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1. 发明授权

US11114498B2 Image sensor and imaging apparatus 有权
公开(公告)号：US11114498B2
公开(公告)日：2021-09-07
申请号：US16892668
申请日：2020-06-04
申请人： SONY CORPORATION
发明人： Tatsuki Nishino , Yosuke Ueno , Yusuke Moriyama , Shizunori Matsumoto
IPC分类号： H01L27/148 , H01L27/146 , H04N5/341 , H04N5/372 , H04N5/374 , H04N5/357
摘要： An image signal output unit is controlled in accordance with a first control signal indicating either voltage state of an on voltage for causing a conductive state and an off voltage having a polarity different from that of the on voltage, and outputs an analog image signal corresponding to the electric charge held by an electric charge holding unit in the conductive state. A reset unit is controlled in accordance with a second control signal indicating either voltage state of the on voltage and the off voltage, resets the electric charge holding unit in the conductive state, transmits a fluctuation in the off voltage to the electric charge holding unit, and fluctuates the analog image signal. A reference signal generation unit generates a reference signal being a signal serving as a reference used when conversion from an analog image signal output from the image signal output unit into a digital image signal is performed. A reference signal correction unit corrects the generated reference signal in accordance with the fluctuation in the off voltage. An analog-to-digital conversion unit performs the conversion on the basis of the corrected reference signal.

2. 发明授权

US10694124B2 Image pickup element and electronic apparatus with noise correcting circuit 有权
公开(公告)号：US10694124B2
公开(公告)日：2020-06-23
申请号：US16083023
申请日：2017-03-03
申请人： Sony Corporation
发明人： Tatsuki Nishino , Yosuke Ueno , Yusuke Moriyama , Shizunori Matsumoto
IPC分类号： H04N5/335 , H04N5/357 , H04N5/369 , H04N5/378 , G05F3/26 , H04N5/341
摘要： The present technique relates to an image pickup element and an electronic apparatus which enable a higher-quality image to be obtained. An image pickup element includes an input sense portion configured to produce a noise correction signal portion includes a first transistor and a second transistor configuring a current mirror circuit, a switch provided between a gate of the first transistor and a gate of the second transistor, and a capacitive element one electrode of which is connected between the switch and the gate of the second transistor on an output side of the current mirror circuit, and the other electrode of which is connected to the predetermined power source.

3. 发明授权

US09838626B2 Semiconductor apparatus, solid-state image sensing apparatus, and camera system 有权
公开(公告)号：US09838626B2
公开(公告)日：2017-12-05
申请号：US15630608
申请日：2017-06-22
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/374 , H04N5/363 , H03M1/56 , H03M1/08 , H03M1/12 , H04N5/359 , H04N5/378 , H04N5/3745 , H04N5/225 , H01L27/146
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

4. 发明申请

US20130100326A1 COMPARATOR, AD CONVERTER, SOLID-STATE IMAGING DEVICE, AND CAMERA SYSTEM 有权
标题翻译：比较器，AD转换器，固态成像装置和摄像机系统
公开(公告)号：US20130100326A1
公开(公告)日：2013-04-25
申请号：US13653008
申请日：2012-10-16
申请人： SONY CORPORATION
发明人： Yosuke Ueno
IPC分类号： H03K5/22 , H03M1/12 , H01L27/146 , H04N5/335
CPC分类号： H03F3/72 , H03K5/2481 , H03M1/123 , H03M1/56 , H04N5/357 , H04N5/378
摘要： Disclosed herein is a comparator including: a first input sampling capacitance; a second input sampling capacitance; an output node; a transconductance (Gm) amplifier as a differential comparator section configured to receive a slope signal, a signal level of the slope signal changing with a slope, at one input terminal of the Gm amplifier via the first input sampling capacitance, and receive an input signal at another input terminal of the Gm amplifier via the second input sampling capacitance, and subject the slope signal and the input signal to comparing operation; and an isolator configured to hold a voltage of an output section of the Gm amplifier constant, the isolator being disposed between the output section of the Gm amplifier and the output node.
摘要翻译：本文公开了一种比较器，包括：第一输入采样电容; 第二输入采样电容; 输出节点; 作为差分比较器部分的跨导（Gm）放大器，被配置为经由所述第一输入采样电容接收所述Gm放大器的一个输入端处的倾斜信号的斜坡信号的信号电平，所述倾斜信号以斜率变化，并且接收输入信号通过第二输入采样电容在Gm放大器的另一个输入端，并对斜率信号和输入信号进行比较操作; 以及隔离器，被配置为保持Gm放大器的输出部分的电压恒定，所述隔离器设置在Gm放大器的输出部分和输出节点之间。

5. 发明授权

US10911707B2 Imaging element, imaging method and electronic apparatus 有权
公开(公告)号：US10911707B2
公开(公告)日：2021-02-02
申请号：US16840077
申请日：2020-04-03
申请人： SONY CORPORATION
发明人： Atsumi Niwa , Yosuke Ueno , Shimon Teshima , Daijiro Anai , Yoshinobu Furusawa , Taishin Yoshida , Takahiro Uchimura , Eiji Hirata
IPC分类号： H04N5/378 , H04N5/374 , H04N9/04 , H01L27/146 , H03M1/12 , H03M1/56 , H04N5/369 , H04N5/3745
摘要： There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

6. 发明授权

US10659716B2 Imaging element, imaging method and electronic apparatus 有权
公开(公告)号：US10659716B2
公开(公告)日：2020-05-19
申请号：US16559795
申请日：2019-09-04
申请人： SONY CORPORATION
发明人： Atsumi Niwa , Yosuke Ueno , Shimon Teshima , Daijiro Anai , Yoshinobu Furusawa , Taishin Yoshida , Takahiro Uchimura , Eiji Hirata
IPC分类号： H04N5/378 , H04N5/374 , H04N9/04 , H01L27/146 , H04N5/3745
摘要： There is provided an imaging device including a pixel array section including pixel units two-dimensionally arranged in a matrix pattern, each pixel unit including a photoelectric converter, and a plurality of column signal lines disposed according to a first column of the pixel units. The imaging device further includes an analog to digital converter that is shared by the plurality of column signal lines.

7. 发明授权

US10554912B2 Semiconductor apparatus, solid-state image sensing apparatus, and camera system 有权
公开(公告)号：US10554912B2
公开(公告)日：2020-02-04
申请号：US15800744
申请日：2017-11-01
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04M1/56 , H04N5/359 , H01L27/146 , H03M1/56 , H03M1/08 , H03M1/12 , H04N5/378 , H04N5/225 , H04N5/374 , H04N5/3745
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

8. 发明授权

US10008525B2 Imaging element and imaging apparatus 有权
公开(公告)号：US10008525B2
公开(公告)日：2018-06-26
申请号：US15118956
申请日：2015-02-17
申请人： SONY CORPORATION
发明人： Yosuke Ueno , Yusuke Ikeda , Shizunori Matsumoto , Tsutomu Haruta , Rei Yoshikawa
IPC分类号： H01L27/146 , H04N5/357 , H04N5/369 , H04N5/3745 , H04N5/378
摘要： An imaging element comprises a photoelectric conversion unit formed in a pixel region and configured to convert light into electrical charge. Further, the imaging element includes a transistor formed in the pixel region and configured to transfer electric charge from the photoelectric conversion unit. The photoelectric conversion unit of the imaging element may be connected to a well of the pixel region, where the well of the pixel region has a negative potential.

9. 发明申请

US20170134678A1 SEMICONDUCTOR APPARATUS, SOLID-STATE IMAGE SENSING APPARATUS, AND CAMERA SYSTEM 审中-公开
公开(公告)号：US20170134678A1
公开(公告)日：2017-05-11
申请号：US15414019
申请日：2017-01-24
申请人： Sony Corporation
发明人： Toshiaki Nagai , Ken Koseki , Yosuke Ueno , Atsushi Suzuki
IPC分类号： H04N5/363 , H04N5/378 , H03M1/56 , H03M1/08 , H03M1/12 , H04N5/374 , H01L27/146
CPC分类号： H04N5/363 , H01L27/14612 , H01L27/14618 , H01L27/14634 , H01L27/14636 , H01L27/14643 , H01L2924/0002 , H03M1/08 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/2253 , H04N5/359 , H04N5/374 , H04N5/37457 , H04N5/378 , H01L2924/00
摘要： A semiconductor apparatus, a solid-state image sensing apparatus, and a camera system capable of reducing interference between signals transmitted through adjacent via holes, preventing an increase in the number of the via holes, reducing the area of a chip having sensors thereon and the number of mounting steps thereof. First and second chips are bonded together to form a laminated structure, a wiring between the first chip and the second chip being connected through via holes, the first chip transmitting signals obtained by time-discretizing analog signals generated by respective sensors to the second chip through the corresponding via holes, the second chip sampling the signals transmitted from the first chip through the via holes at a timing different from a timing at which the signals are sampled by the first chip and quantizing the sampled signals to obtain digital signals.

10. 发明授权

US09407846B2 Analog-to-digital conversion device 有权
标题翻译：模数转换器
公开(公告)号：US09407846B2
公开(公告)日：2016-08-02
申请号：US14541712
申请日：2014-11-14
申请人： Sony Corporation
发明人： Yasunori Tsukuda , Takashi Moue , Yosuke Ueno
IPC分类号： H04N5/378 , H04N5/374 , H03M1/08 , H04N5/369 , H03M1/12 , H03M1/56
CPC分类号： H04N5/374 , H03M1/0863 , H03M1/123 , H03M1/56 , H04N5/3698 , H04N5/378
摘要： An analog-to-digital conversion device includes a plurality of counting period supply units that supply a period of length according to a voltage of an analog signal inputted into each counting period supply unit based on the voltage of the analog signal as a counting period, a plurality of counter circuits which are connected to a common power supply and which perform a counting operation that counts a count value in the counting period different from each other and generate a digital signal indicating the count value, and a plurality of compensation circuits which are connected to the power supply and which operate so that the greater the number of counter circuits that stop the counting operation among the plurality of counter circuits, the greater the number of the compensation circuits that operate.
摘要翻译：模数转换装置包括多个计数周期供给单元，其基于模拟信号的电压作为计数周期，根据输入到每个计数周期供给单元的模拟信号的电压提供长度的周期，多个计数器电路，其连接到公共电源，并且执行对计数周期内的计数值进行计数的计数操作，并产生指示计数值的数字信号;以及多个补偿电路，连接到电源并且其操作使得在多个计数器电路中停止计数操作的计数器电路的数量越多，操作的补偿电路的数量越多。

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