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    • 1. 发明授权
    • Light emitting device package with frame and optically transmissive element
    • 具有框架和光学透射元件的发光器件封装
    • US07906794B2
    • 2011-03-15
    • US11773426
    • 2007-07-04
    • Shane HarrahIngo SpeierPhilippe Schick
    • Shane HarrahIngo SpeierPhilippe Schick
    • H01L33/00H01L21/02
    • H01L33/56H01L33/64H01L2224/48465H01L2224/73265
    • The present invention provides a lighting device package with one or more light-emitting elements operatively coupled to a substrate and a frame disposed at least in part around the one or more light-emitting elements. The frame and substrate define a cavity in which the one or more light-emitting elements are positioned, wherein this cavity can be substantially enclosed by an optically transmissive system. At least a portion of the cavity can be filled with an encapsulation material. The frame defines one or more passageways, wherein each passageway interconnects the cavity with the outside through an outside port. For example, the outside port can be accessible from the ambient when the lighting device package is in an assembled state, thereby enabling fluidic movement of the encapsulation material into and/or out of the cavity.
    • 本发明提供了一种照明装置封装,其具有可操作地耦合到基板的一个或多个发光元件和至少部分地围绕所述一个或多个发光元件设置的框架。 框架和基底限定了一个或多个发光元件定位在其中的空腔,其中该空腔可以被光学透射系统基本上包围。 空腔的至少一部分可以用封装材料填充。 框架限定一个或多个通道,其中每个通道通过外部端口将空腔与外部相互连接。 例如,当照明装置封装处于组装状态时,外部端口可以从环境接近,从而使得封装材料能够流体地移动到和/或离开空腔。
    • 2. 发明申请
    • Solid-State Lighting Device Package
    • 固态照明器件封装
    • US20080296589A1
    • 2008-12-04
    • US10582565
    • 2006-03-24
    • Ingo SpeierPhilippe Schick
    • Ingo SpeierPhilippe Schick
    • H01L33/00
    • H01L33/642H01L25/0753H01L25/167H01L33/54H01L33/56H01L33/58H01L33/648H01L2924/0002H01L2933/0091H01L2924/00
    • The present invention provides a lighting device package, which can provide a means for efficient thermal access to the lighting device package in addition to a desired level of light extraction from the one or more light-emitting elements within the lighting device package. The lighting device package comprises a substrate having a thermally conductive region to which one or more light-emitting elements are thermally connected, wherein the light-emitting elements may be relatively closely packed. An optical system is optically coupled to one or more light emitting elements, and is positioned relative to the substrate such that the optical system substantially encloses the one or more light-emitting elements on the substrate. The optical system is adapted to extract the light from the one or more light-emitting elements.
    • 本发明提供了一种照明装置封装,除了从照明器件封装内的一个或多个发光元件提取所需的光级以外,还可以提供用于有效地进入照明器件封装的装置。 照明装置封装包括具有导热区域的基板,一个或多个发光元件热连接到该导热区域,其中发光元件可以相对紧密地封装。 光学系统光学耦合到一个或多个发光元件,并且相对于基板定位,使得光学系统基本上将衬底上的一个或多个发光元件封闭。 光学系统适于从一个或多个发光元件提取光。