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1. 发明授权

US09357146B2 Solid-state imaging device and camera system 有权
公开(公告)号：US09357146B2
公开(公告)日：2016-05-31
申请号：US14732349
申请日：2015-06-05
申请人： Sony Corporation
发明人： Masamichi Ito , Tsuyoshi Hara , Yoshiaki Inada
IPC分类号： H04N5/374 , H04N5/341 , H04N5/357 , H04N5/3745 , H04N5/378 , H04N5/347 , H04N5/345 , H04N5/376
CPC分类号： H04N5/37455 , H04N5/341 , H04N5/3456 , H04N5/347 , H04N5/357 , H04N5/374 , H04N5/3741 , H04N5/3745 , H04N5/3765 , H04N5/378
摘要： A solid-state imaging device includes a pixel array with unit pixels each having a photoelectric conversion device arranged in a matrix. Column signal lines are wired with respect to one column in the pixel arrangement and pixels are regularly connected to the column signal lines in accordance with rows in which pixels are positioned. A pixel signal reading unit has a column processing unit that reads pixel signals in units of plural pixels from the pixel array and performs column processing to read signals on a column basis, wherein the pixel signal reading unit includes a column input unit which can connect one or plural column signal lines arranged at a corresponding column to an input of one column processing unit through plural capacitors connected in parallel The column input unit has switches which can change a connection state between capacitors and column signal lines corresponding to the column.

2. 发明申请

US20150009382A1 SOLID-STATE IMAGING DEVICE AND CAMERA SYSTEM 审中-公开
公开(公告)号：US20150009382A1
公开(公告)日：2015-01-08
申请号：US14494087
申请日：2014-09-23
申请人： Sony Corporation
发明人： Masamichi Ito , Tsuyoshi Hara , Yoshiaki Inada
IPC分类号： H04N5/374 , H04N5/3745 , H04N5/345 , H04N5/376
CPC分类号： H04N5/37455 , H04N5/341 , H04N5/3456 , H04N5/347 , H04N5/357 , H04N5/374 , H04N5/3741 , H04N5/3745 , H04N5/3765 , H04N5/378
摘要： A solid-state imaging device includes a pixel array with unit pixels each having a photoelectric conversion device arranged in a matrix. Column signal lines are wired with respect to one column in the pixel arrangement and pixels are regularly connected to the column signal lines in accordance with rows in which pixels are positioned. A pixel signal reading unit has a column processing unit that reads pixel signals in units of plural pixels from the pixel array and performs column processing to read signals on a column basis, wherein the pixel signal reading unit includes a column input unit which can connect one or plural column signal lines arranged at a corresponding column to an input of one column processing unit through plural capacitors connected in parallel The column input unit has switches which can change a connection state between capacitors and column signal lines corresponding to the column.

3. 发明授权

US11611196B2 Light emitting element 有权
公开(公告)号：US11611196B2
公开(公告)日：2023-03-21
申请号：US16471428
申请日：2017-10-13
申请人： Sony Corporation
发明人： Tatsushi Hamaguchi , Jugo Mitomo , Hiroshi Nakajima , Masamichi Ito , Susumu Sato
IPC分类号： H01S5/183 , H01S5/02 , H01S5/343 , H01S5/042
摘要： A light emitting element according to the present disclosure includes a first light reflecting layer 41, a laminated structure 20, and a second light reflecting layer 42 laminated to each other. The laminated structure 20 includes a first compound semiconductor layer 21, a light emitting layer 23, and a second compound semiconductor layer 22 laminated to each other from a side of the first light reflecting layer. Light from the laminated structure 20 is emitted to an outside via the first light reflecting layer 41 or the second light reflecting layer 42. The first light reflecting layer 41 has a structure in which at least two types of thin films 41A and 41B are alternately laminated to each other in plural numbers. A film thickness modulating layer 80 is provided between the laminated structure 20 and the first light reflecting layer 41.

4. 发明授权

US11594859B2 Light emitting element and light emitting element array 有权
公开(公告)号：US11594859B2
公开(公告)日：2023-02-28
申请号：US16631709
申请日：2018-05-09
申请人： Sony Corporation
发明人： Jugo Mitomo , Tatsushi Hamaguchi , Hiroshi Nakajima , Masamichi Ito , Susumu Sato
IPC分类号： H01S5/183 , H01S5/042 , H01S5/02
摘要： A light emitting element includes: a laminated structure 20 obtained by laminating a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22; a first light reflecting layer 41 disposed on a first surface side of the first compound semiconductor layer 21; a second light reflecting layer 42 disposed on a second surface side of the second compound semiconductor layer 22; and light convergence/divergence changing means 50. The first light reflecting layer 41 is formed on a concave mirror portion 43. The second light reflecting layer 42 has a flat shape. When light generated in the active layer 23 is emitted to the outside, a light convergence/divergence state before the light is incident on the light convergence/divergence changing means 50 is different from a light convergence/divergence state after the light passes through the light convergence/divergence changing means 50.

5. 发明授权

US11031752B2 Surface-emitting laser and electronic apparatus 有权
公开(公告)号：US11031752B2
公开(公告)日：2021-06-08
申请号：US16463309
申请日：2017-10-19
申请人： Sony Corporation
发明人： Tatsushi Hamaguchi , Jugo Mitomo , Hiroshi Nakajima , Masamichi Ito , Susumu Sato , Noriyuki Futagawa
IPC分类号： H01S5/183 , H01S5/187 , H01S5/125
摘要： A surface-emitting laser according to an embodiment of the present disclosure includes a current constriction region having an opening and formed by impurities injected into a laminate from side of a second semiconductor layer; and a first DBR layer on side of a first semiconductor layer and a second DBR layer on the side of the second semiconductor layer having the laminate interposed therebetween at a position facing the opening. At the opening, an opening diameter close to the first DBR layer is larger than an opening diameter close to the second DBR layer.

6. 发明授权

US11011888B2 Light-emitting device and light-emitting apparatus 有权
公开(公告)号：US11011888B2
公开(公告)日：2021-05-18
申请号：US16490369
申请日：2018-03-05
申请人： SONY CORPORATION
发明人： Jugo Mitomo , Tatsushi Hamaguchi , Hiroshi Nakajima , Masamichi Ito , Susumu Sato , Hidekazu Kawanishi
IPC分类号： H01S5/183 , H01S5/024 , H01S5/343 , H01S5/42
摘要： A light-emitting device according to an embodiment of the present disclosure includes a laminate. The laminate includes an active layer, a first semiconductor layer, and a second semiconductor layer. The first semiconductor layer and the second semiconductor layer sandwich the active layer in between. The light-emitting device further includes a current confining layer, a concave-shaped first reflecting mirror provided on side of the first semiconductor layer, and a second reflecting mirror provided on side of the second semiconductor layer. The current confining layer has an opening. The first reflecting mirror and the second reflecting mirror sandwich the laminate and the opening in between. The light-emitting device further includes a first reflecting layer and a phosphor layer. The first reflecting layer is disposed at a position opposed to the first reflecting mirror with a predetermined gap in between. The phosphor layer is disposed between the first reflecting mirror and the first reflecting layer, and performs wavelength conversion on light leaking from the first reflecting mirror.

7. 发明授权

US11411372B2 Light emitting element and manufacturing method therefor 有权
公开(公告)号：US11411372B2
公开(公告)日：2022-08-09
申请号：US16627174
申请日：2018-04-27
申请人： Sony Corporation
发明人： Tatsushi Hamaguchi , Jugo Mitomo , Susumu Sato , Hiroshi Nakajima , Masamichi Ito , Hidekazu Kawanishi
IPC分类号： H01S5/183 , H01S5/02 , H01S5/343 , H01S5/323
摘要： A method of manufacturing a light emitting element includes, at least: (A) forming a stacked structure 20 which includes a GaN-based compound semiconductor and in which a first compound semiconductor layer 21, an active layer 23, and a second compound semiconductor layer 22 are stacked, and forming a concave mirror section 43 on a first surface side of the first compound semiconductor layer 21; then (B) forming a photosensitive material layer 35 over the second compound semiconductor layer 22; and thereafter (C) exposing the photosensitive material layer 35 to light from the concave mirror section side through the stacked structure 20, to obtain a treatment mask layer including the photosensitive material layer 35, and then processing the second compound semiconductor layer 22 by use of the treatment mask layer.

8. 发明授权

US11309686B2 Surface emitting laser and method of manufacturing the same 有权
公开(公告)号：US11309686B2
公开(公告)日：2022-04-19
申请号：US16621807
申请日：2018-04-17
申请人： SONY CORPORATION
发明人： Hiroshi Nakajima , Tatsushi Hamaguchi , Jugo Mitomo , Susumu Sato , Masamichi Ito , Hidekazu Kawanishi
IPC分类号： H01S5/042 , H01S5/02 , H01S5/183 , H01S5/30 , H01S5/343
摘要： A surface emitting laser includes: a semiconductor layer containing a nitride semiconductor, and including a first semiconductor layer, an active layer, and a second semiconductor layer that are stacked in this order, in which the semiconductor layer includes a light emitting region; and a first light reflecting layer and a second light reflecting layer that are opposed to each other with the semiconductor layer being disposed therebetween. The first semiconductor layer has a high dislocation portion disposed outside the light emitting region. The high dislocation portion has an average dislocation density higher than an average dislocation density of the light emitting region.

9. 发明授权

US10051222B2 Solid-state imaging device and camera system having lower power consumption 有权
公开(公告)号：US10051222B2
公开(公告)日：2018-08-14
申请号：US15612930
申请日：2017-06-02
申请人： SONY CORPORATION
发明人： Masamichi Ito , Tsuyoshi Hara , Yoshiaki Inada
IPC分类号： H04N5/3745 , H04N5/341 , H04N5/357 , H04N5/378 , H04N5/374 , H04N5/345 , H04N5/376 , H04N5/347
摘要： A solid-state imaging device includes a pixel array with unit pixels each having a photoelectric conversion device arranged in a matrix. Column signal lines are wired with respect to one column in the pixel arrangement and pixels are regularly connected to the column signal lines in accordance with rows in which pixels are positioned. A pixel signal reading unit has a column processing unit that reads pixel signals in units of plural pixels from the pixel array and performs column processing to read signals on a column basis, wherein the pixel signal reading unit includes a column input unit which can connect one or plural column signal lines arranged at a corresponding column to an input of one column processing unit through plural capacitors connected in parallel The column input unit has switches which can change a connection state between capacitors and column signal lines corresponding to the column.

10. 发明授权

US09083903B2 Solid-state imaging device and camera system 有权
标题翻译：固态成像装置和相机系统
公开(公告)号：US09083903B2
公开(公告)日：2015-07-14
申请号：US14494087
申请日：2014-09-23
申请人： Sony Corporation
发明人： Masamichi Ito , Tsuyoshi Hara , Yoshiaki Inada
IPC分类号： H04N5/374 , H04N5/341 , H04N5/357 , H04N5/3745 , H04N5/378 , H04N5/347 , H04N5/345 , H04N5/376
CPC分类号： H04N5/37455 , H04N5/341 , H04N5/3456 , H04N5/347 , H04N5/357 , H04N5/374 , H04N5/3741 , H04N5/3745 , H04N5/3765 , H04N5/378
摘要： A solid-state imaging device includes a pixel array with unit pixels each having a photoelectric conversion device arranged in a matrix. Column signal lines are wired with respect to one column in the pixel arrangement and pixels are regularly connected to the column signal lines in accordance with rows in which pixels are positioned. A pixel signal reading unit has a column processing unit that reads pixel signals in units of plural pixels from the pixel array and performs column processing to read signals on a column basis, wherein the pixel signal reading unit includes a column input unit which can connect one or plural column signal lines arranged at a corresponding column to an input of one column processing unit through plural capacitors connected in parallel The column input unit has switches which can change a connection state between capacitors and column signal lines corresponding to the column.
摘要翻译：固态成像装置包括具有单位像素的像素阵列，每个像素阵列具有以矩阵形式布置的光电转换装置。列信号线相对于像素布置中的一列被布线，并且像素根据像素所在的行而规则地连接到列信号线。像素信号读取单元具有列处理单元，其从像素阵列读取以多个像素为单位的像素信号，并执行列处理以逐列读取信号，其中像素信号读取单元包括列输入单元，其可以连接一个或多列列信号线，通过并联连接的多个电容器配置在与列列处理单元的输入相对应的列上。列输入单元具有可改变电容器与列对应的列信号线之间的连接状态的开关。

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