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    • 7. 发明申请
    • LIGHT EMITTING DEVICE AND METHOD OF MANUFACTURING THE SAME
    • 发光装置及其制造方法
    • US20150097177A1
    • 2015-04-09
    • US14569872
    • 2014-12-15
    • SEMICONDUCTOR ENERGY LABORATORY CO., LTD.
    • Takeshi NishiYasuo Nakamura
    • H01L51/52H01L27/32
    • H01L51/5253H01L27/32H01L27/322H01L27/3244H01L33/56H01L51/0024H01L51/5221H01L51/5237H01L51/5246H01L2251/5315H01L2251/5323
    • A light emitting device having a structure in which oxygen and moisture are prevented from reaching light emitting elements, and a method of manufacturing the same, are provided. Further, the light emitting elements are sealed by using a small number of process steps, without enclosing a drying agent. The present invention has a top surface emission structure. A substrate on which the light emitting elements are formed is bonded to a transparent sealing substrate. The structure is one in which a transparent second sealing material covers the entire surface of a pixel region when bonding the two substrates, and a first sealing material (having a higher viscosity than the second sealing material), which contains a gap material (filler, fine particles, or the like) for protecting a gap between the two substrates, surrounds the pixel region. The two substrates are sealed by the first sealing material and the second sealing material. Further, reaction between electrodes of the light emitting elements (cathodes or anodes) and the sealing materials can be prevented by covering the electrodes with a transparent protective layer, for example, CaF2, MgF2, or BaF2.
    • 提供了具有防止氧气和水分到达发光元件的结构的发光器件及其制造方法。 此外,通过使用少量的工艺步骤来密封发光元件,而不包封干燥剂。 本发明具有顶面发射结构。 其上形成有发光元件的基板被接合到透明密封基板。 该结构是当粘合两个基板时透明第二密封材料覆盖像素区域的整个表面的结构,以及包含间隙材料(填料)的第一密封材料(具有比第二密封材料更高的粘度) 微粒等),用于保护两个基板之间的间隙,围绕像素区域。 两个基板由第一密封材料和第二密封材料密封。 此外,通过用透明保护层覆盖电极可以防止发光元件(阴极或阳极)的电极与密封材料之间的反应,例如CaF 2,MgF 2或BaF 2。