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    • 7. 发明授权
    • Semiconductor film, method for manufacturing the same, and power storage device
    • 半导体膜及其制造方法以及蓄电装置
    • US08643182B2
    • 2014-02-04
    • US13908047
    • 2013-06-03
    • Semiconductor Energy Laboratory Co., Ltd.
    • Tomokazu YokoiTakayuki InoueMakoto Furuno
    • H01L23/12
    • H01L29/12H01M4/0428H01M4/134H01M4/366H01M4/386
    • Provided are a semiconductor film including silicon microstructures formed at high density, and a manufacturing method thereof. Further, provided are a semiconductor film including silicon microstructures whose density is controlled, and a manufacturing method thereof. Furthermore, a power storage device with improved charge-discharge capacity is provided. A manufacturing method in which a semiconductor film with a silicon layer including silicon structures is formed over a substrate with a metal surface is used. The thickness of a silicide layer formed by reaction between the metal and the silicon is controlled, so that the grain sizes of silicide grains formed at an interface between the silicide layer and the silicon layer are controlled and the shapes of the silicon structures are controlled. Such a semiconductor film can be applied to an electrode of a power storage device.
    • 提供了包括以高密度形成的硅微结构的半导体膜及其制造方法。 此外,提供了包括其密度被控制的硅微结构的半导体膜及其制造方法。 此外,提供了具有改善的充放电容量的蓄电装置。 使用其中在具有金属表面的基板上形成具有包括硅结构的硅层的半导体膜的制造方法。 控制由金属与硅之间的反应形成的硅化物层的厚度,从而控制在硅化物层和硅层之间的界面处形成的硅化物晶粒的晶粒尺寸,并且控制硅结构的形状。 这样的半导体膜可以应用于蓄电装置的电极。