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1. 发明授权

US08080319B2 Thermosetting resin composition and use thereof 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US08080319B2
公开(公告)日：2011-12-20
申请号：US12083588
申请日：2006-10-18
申请人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
IPC分类号： B32B27/38 , C08G69/26 , C08L63/00
CPC分类号： C08L63/00 , C08G59/4042 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08L79/08 , Y10T428/31511 , Y10T428/31529 , Y10T428/31721 , C08L2666/20 , C08L2666/22
摘要： Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.
摘要翻译：本发明涉及一种热固性树脂组合物，其包含具有酚羟基的聚酰亚胺树脂（A），优选由氨基苯酚（a），二氨基化合物（b）和四元酸二酐（c）制备的聚酰亚胺树脂（A））和环氧树脂（B）; 及其固化物。树脂组合物的保存稳定性优异，得到阻燃性和耐热性优异的固化物。此外，当固化产物为薄膜形式时，产品具有足够的柔韧性和优异的耐折性。

2. 发明申请

US20090286087A1 Thermosetting Resin Composition and Use thereof 有权
标题翻译：热固性树脂组合物及其用途
公开(公告)号：US20090286087A1
公开(公告)日：2009-11-19
申请号：US12083588
申请日：2006-10-18
申请人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Makoto Uchida , Hiroo Koyanagi
IPC分类号： B32B27/38 , C08L79/08 , C08L63/00 , B32B27/08
CPC分类号： C08L63/00 , C08G59/4042 , C08G73/1039 , C08G73/1046 , C08G73/1064 , C08J5/24 , C08J2363/00 , C08J2379/08 , C08L79/08 , Y10T428/31511 , Y10T428/31529 , Y10T428/31721 , C08L2666/20 , C08L2666/22
摘要： Disclosed is related to a thermosetting resin composition which comprises a polyimide resin (A) having a phenolic hydroxyl group, preferably a polyimide resin (A) produced from an aminophenol (a), a diamino compound (b) and a tetrabasic acid dianhydride (c), and an epoxy resin (B); and a cured product thereof. The resin composition is excellent in storage stability, and gives a cured product excellent in flame retardancy and heat resistance. Furthermore, when the cured product is in a film form, the product has sufficient flexibility and excellent folding endurance.
摘要翻译：本发明涉及一种热固性树脂组合物，其包含具有酚羟基的聚酰亚胺树脂（A），优选由氨基苯酚（a），二氨基化合物（b）和四元酸二酐（c）制备的聚酰亚胺树脂（A））和环氧树脂（B）; 及其固化物。树脂组合物的保存稳定性优异，得到阻燃性和耐热性优异的固化物。此外，当固化产物为薄膜形式时，产品具有足够的柔韧性和优异的耐折性。

3. 发明申请

US20070161100A1 Photosensitive resin composition and cured product thereof 审中-公开
标题翻译：感光性树脂组合物及其固化物
公开(公告)号：US20070161100A1
公开(公告)日：2007-07-12
申请号：US10597799
申请日：2005-02-08
申请人： Ryutaro Tanaka , Masataka Nakanishi , Yasumasa Akatsuka , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Masataka Nakanishi , Yasumasa Akatsuka , Hiroo Koyanagi
IPC分类号： B09C1/10
CPC分类号： G03F7/038 , C08G59/32
摘要： Disclosed is a photosensitive resin composition comprising a resin (A) soluble in an aqueous alkaline solution, a crosslinking agent (B), a photopolymerization initiator (C) and a curing agent (D) wherein the curing agent (D) is an epoxy compound obtained by glycidylating a compound containing not less than 80% of a tetraphenylethane derivative represented by the following formula (1). In the formula, R1 to R8 independently represents a hydrogen atom, a C1-C4 alkyl group or a halogen atom.
摘要翻译：公开了包含可溶于碱性水溶液的树脂（A），交联剂（B），光聚合引发剂（C）和固化剂（D））的感光性树脂组合物，其中固化剂（D）为环氧化合物通过使含有不少于80％由下式（1）表示的四苯乙烷衍生物的化合物缩水甘油化得到。在该式中，R 1至R 8独立地表示氢原子，C 1 -C 4 - C 4 - 烷基基团或卤素原子。

4. 发明申请

US20090042126A1 Photosensitive resin composition and cured article thereof 审中-公开
标题翻译：光敏树脂组合物及其固化制品
公开(公告)号：US20090042126A1
公开(公告)日：2009-02-12
申请号：US11988903
申请日：2006-07-20
申请人： Ryutaro Tanaka , Toru Kurihashi , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Toru Kurihashi , Hiroo Koyanagi
IPC分类号： G03F7/004
CPC分类号： C08F283/10 , C08F290/00 , C08F290/02 , C08F299/00 , C08F299/02 , C08G59/1466 , C08G59/42 , C08L63/00 , G03F7/027 , G03F7/038 , G03F7/0388 , H05K3/287
摘要： A photosensitive resin composition which is excellent in photosensitivity and excellent in flame resistance, flexibility, adhesiveness, pencil hardness, resistance to solvent, acid resistance, heat resistance, resistance to gold plating and the like and a cured article thereof are provided.An alkaline aqueous solution-soluble photosensitive resin composition containing an alkaline aqueous solution-soluble resin (A) obtained by adding a polybasic acid anhydride (c) to a resin (C) which is a reaction product of an epoxy resin (a) represented by the formula (1) with an unsaturated monocarboxylic acid (b), an epoxy resin (a′) represented by the formula (1) as a curing agent (B) and a photopolymerization initiator. [In the formula, n represents a positive number of 1 to 10 as an average value.]
摘要翻译：提供了光敏性优异，耐火性，柔韧性，粘合性，铅笔硬度，耐溶剂性，耐酸性，耐热性，耐镀金性等优异的感光性树脂组合物及其固化物。一种碱性水溶性可溶性感光性树脂组合物，其含有通过将多元酸酐（c）添加到由（C）表示的环氧树脂（a）的反应产物的树脂（C）中而获得的碱性水溶性溶液性树脂（A）具有不饱和一元羧酸（b）的式（1），作为固化剂（B）的式（1）表示的环氧树脂（a'）和光聚合引发剂。 [式中，n表示作为平均值的1〜10的正数]

5. 发明申请

US20080306180A1 Polyamide Acid Resin Containing Unsaturated Group, Photosensitive Resin Composition Using Same, and Cured Product Thereof 审中-公开
标题翻译：含有不饱和基团的聚酰胺酸树脂，使用其的感光性树脂组合物及其固化物
公开(公告)号：US20080306180A1
公开(公告)日：2008-12-11
申请号：US10583644
申请日：2004-12-20
申请人： Chika Amishima , Ryutaro Tanaka , Hideaki Kametani , Hiroo Koyanagi
发明人： Chika Amishima , Ryutaro Tanaka , Hideaki Kametani , Hiroo Koyanagi
IPC分类号： C08L77/06 , C08F2/46
CPC分类号： C08L79/08 , C08G73/16 , G03F7/037 , H05K1/0346 , H05K3/3452
摘要： The present invention provides a novel polyamide acid resin (A) containing an unsaturated group, suitable to a photosensitive resin composition, and a photosensitive resin composition using the same, which is excellent in photosensitivity, and the resultant cured product is excellent in flexibility as well as adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, and the like. Said polyamide acid resin (A) containing an unsaturated group is obtained by reacting an unsaturated group-containing polyester resin (a) having a terminal anhydride group, and a compound (b) having two amino groups in a molecule, and said photosensitive resin composition is obtained by reacting a resin composition containing said polyamide acid resin (A) containing an unsaturated group, a crosslinker (B) and a photopolymerization initiator (C).
摘要翻译：本发明提供一种适用于感光性树脂组合物的含有不饱和基团的新型聚酰胺酸树脂（A）和使用该聚酰胺树脂组合物的感光性树脂组合物，其光敏性优异，得到的固化物的柔软性优异作为粘合性，铅笔硬度，耐溶剂性，耐酸性，耐热性，耐镀金性等。所述含有不饱和基团的聚酰胺酸树脂（A）通过使具有末端酸酐基的不饱和基团的聚酯树脂（a）和分子中具有两个氨基的化合物（b）反应而获得，并且所述感光性树脂组合物通过使含有不饱和基团的聚酰胺酸树脂（A），交联剂（B）和光聚合引发剂（C）的树脂组合物反应而得到。

6. 发明申请

US20080286688A1 Photosensitive Resin Composition and Cured Product Thereof 审中-公开
标题翻译：光敏树脂组合物及其固化产品
公开(公告)号：US20080286688A1
公开(公告)日：2008-11-20
申请号：US10585699
申请日：2005-01-21
申请人： Hiroo Koyanagi , Ryutaro Tanaka , Hideaki Kametani
发明人： Hiroo Koyanagi , Ryutaro Tanaka , Hideaki Kametani
IPC分类号： G03F7/004
CPC分类号： G03F7/027 , G03F7/038
摘要： [PROBLEMS] To provide a photosensitive resin composition with excellent photosensitivity whose cured product is excellent in adhesiveness, pencil hardness, solvent resistance, acid resistance, heat resistance, gold plating resistance, HAST properties, flame retardance, flexibility and the like a cured product thereof. [MEANS FOR SOLVING PROBLEMS] A photosensitive resin composition comprising a carboxyl group-containing resin (A) which is a reaction product of a compound (a) represented by the following formula (1): wherein n is an average value of 1 to 20; R1 and R2 may be the same or different, and are each a hydrogen atom, a halogen atom or a C1 to C4 lower alkyl group; R3, R5, R8 and R10 may be the same or different, and are each a hydrogen atom, a halogen atom or a methyl group; and R4, R6, R7 and R9 may be the same or different, and are each a hydrogen atom or a methyl group, a compound (b) having an ethylenically unsaturated group and a glycidyl group in the molecule and a polybasic acid anhydride (c), a crosslinking agent (B) and a photopolymerization initiator (C), and a cured product thereof.
摘要翻译： [问题]为了提供具有优异的光敏性的感光性树脂组合物，其固化产物的粘合性，铅笔硬度，耐溶剂性，耐酸性，耐热性，耐镀金性，HAST性，阻燃性，柔软性等优异的固化产物。解决问题的手段一种含有含羧基的树脂（A）的感光性树脂组合物，其是由下式（1）表示的化合物（a）的反应产物：其中n为1〜20的平均值 ; R 1和R 2可以相同或不同，并且各自为氢原子，卤素原子或C 1 -C 6烷基，低级烷基;低级烷基;低级烷基; R 3，R 5，R 8和R 10可以相同或不同，并且各自为氢原子，卤素原子或甲基; 和R 4，R 6，R 7和R 9可以相同或不同，并且各自为氢原子或甲基，分子中具有烯键式不饱和基团和缩水甘油基的化合物（b）和多元酸酐（c），交联剂（B）和光聚合引发剂（C），以及其固化产物。

7. 发明授权

US07374862B2 Photosensitive resin composition and curing product thereof 有权
标题翻译：感光树脂组合物及其固化产物
公开(公告)号：US07374862B2
公开(公告)日：2008-05-20
申请号：US10547907
申请日：2004-03-04
申请人： Ryutaro Tanaka , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Hiroo Koyanagi
IPC分类号： G03F7/027
CPC分类号： C08G18/773 , C08F290/067 , C08G18/4837 , C08G18/5015 , C08G18/5021 , C08G18/5072 , C09J175/04 , G03F7/027 , G03F7/038
摘要： A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).
摘要翻译：对光化学能量射线（感光度）的敏感性优异的感光性树脂组合物在短时间内是可硬化的，并且可以通过用稀释的碱水溶液显影形成图案，并且通过后固化步骤中的热固化得到固化膜，该固化膜具有令人满意的柔性并适用于绝缘性优异的镀金，无电镀金和镀锡电阻的焊料掩模油墨; 及其固化物。特别是一种感光性树脂组合物，其特征在于，含有（1）可溶于碱水溶液的聚氨酯树脂（A），在不存在催化剂的情况下通过氨基甲酸酯化得到的聚氨酯树脂，二异氰酸酯化合物（a），具有烯属不饱和的二醇化合物其分子（b）中的基团和其分子中具有羧基的二醇化合物（c）任选地与在其分子（d）中不具有任何烯键式不饱和基团或羧基的二醇化合物一起使反应产物与环状酸酐（e）; （2）光聚合引发剂（B）; 和（3）反应性交联剂（C）。

8. 发明申请

US20060102051A1 Photosensitive resin composition and curing product thereof 有权
标题翻译：感光树脂组合物及其固化产物
公开(公告)号：US20060102051A1
公开(公告)日：2006-05-18
申请号：US10547907
申请日：2004-03-04
申请人： Ryutaro Tanaka , Hiroo Koyanagi
发明人： Ryutaro Tanaka , Hiroo Koyanagi
IPC分类号： C08L99/00
CPC分类号： C08G18/773 , C08F290/067 , C08G18/4837 , C08G18/5015 , C08G18/5021 , C08G18/5072 , C09J175/04 , G03F7/027 , G03F7/038
摘要： A photosensitive resin composition that excels in sensitivity to actinic energy rays (photosensitivity), is hardenable within a short period of time and can form pattern through development with a diluted aqueous alkali solution and that gives a cured film through thermal curing in the postcuring step, the cured film having satisfactory flexibility and being suitable to a solder mask ink of high insulation excelling in adherence and resistances of gold plating, electroless gold plating and tin plating; and a curing product thereof. In particular, a photosensitive resin composition characterized by comprising (1) a urethane resin (A) soluble in aqueous alkali solutions, the urethane resin obtained by urethanizing in the absence of catalyst a diisocyanate compound (a), a diol compound having an ethylenically unsaturated group in its molecule (b) and a diol compound having a carboxyl group in its molecule (c) optionally together with a diol compound not having any ethylenically unsaturated group or carboxyl group in its molecule (d) and reacting the reaction product with a cyclic acid anhydride (e); (2) photopolymerization initiator (B); and (3) a reactive crosslinking agent (C).
摘要翻译：对光化学能量射线（感光度）的敏感性优异的感光性树脂组合物在短时间内是可硬化的，并且可以通过用稀释的碱水溶液显影形成图案，并且通过后固化步骤中的热固化得到固化膜，该固化膜具有令人满意的柔性并适用于绝缘性优异的镀金，无电镀金和镀锡电阻的焊料掩模油墨; 及其固化物。特别是一种感光性树脂组合物，其特征在于，含有（1）可溶于碱水溶液的聚氨酯树脂（A），在不存在催化剂的情况下通过氨基甲酸酯化得到的聚氨酯树脂，二异氰酸酯化合物（a），具有烯属不饱和的二醇化合物其分子（b）中的基团和其分子中具有羧基的二醇化合物（c）任选地与在其分子（d）中不具有任何烯键式不饱和基团或羧基的二醇化合物一起使反应产物与环状酸酐（e）; （2）光聚合引发剂（B）; 和（3）反应性交联剂（C）。

9. 发明申请

US20100129604A1 COPPER FOIL WITH RESIN LAYER 审中-公开
标题翻译：铜箔与树脂层
公开(公告)号：US20100129604A1
公开(公告)日：2010-05-27
申请号：US12451359
申请日：2008-05-13
申请人： Makoto Uchida , Ryutaro Tanaka , Shigeo Hayashimoto
发明人： Makoto Uchida , Ryutaro Tanaka , Shigeo Hayashimoto
IPC分类号： B32B15/088 , B32B15/092 , B32B3/10
CPC分类号： H05K1/0346 , B32B7/12 , B32B15/08 , B32B15/20 , B32B27/20 , B32B27/281 , B32B27/34 , B32B27/38 , B32B2262/101 , B32B2264/10 , B32B2264/102 , B32B2264/104 , B32B2307/202 , B32B2307/208 , B32B2307/21 , B32B2307/306 , B32B2307/3065 , B32B2307/718 , B32B2457/08 , C08G69/32 , C09D177/10 , H05K3/384 , H05K2201/0358 , Y10T428/24355 , Y10T428/31529 , Y10T428/31681
摘要： An object of the present invention is to provide a copper foil with a resin layer to be used as a resin substrate for a flexible printed wiring board and having good adhesiveness between the copper foil, to which no roughening treatment is applied, and a raw material resin layer.A copper foil with a resin layer characterized in that a copper foil having no roughening treatment applied thereto is directly joined to a resin layer, which contains a phenolic hydroxyl group-containing aromatic polyamide resin having a structure represented by the following formula (1): in the formula (1), m and n denote average values and satisfy the relationship: 0.005≦n/(m+n)
摘要翻译：本发明的目的是提供一种铜箔，其具有用作柔性印刷线路板的树脂基板的树脂层，并且在不进行粗糙化处理的铜箔和原料之间具有良好的粘附性树脂层。一种具有树脂层的铜箔，其特征在于将不进行粗糙化处理的铜箔直接接合到树脂层上，所述树脂层含有具有由下式（1）表示的结构的含酚羟基的芳族聚酰胺树脂：在式（1）中，m和n表示平均值，满足关系式：0.005＆nlE; n /（m + n）<0.05，m + n为2〜200; Ar1是二价芳族基团; Ar 2是具有酚性羟基的二价芳香族基团，Ar 3是二价芳香族基团。

10. 发明申请

US20120288725A1 Heat-Resistant Adhesive 审中-公开
标题翻译：耐热粘合剂
公开(公告)号：US20120288725A1
公开(公告)日：2012-11-15
申请号：US13575614
申请日：2011-03-10
申请人： Ryutaro Tanaka , Makoto Uchida , Shigeru Moteki , Yasumasa Akatsuka
发明人： Ryutaro Tanaka , Makoto Uchida , Shigeru Moteki , Yasumasa Akatsuka
IPC分类号： C09J177/00 , B32B15/08
CPC分类号： B32B15/01 , C08G69/265 , C08G69/32 , C08K3/013 , C08K3/28 , C08K3/38 , C08L63/00 , C08L77/10 , C08L2666/22 , C09D177/06 , C09D177/10 , C09J163/00 , C09J177/06 , C09J177/10 , H01L2924/0002 , Y10T428/31681 , H01L2924/00
摘要： Disclosed is a heat-resistant adhesive including: a phenolic hydroxy group-containing aromatic polyamide resin (A) having a structure represented by the following formula (1) (in the formula, m and n each represent an average and satisfy the relation: 0.005≦n/(m+n)
摘要翻译：公开了一种耐热粘合剂，其包括：具有由下式（1）表示的结构的酚羟基的芳族聚酰胺树脂（A）（式中，m和n各自表示平均值，满足关系式：0.005 ＆nlE; n /（m + n）<1，m + n是大于0但等于或小于200的整数，Ar 1表示二价芳族基团，Ar 2表示具有酚羟基的二价芳基，Ar 3表示二价芳香族基团），环氧树脂（B），固化催化剂（C），无机填料（D），以及作为任意成分的成分（A）以外的环氧树脂固化剂，其中组分（D）的含量相对于组分（A）至（C）和环氧树脂固化剂的总量相对于100质量份为任意成分为30〜950质量份。当电路等和散热板彼此粘合时，粘合剂的固化层不仅具有高耐热性和高粘合性，而且具有高导热性，并且还具有高导热性绝佳的保温性能。此外，固化的粘合剂是阻燃剂，因此粘合剂作为高功能半导体周边材料是非常有用的。

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