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    • 9. 发明授权
    • Film-like composite structure and method of manufacture thereof
    • 薄膜状复合结构体及其制造方法
    • US06452244B1
    • 2002-09-17
    • US09319210
    • 1999-08-10
    • Tadao MiuraTouru SumiyaShun-ichiro Tanaka
    • Tadao MiuraTouru SumiyaShun-ichiro Tanaka
    • H01L27095
    • H01L29/872H01L29/45H01L29/452H01L29/456H01L29/47H01L29/475
    • On a semiconductor layer 1 consisting of a substrate of a semiconductor single crystal or the like, a metallic layer 2 of a thickness of 20 nm or less is formed. The metallic layer 2 comprises a first area A directly contacting with the semiconductor layer 1, and a second area B that is interposed by an intermediate layer 3 consisting of an insulator, a metal different from the metallic layer 2 or a semiconductor different from the semiconductor layer 1 between the semiconductor 1 and the metallic layer 2, and of a thickness of 10 nm or less. The first area and the second area are different in their Schottky currents, further in their Schottky barrier heights. Any one of the respective areas A and B has an area of nanometer level, and the respective interfaces in each of the areas A and B have an essentially uniform potential barrier, respectively. Such a film-like composite structure contributes to a minute semiconductor device of nanometer level and realization of a new functional device.
    • 在由半导体单晶等的基板构成的半导体层1上形成厚度为20nm以下的金属层2。 金属层2包括与半导体层1直接接触的第一区域A和由绝缘体,不同于金属层2的金属或不同于半导体的半导体的中间层3插入的第二区域B 层1在半导体1和金属层2之间,厚度为10nm以下。 第一个区域和第二个区域的肖特基电流在其肖特基势垒高度方面是不同的。 各区域A和B中的任一个具有纳米级的面积,并且各区域A和B中的各个界面分别具有基本均匀的势垒。 这种膜状复合结构有助于纳米级的微小半导体器件和新功能器件的实现。