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1. 发明申请

US20140110830A1 SEMICONDUCTOR PACKAGE 有权
标题翻译：半导体封装
公开(公告)号：US20140110830A1
公开(公告)日：2014-04-24
申请号：US13735667
申请日：2013-01-07
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Jong Man Kim , Young Hoon Kwak , Chang Seob Hong , Soon Gyu Yim
IPC分类号： H01L23/34
CPC分类号： H01L23/34 , H01L23/367 , H01L23/4334 , H01L23/49568 , H01L23/49575 , H01L2023/4056 , H01L2224/32245
摘要： Disclosed herein is a semiconductor package, including: a first heat radiating plate; a second heat radiating plate formed below the first heat radiating plate; a heat radiating lead formed above the first heat radiating plate and having both ends contacted with the second heat radiating plate; an insulating layer formed above the heat radiating lead; at least one power device formed above the insulating layer; and at least one control device formed above the insulating layer.
摘要翻译：本文公开了一种半导体封装，包括：第一散热板; 形成在第一散热板下方的第二散热板; 形成在所述第一散热板上方并具有与所述第二散热板接触的两端的散热引线; 形成在散热引线上方的绝缘层; 形成在绝缘层之上的至少一个功率器件; 以及形成在所述绝缘层上方的至少一个控制装置。

2. 发明申请

US20150214126A1 POWER SEMICONDUCTOR MODULE 有权
标题翻译：功率半导体模块
公开(公告)号：US20150214126A1
公开(公告)日：2015-07-30
申请号：US14296094
申请日：2014-06-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kwang Soo KIM , Joon Seok Chae , Chang Seob Hong , Young Hoon Kwak , Young Ki Lee
IPC分类号： H01L23/34 , H01L23/00
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48227 , H01L2224/48229 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.
摘要翻译：这里公开了功率半导体模块。功率半导体模块包括：印刷电路板（PCB）; 第一和第二散热器安装在PCB上并具有一个布置有端子槽的表面; 功率器件安装在第一散热器上并且彼此并联并电连接到第二散热器; 以及第一和第二端子，其设置有插入端子槽中的突起，并且设置有用于连接外部端子的连接端子。因此，可以提高功率半导体模块的散热性能，并且可以提高与端子连接相关的诸如焊料裂纹或分层的可靠性问题。

3. 发明申请

US20150156914A1 HEAT RADIATION SYSTEM FOR POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：用于功率半导体模块的热辐射系统
公开(公告)号：US20150156914A1
公开(公告)日：2015-06-04
申请号：US14327466
申请日：2014-07-09
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Hoon KWAK , Chang Seob Hong , Young Ki Lee
IPC分类号： H05K7/20
CPC分类号： H05K7/20254 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a heat radiation system including: a frame; a partition plate disposed across the frame and including an inlet for supplying a cooling medium, a plurality of louvers extended radially from a circumference of the inlet, and a slot formed at a circumference of an edge thereof; a diffusion chamber defined by the frame and the partition plate; a lower plate disposed at a lower portion of the frame so as to be spaced apart from the partition plate by a predetermined interval and including an outlet for discharging the cooling medium; and a recovery chamber defined by the frame, the partition plate, and the lower plate and being in fluid communication with the diffusion chamber. Particularly, the diffusion chamber and the recovery chamber may be partitioned from each other by the partition wall to form a double
摘要翻译：本文公开了一种散热系统，包括：框架; 跨越框架设置的分隔板，并且包括用于供应冷却介质的入口，从入口的圆周径向延伸的多个百叶窗和在其边缘的圆周处形成的狭槽; 由框架和隔板限定的扩散室; 下部板，其设置在所述框架的下部，以与所述隔板间隔预定间隔并且包括用于排出所述冷却介质的出口; 以及由框架，分隔板和下板限定并与扩散室流体连通的回收室。特别地，扩散室和回收室可以通过分隔壁彼此隔开以形成双重的

4. 发明授权

US08810014B2 Semiconductor package including conductive member disposed between the heat dissipation member and the lead frame 有权
标题翻译：半导体封装，包括设置在散热构件和引线框架之间的导电构件
公开(公告)号：US08810014B2
公开(公告)日：2014-08-19
申请号：US13761750
申请日：2013-02-07
申请人： Samsung Electro-Mechanics Co., Ltd.
发明人： Jae Hyun Lim , Chang Seob Hong , Young Hoon Kwak , Young Ho Sohn
IPC分类号： H01L23/495
CPC分类号： H01L23/49575 , H01L23/3107 , H01L23/4952 , H01L23/49531 , H01L23/49548 , H01L23/49568 , H01L2224/16245 , H01L2224/32245
摘要： There is provided a semiconductor package including: a lead frame having an electronic component mounted on one surface thereof; a heat dissipation substrate disposed downwardly of the lead frame; an insulating member disposed upwardly of the electronic component such that the electronic components are electrically connected to one another; a conductive member disposed between the insulating member and the lead frame and electrically connecting the electronic component to the lead frame; and a molded portion hermetically sealing the insulating member and the heat dissipation substrate.
摘要翻译：提供一种半导体封装，其包括：引线框架，其具有安装在其一个表面上的电子部件; 布置在引线框架下方的散热基板; 绝缘构件，其设置在所述电子部件的上方，使得所述电子部件彼此电连接; 导电构件，设置在所述绝缘构件和所述引线框架之间并将所述电子部件电连接到所述引线框架; 以及密封绝缘构件和散热基板的成型部。

5. 发明授权

US09443818B2 Power semiconductor module 有权
标题翻译：功率半导体模块
公开(公告)号：US09443818B2
公开(公告)日：2016-09-13
申请号：US14296094
申请日：2014-06-04
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Kwang Soo Kim , Joon Seok Chae , Chang Seob Hong , Young Hoon Kwak , Young Ki Lee
IPC分类号： H01L23/12 , H01L23/00 , H01L25/07
CPC分类号： H01L24/49 , H01L24/48 , H01L25/072 , H01L2224/48091 , H01L2224/48227 , H01L2224/48229 , H01L2224/49111 , H01L2224/49113 , H01L2224/49175 , H01L2924/00014 , H01L2924/13055 , H01L2924/13091 , H01L2924/00 , H01L2224/45099 , H01L2224/05599
摘要： Disclosed herein is a power semiconductor module. The power semiconductor module includes: a printed circuit board (PCB); first and second heat spreaders mounted on the PCB and having one surface arranged with terminal slots; power devices mounted on the first heat spreader and connected to one another in parallel and electrically connected to the second heat spreader; and first and second terminals provided with protrusion inserted into the terminal slots and provided with connection terminals for connecting external terminals. Therefore, it is possible to improve heat radiating properties of the power semiconductor module and improve a reliability problem such as solder crack or delamination in connection with terminal connection.
摘要翻译：这里公开了功率半导体模块。功率半导体模块包括：印刷电路板（PCB）; 第一和第二散热器安装在PCB上并具有一个布置有端子槽的表面; 功率器件安装在第一散热器上并且彼此并联并电连接到第二散热器; 以及第一和第二端子，其设置有插入端子槽中的突起，并且设置有用于连接外部端子的连接端子。因此，可以提高功率半导体模块的散热性能，并且可以提高与端子连接相关的诸如焊料裂纹或分层的可靠性问题。

6. 发明申请

US20140092563A1 HEAT RADIATING SUBSTRATE AND METHOD FOR MANUFACTURING THE SAME 有权
标题翻译：热辐射基板及其制造方法
公开(公告)号：US20140092563A1
公开(公告)日：2014-04-03
申请号：US13753824
申请日：2013-01-30
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ki Lee , Kawng Soo Kim , Bum Seok Suh , Chang Seob Hong , Joon Seok Chae
IPC分类号： H05K7/20 , B23P15/26
CPC分类号： H05K7/20 , B23P15/26 , H01L2224/48091 , H01L2224/73265 , H05K1/0201 , H05K1/0204 , H05K1/0271 , H05K1/05 , H05K3/44 , H05K2201/0187 , H05K2201/09909 , H05K2201/09972 , H05K2203/0207 , Y10T29/4935 , H01L2924/00014
摘要： Disclosed herein is a heat radiating substrate including: a heat radiating plate including a plurality of holes having a predetermined depth and formed in a lower portion of one side thereof; a conductor pattern layer formed on the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.
摘要翻译：本发明公开了一种散热基板，其特征在于，包括：散热板，具有规定深度的多个孔，形成在其一侧的下部; 导体图案层，其形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

7. 发明申请

US20140014313A1 MULTI-STAGE HEAT SINK, COOLING SYSTEM WITH THE SAME AND METHOD FOR CONTROLLING THE SAME 审中-公开
标题翻译：多级散热器，其冷却系统及其控制方法
公开(公告)号：US20140014313A1
公开(公告)日：2014-01-16
申请号：US13671315
申请日：2012-11-07
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Chang Seob Hong , Young Hoon Kwak , Young Ho Sohn
IPC分类号： F28F27/00 , F28F13/12
CPC分类号： F28F27/00 , F28F13/12 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： Disclosed herein is a multi-stage heat sink cooling system, including: at least one step surface in a direction of a surface to which cooling air is injected, wherein the step surface is any one of a step surface having a stair shape that is provided with a plurality of heat radiating plates each having a curve, a step surface provided with a plurality of heat radiating plates having a streamlined smooth curve, and a step surface provided with a plurality of heat radiating fins having a height difference. According to the preferred embodiments of the present invention, the cooling system with the multi-stage heat sink can cool heat generated from a heat radiating element using the multi-stage heat sink and the air injection part to improve a heat release rate.
摘要翻译：本发明公开了一种多级散热器冷却系统，包括：冷却空气注入表面的方向上的至少一个台阶表面，其中台阶表面是具有台阶形状的台阶表面中的任何一个，具有各自具有曲线的多个散热板，设置有具有流线型平滑曲线的多个散热板的台阶表面和设置有多个具有高度差的散热片的台阶表面。根据本发明的优选实施例，具有多级散热器的冷却系统可以使用多级散热器和空气注入部来冷却由散热元件产生的热量，以提高放热率。

8. 发明授权

US09258879B2 Heat radiating substrate and method of manufacturing the same 有权
标题翻译：散热基板及其制造方法
公开(公告)号：US09258879B2
公开(公告)日：2016-02-09
申请号：US13961398
申请日：2013-08-07
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Ki Lee , Bum Seok Suh , Chang Seob Hong , Joon Seok Chae , Kwang Soo Kim
IPC分类号： H05K1/00 , H05K1/02 , H05K1/05 , H01L25/16 , H01L33/64
CPC分类号： H05K1/0201 , H01L25/167 , H01L33/642 , H01L2224/48091 , H01L2224/73265 , H05K1/05 , H05K2201/09845 , H05K2201/09972 , H05K2203/0323 , Y10T29/49155 , H01L2924/00014
摘要： Disclosed herein is a heat radiating substrate including: a heat radiating plate having a step formed so that one side and the other side thereof have thicknesses different from each other; a conductor pattern layer formed over the heat radiating plate and including a mounting pad on which a control device and a power device are mounted and a circuit pattern; and an insulating layer formed between the heat radiating plate and the conductor pattern layer.
摘要翻译：本发明公开了一种散热基板，其特征在于，包括：散热板，其散热板的一侧和另一侧的厚度彼此不同; 导体图案层，形成在所述散热板上并且包括其上安装有控制装置和功率器件的安装焊盘和电路图案; 以及形成在散热板和导体图案层之间的绝缘层。

9. 发明申请

US20150156909A1 POWER SEMICONDUCTOR MODULE 审中-公开
标题翻译：功率半导体模块
公开(公告)号：US20150156909A1
公开(公告)日：2015-06-04
申请号：US14270167
申请日：2014-05-05
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Young Hoon Kwak , Chang Seob Hong , Young Ki Lee
IPC分类号： H05K7/14
CPC分类号： H01L23/053 , H01L23/3735 , H01L23/49811 , H01L24/48 , H01L24/49 , H01L24/73 , H01L25/072 , H01L2224/04042 , H01L2224/48227 , H01L2224/49111 , H01L2224/49175 , H01L2224/49433 , H01L2224/73265 , H01L2924/00014 , H01L2924/13091 , H01L2924/30107 , H01L2224/45099 , H01L2924/00
摘要： Disclosed herein is a power semiconductor module including a module housing comprising an accommodation space formed therein and fixing portions formed on an external surface thereof, a printed circuit board included in the module housing, exposed through the accommodation space, and comprising circuit patterns (Cu patterns) on which power devices are arranged, and a terminal fixedly coupled to the fixing portion, and comprising an input end for receiving power and leads adhered to a circuit pattern between the power devices and for distribution of supplied current. Accordingly, stray inductance may be effectively reduced, and thus, current distribution between power devices may be balanced, thereby effectively preventing a surge voltage from increasing.
摘要翻译：本文公开了一种功率半导体模块，包括模块壳体，其包括形成在其中的容纳空间和形成在其外表面上的固定部分，包括在模块壳体中的印刷电路板通过容纳空间暴露，并且包括电路图案（Cu图案）和固定地连接到固定部分的端子，并且包括用于接收电力的输入端和附着到电力设备之间的电路图案并且用于分配供电电流的引线。因此，可以有效地减小杂散电感，从而可以平衡功率器件之间的电流分布，从而有效地防止浪涌电压增加。

10. 发明申请

US20150091177A1 EXTERNAL CONNECTION TERMINAL, SEMICONDUCTOR PACKAGE HAVING EXTERNAL CONNECTION TERMINAL, AND METHODS FOR MANUFACTURING THE SAME 有权
标题翻译：外部连接端子，具有外部连接端子的半导体封装及其制造方法
公开(公告)号：US20150091177A1
公开(公告)日：2015-04-02
申请号：US14142719
申请日：2013-12-27
申请人： SAMSUNG ELECTRO-MECHANICS CO., LTD.
发明人： Chang Seob Hong , Eun Jung Jo , Kyu Hwan Oh , Kang Hyun Lee
IPC分类号： H01L23/482 , H01L23/00
CPC分类号： H01L23/482 , H01L23/295 , H01L23/49811 , H01L24/16 , H01L24/29 , H01L25/0652 , H01L25/0655 , H01L25/16 , H01L2224/16225 , H01L2224/81447 , H01L2924/01322 , H01L2924/12042 , H01L2924/1531 , H01L2924/181 , H01L2924/19106 , H05K1/0366 , H05K1/141 , H05K3/181 , H05K2201/0275 , H05K2201/049 , H01L2924/00 , H01L2924/00014
摘要： Disclosed herein are an external connection terminal part, a semiconductor package having the external connection terminal part, and a method for manufacturing the same. According to a preferred embodiment of the present invention, the external connection terminal part includes an insulating material and metal plating pattern formed on both surfaces of the insulating material.
摘要翻译：这里公开了一种外部连接端子部件，具有外部连接端子部件的半导体封装件及其制造方法。根据本发明的优选实施例，外部连接端子部分包括形成在绝缘材料的两个表面上的绝缘材料和金属电镀图案。

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