值，并且被配置为基于锁存器的活动来选择性地将光信号分配到锁存器。注意，选择性门控是光学执行的。

7. 发明授权

US07356213B1 Transparent switch using optical and electrical proximity communication 有权
标题翻译：透明开关采用光电接近通讯
公开(公告)号：US07356213B1
公开(公告)日：2008-04-08
申请号：US11728843
申请日：2007-03-26
申请人： John E. Cunningham , Ashok V. Krishnamoorthy , Ronald Ho , Robert J. Drost
发明人： John E. Cunningham , Ashok V. Krishnamoorthy , Ronald Ho , Robert J. Drost
IPC分类号： G02B6/12
CPC分类号： H01L23/48 , H01L25/0652 , H01L25/0657 , H01L2225/06513 , H01L2225/06527 , H01L2924/0002 , H01L2924/00
摘要： Embodiments of a switch are described. This switch includes input ports configured to receive signals (which include data) and output ports configured to output the signals. In addition, the switch includes switching elements and a flow-control mechanism, which is configured to provide flow-control information associated with the data to the switching elements via an optical control path. These switching elements are configured to selectively couple the input ports to the output ports based on the flow-control information. Furthermore, a given switching element in the switching elements is coupled to a given input port and a given output port via electrical signal paths that are configured to use proximity communication to communicate the data.
摘要翻译：描述开关的实施例。该开关包括被配置为接收被配置为输出信号的信号（其包括数据）和输出端口的输入端口。此外，开关包括开关元件和流量控制机构，其被配置为经由光学控制路径向开关元件提供与数据相关联的流量控制信息。这些开关元件被配置为基于流量控制信息选择性地将输入端口耦合到输出端口。此外，开关元件中的给定开关元件通过经配置以使用接近通信来传送数据的电信号路径耦合到给定输入端口和给定输出端口。

8. 发明授权

US08698322B2 Adhesive-bonded substrates in a multi-chip module 有权
标题翻译：多芯片模块中的粘合粘合基板
公开(公告)号：US08698322B2
公开(公告)日：2014-04-15
申请号：US12730823
申请日：2010-03-24
申请人： Robert J. Drost , Ashok V. Krishnamoorthy , John E. Cunningham
发明人： Robert J. Drost , Ashok V. Krishnamoorthy , John E. Cunningham
IPC分类号： H01L23/538
CPC分类号： H01L25/0657 , H01L23/48 , H01L23/5389 , H01L2224/16145 , H01L2224/16225 , H01L2225/06531 , H01L2225/06555 , H01L2924/15153
摘要： A multi-chip module (MCM) is described in which at least two substrates are mechanically coupled by an adhesive layer that maintains alignment and a zero (or near zero) spacing between proximity connectors on surfaces of the substrates, thereby facilitating high signal quality during proximity communication between the substrates. In order to provide sufficient shear strength, the adhesive layer has a thickness that is larger than the spacing. This may be accomplished using one or more positive and/or negative features on the substrates. For example, the adhesive may be bonded to: one of the surfaces and an inner surface of a channel that is recessed below the other surface; inner surfaces of channels that are recessed below both of the surfaces; or both of the surfaces. In this last case, the zero (or near zero) spacing may be achieved by disposing proximity connectors on a mesa that protrudes above at least one of the substrate surfaces.
摘要翻译：描述了一种多芯片模块（MCM），其中至少两个基板通过粘合剂层机械耦合，所述粘合剂层在基板的表面上的接近连接器之间保持对准和零（或接近零）的间隔，从而有利于高信号质量基板之间的接近连接。为了提供足够的剪切强度，粘合剂层的厚度大于间隔。这可以使用衬底上的一个或多个正和/或负特征来实现。例如，粘合剂可以结合到：一个表面和在另一个表面下方凹进的通道的内表面; 在两个表面下凹陷的通道的内表面; 或两个表面。在最后一种情况下，零（或接近零）的间距可以通过将接近连接器设置在突出在至少一个衬底表面上的台面上来实现。

9. 发明申请

US20100329607A1 OPTICAL CONNECTOR WITH REDUCED MECHANICAL-ALIGNMENT SENSITIVITY 有权
标题翻译：具有降低机械对准灵敏度的光学连接器
公开(公告)号：US20100329607A1
公开(公告)日：2010-12-30
申请号：US12495228
申请日：2009-06-30
申请人： Robert J. Drost , John E. Cunningham , Ashok V. Krishnamoorthy
发明人： Robert J. Drost , John E. Cunningham , Ashok V. Krishnamoorthy
IPC分类号： G02B6/34 , G02B6/26
CPC分类号： G02B6/4204 , G02B6/30 , G02B6/34 , G02B6/4215 , G02B6/4298 , G02B6/43
摘要： An optical connector is described. This optical connector spatially segregates optical coupling between an optical fiber and an optical component, which relaxes the associated mechanical-alignment requirements. In particular, the optical connector includes an optical spreader component disposed on a substrate. This optical spreader component is optically coupled to the optical fiber at a first coupling region, and is configured to optically couple to the optical component at a second coupling region that is at a different location on the substrate than the first coupling region. Moreover, the first coupling region and the second coupling region are optically coupled by an optical waveguide.
摘要翻译：描述光连接器。该光学连接器在空间上分离光纤和光学部件之间的光学耦合，这松弛了相关的机械对准要求。特别地，光连接器包括设置在基板上的光扩散部件。该光扩散器部件在第一耦合区域光学耦合到光纤，并且被配置为在与第一耦合区域在基板上的不同位置处的第二耦合区域光学耦合到光学部件。此外，第一耦合区域和第二耦合区域通过光波导光学耦合。

10. 发明授权

US07747173B1 Multi-phase clocking of integrated circuits using photonics 有权
标题翻译：使用光子学的集成电路的多相时钟
公开(公告)号：US07747173B1
公开(公告)日：2010-06-29
申请号：US11728841
申请日：2007-03-26
申请人： Ronald Ho , John E. Cunningham , Ashok V. Krishnamoorthy , Robert J. Drost
发明人： Ronald Ho , John E. Cunningham , Ashok V. Krishnamoorthy , Robert J. Drost
IPC分类号： H04B10/00
CPC分类号： H04B10/801
摘要： Embodiments of an integrated circuit are described. This integrated circuit includes a clock-generator circuit configured to provide a clock signal and an optical clock path coupled to the clock-generator circuit. Note that the optical clock path is configured to distribute optical signals corresponding to the clock signal. Furthermore, note that a given optical signal has a phase which is different than phases of the other optical signals.
摘要翻译：描述集成电路的实施例。该集成电路包括时钟发生器电路，其被配置为提供时钟信号和耦合到时钟发生器电路的光时钟通路。注意，光时钟路径被配置为分配对应于时钟信号的光信号。此外，注意，给定的光信号具有与其它光信号的相位不同的相位。

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