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1. 发明授权

US08382024B2 Device for controlling the drive of a reel 有权
标题翻译：用于控制卷轴驱动的装置
公开(公告)号：US08382024B2
公开(公告)日：2013-02-26
申请号：US12902926
申请日：2010-10-12
申请人： Stefan Fries , Werner Steinhilber , Helmut Lengerer
发明人： Stefan Fries , Werner Steinhilber , Helmut Lengerer
IPC分类号： B21C47/16 , B21C49/00 , B21F23/00 , B65H51/30 , B65H59/38
CPC分类号： B21C47/16 , B21C49/00 , B21F23/00 , B65H51/10 , B65H51/30 , B65H59/387
摘要： With a device for controlling the drive of a reel, with a wire supply in the form of a coil of said wire supply, from which the wire, through interposition of a tensioning device, which is spring-pretensioned in one deflection direction and effective up to a maximum deflection, for approximated stabilization of the wire tension of a feed installation of the wire infeed of a downstream positioned wire processing machine, the velocity curve of the feed rate of the wire infeed in accordance with a preset velocity-time profile is controlled by a control unit of the wire processing machine, and whereby the curve of the rotation speed of the reel in accordance with a preset rotation speed-time profile is controlled by the drive control of the reel, whereby the drive control of the reel sets the rotation speed-time profile of the reel, with regard to the velocity-time profile of the feed rate, forward by a preset time interval.
摘要翻译：利用用于控制卷轴驱动的装置，以所述电线供应线圈形式的电线供给，通过插入张紧装置的电线，弹簧预张紧在一个偏转方向上并有效地上升对于最大偏转，为了近似稳定下游定位的丝线加工机的送丝装置的进给装置的丝线张力，控制根据预设的速度 - 时间曲线的送丝速度的速度曲线通过线加工机的控制单元，通过卷轴的驱动控制来控制卷轴根据预设的转速 - 时间曲线的转速的曲线，由此卷轴的驱动控制将关于进给速度的速度 - 时间曲线，卷轴的转速 - 时间曲线以预设的时间间隔向前。

2. 发明申请

US20110192204A1 METHOD AND APPARATUS FOR THE PRODUCTION OF A BENT PART 有权
标题翻译：生产零件的方法和装置
公开(公告)号：US20110192204A1
公开(公告)日：2011-08-11
申请号：US12900641
申请日：2010-10-08
申请人： Werner Steinhilber , Stefan Fries , Anton Schoenle , Matthias Groeninger
发明人： Werner Steinhilber , Stefan Fries , Anton Schoenle , Matthias Groeninger
IPC分类号： B21D7/12 , B21D31/00
CPC分类号： B21F1/00 , B21D7/12
摘要： A method produces a bent part by two- or three-dimensional bending of an elongate workpiece, in particular a wire or tube, in a bending process wherein at least one portion of the workpiece is moved into an initial position in the region of engagement of a bending tool by one or more feed operations by the coordinated activation of the movements of driven machine axes of a bending machine numerically controlled by a control device and is formed by bending in at least one bending operation with the aid of a bending tool. The movements of the driven machine axes are generated according to a movement profile predeterminable by the control device of the bending machine and include at least one oscillation-relevant movement leading to an oscillation of the free end portion of the bent part. During an oscillation-relevant movement, a compensating movement, reducing the generation of oscillation and/or damping the oscillation, a machine axis is generated in at least one compensation time interval.
摘要翻译：一种方法通过弯曲过程中的细长工件，特别是线或管的二维或三维弯曲来产生弯曲部分，其中工件的至少一部分在接合区域中移动到初始位置通过由控制装置数字控制的弯曲机的从动机器轴的运动的协调启动而通过一个或多个进给操作的弯曲工具，并且通过弯曲工具在至少一个弯曲操作中弯曲形成。从动机器轴的运动根据由弯曲机的控制装置预先确定的运动轮廓产生，并且包括至少一个振动相关运动，导致弯曲部分的自由端部的振动。在振荡相关运动期间，补偿运动，减少振荡的产生和/或阻尼振荡，在至少一个补偿时间间隔内产生机器轴。

3. 发明授权

US08573019B2 Method and apparatus for the production of a bent part 有权
标题翻译：用于生产弯曲部分的方法和装置
公开(公告)号：US08573019B2
公开(公告)日：2013-11-05
申请号：US12900641
申请日：2010-10-08
申请人： Werner Steinhilber , Stefan Fries , Anton Schoenle , Matthias Groeninger
发明人： Werner Steinhilber , Stefan Fries , Anton Schoenle , Matthias Groeninger
IPC分类号： B21D11/00 , G06F19/00
CPC分类号： B21F1/00 , B21D7/12
摘要： A method produces a bent part by two- or three-dimensional bending of an elongate workpiece, in particular a wire or tube, in a bending process wherein at least one portion of the workpiece is moved into an initial position in the region of engagement of a bending tool by one or more feed operations by the coordinated activation of the movements of driven machine axes of a bending machine numerically controlled by a control device and is formed by bending in at least one bending operation with the aid of a bending tool. The movements of the driven machine axes are generated according to a movement profile predeterminable by the control device of the bending machine and include at least one oscillation-relevant movement leading to an oscillation of the free end portion of the bent part. During an oscillation-relevant movement, a compensating movement, reducing the generation of oscillation and/or damping the oscillation, a machine axis is generated in at least one compensation time interval.
摘要翻译：一种方法通过弯曲过程中的细长工件，特别是线或管的二维或三维弯曲来产生弯曲部分，其中工件的至少一部分在接合区域中移动到初始位置通过由控制装置数字控制的弯曲机的从动机器轴的运动的协调启动而通过一个或多个进给操作的弯曲工具，并且通过弯曲工具在至少一个弯曲操作中弯曲形成。从动机器轴的运动根据由弯曲机的控制装置预先确定的运动轮廓产生，并且包括至少一个振动相关运动，导致弯曲部分的自由端部的振动。在振荡相关运动期间，补偿运动，减少振荡的产生和/或阻尼振荡，在至少一个补偿时间间隔内产生机器轴。

4. 发明授权

US06682635B2 Cathodic sputtering chamber for applying material to the surface of a semiconductor wafer located therein 有权
标题翻译：用于将材料施加到位于其中的半导体晶片的表面的阴极溅射室
公开(公告)号：US06682635B2
公开(公告)日：2004-01-27
申请号：US10085446
申请日：2002-02-28
申请人： Hermann Bichler , Reinhard Hanzlik , Frank Mueller , Stefan Fries , Helmut Endl
发明人： Hermann Bichler , Reinhard Hanzlik , Frank Mueller , Stefan Fries , Helmut Endl
IPC分类号： C23C1434
CPC分类号： H01J37/3447 , C23C14/564
摘要： A chamber (10) for applying material to the surface of a semiconductor wafer (18) located in the chamber by means of cathodic sputtering a target (26), located on a target mount (24), of the material to be applied or a component thereof, contains a wafer mount (14) on which the semiconductor wafer (18) to be coated is located. The wafer mount (14) is provided movable in the chamber (10) between a charging position for application of the semiconductor wafer and a sputtering position in which semiconductor wafer is located at a predefined distance away from and opposite to the target. Provided in the chamber is a shielding support (30) which is supported by the edge of the semiconductor wafer in the sputtering position in maintaining it in contact with the wafer mount, the shielding support extending between the edge of the semiconductor wafer and a portion adjoining the edge of the target on the target mount and thus defining a sputtering space between the target and the semiconductor wafer.
摘要翻译：一种用于通过阴极溅射将位于所述腔室中的半导体晶片（18）的表面施加材料的室（10），所述靶（26）位于所述待施加材料的靶材（24）上，或者其组件包含晶片安装件（14），待涂覆的半导体晶片（18）位于其上。晶片安装件（14）设置成可在半导体晶片的施加位置和溅射位置之间的腔室（10）中移动，其中半导体晶片位于远离目标的预定距离处。在腔室中设置有屏蔽支撑件（30），其在溅射位置由半导体晶片的边缘支撑，以保持其与晶片安装座接触，所述屏蔽支撑件在半导体晶片的边缘与邻接的部分之间延伸目标物体上的靶的边缘，从而在靶和半导体晶片之间限定溅射空间。

5. 发明授权

US09067255B2 Bending apparatus for rod-shaped workpieces 有权
标题翻译：棒状工件弯曲装置
公开(公告)号：US09067255B2
公开(公告)日：2015-06-30
申请号：US13543149
申请日：2012-07-06
申请人： Stefan Fries , Joerg Moeck , Frank Weiblen , Harry Schweikardt
发明人： Stefan Fries , Joerg Moeck , Frank Weiblen , Harry Schweikardt
IPC分类号： B21F1/00
CPC分类号： B21F1/00 , B21F1/006
摘要： A bending device for rod-shaped workpieces having a bending head with a mandrel rotatable about a rotation axis, a cutting device for cutting the respective workpiece in a cutting plane, and a feed and straightening device for feeding the workpieces to the bending head, the cutting device capable of being moved along a travel path in the feed direction of the workpieces, with the bending head capable of being shifted between an operating position in which it is moved towards the workpiece and an inactive end position remote therefrom, the bending head, in order to assume its operating position, can be moved into the travel path of the cutting device, whereas, when assuming its inactive end position, it is positioned outside the travel path of the cutting device, and, when the bending head is situated in its inactive end position, the cutting device can be moved downstream on its travel path at least partly over the area of the operating position of the bending head.
摘要翻译：一种用于棒状工件的弯曲装置，具有可绕旋转轴线旋转的心轴的弯曲头，用于在切割平面中切割相应工件的切割装置，以及用于将工件馈送到弯曲头的进给和矫直装置，切割装置，其能够沿着工件的进给方向上的行进路径移动，其中弯曲头能够在其朝向工件移动的操作位置和远离其的非活动终止位置之间移动，弯曲头，为了承担其操作位置，可以移动到切割装置的行进路径中，而当假定其不活动的结束位置时，其位于切割装置的行进路径的外侧，并且当弯曲头位于其不活动的终止位置，切割装置可以在其行进路径上至少部分地在弯曲头的操作位置的区域上向下游移动。

6. 发明授权

US08795479B2 Wafer clamp assembly for holding a wafer during a deposition process 有权
标题翻译：用于在沉积过程中保持晶片的晶片夹组件
公开(公告)号：US08795479B2
公开(公告)日：2014-08-05
申请号：US11456722
申请日：2006-07-11
申请人： Hermann Bichler , Reinhard Hanzlik , Stefan Fries , Frank Mueller , Heinrich Wachinger
发明人： Hermann Bichler , Reinhard Hanzlik , Stefan Fries , Frank Mueller , Heinrich Wachinger
IPC分类号： C23C14/50 , C23C16/458 , H01L21/687
CPC分类号： C23C14/50 , C23C14/34 , C23C16/4585 , H01L21/02631 , H01L21/68721 , H01L21/68728
摘要： A wafer clamp assembly for holding a wafer during a deposition process comprises an outer annular member defining a central recess that has a diameter slightly greater than the diameter of the wafer. A plurality of finger members are carried by the outer annular member and extend radially inwardly from the outer annular member into the central recess, wherein each of the finger members has a free end for contacting the wafer during the deposition process.
摘要翻译：用于在沉积工艺期间保持晶片的晶片夹具组件包括限定中心凹部的外环形构件，该中心凹部具有略大于晶片直径的直径。多个指状构件由外部环形构件承载并且从外部环形构件径向向内延伸到中心凹部中，其中每个指状构件具有用于在沉积工艺期间接触晶片的自由端。

7. 发明授权

US09468963B2 Bending head for bending rod- and pipe-shaped workpieces 有权
标题翻译：用于弯曲杆和管状工件的弯头
公开(公告)号：US09468963B2
公开(公告)日：2016-10-18
申请号：US14003228
申请日：2012-01-13
申请人： Stefan Fries , Jörg Möck , Frank Weiblen , Carina Baier
发明人： Stefan Fries , Jörg Möck , Frank Weiblen , Carina Baier
IPC分类号： B21D7/024 , B21F1/00
CPC分类号： B21D7/024 , B21F1/00
摘要： In a bending head for bending rod-shaped and tubular workpieces, with a retainer that can be rotated about a rotational axis and that carries a bending mandrel at one axial end, and with at least two further tools, which each comprise a retaining body with, at its axial end facing the bending mandrel, a bending pin and which can each be rotated—in each case independently of the other tools—the retaining bodies of the tools are arranged concentrically to the retainer of the bending mandrel and pivotable about its rotational axis.
摘要翻译：在用于弯曲杆状和管状工件的弯曲头中，具有能够围绕旋转轴线旋转并且在一个轴向端部处承载弯曲心轴的保持器，以及至少两个另外的工具，每个工具包括保持体，在其朝向弯曲心轴的轴向端处具有弯曲销，并且每个都可以旋转 - 在每种情况下都独立于其他工具 - 工具的保持体同心地布置到弯曲心轴的保持器并且可围绕其旋转轴。

8. 发明申请

US20070012561A1 WAFER CLAMP ASSEMBLY FOR HOLDING A WAFER DURING A DEPOSITION PROCESS 有权
标题翻译：用于在沉积过程中保持一个水平的水平夹具组件
公开(公告)号：US20070012561A1
公开(公告)日：2007-01-18
申请号：US11456722
申请日：2006-07-11
申请人： Hermann Bichler , Reinhard Hanzlik , Stefan Fries , Frank Mueller , Heinrich Wachinger
发明人： Hermann Bichler , Reinhard Hanzlik , Stefan Fries , Frank Mueller , Heinrich Wachinger
IPC分类号： C23C14/00
CPC分类号： C23C14/50 , C23C14/34 , C23C16/4585 , H01L21/02631 , H01L21/68721 , H01L21/68728
摘要： A wafer clamp assembly for holding a wafer during a deposition process comprises an outer annular member defining a central recess that has a diameter slightly greater than the diameter of the wafer. A plurality of finger members are carried by the outer annular member and extend radially inwardly from the outer annular member into the central recess, wherein each of the finger members has a free end for contacting the wafer during the deposition process.
摘要翻译：用于在沉积工艺期间保持晶片的晶片夹具组件包括限定中心凹部的外环形构件，该中心凹部具有略大于晶片直径的直径。多个指状构件由外部环形构件承载并且从外部环形构件径向向内延伸到中心凹部中，其中每个指状构件具有用于在沉积工艺期间接触晶片的自由端。

9. 发明申请

US20140000335A1 BENDING HEAD FOR BENDING ROD- AND PIPE-SHAPED WORKPIECES 有权
标题翻译：弯曲头和弯管工具弯曲
公开(公告)号：US20140000335A1
公开(公告)日：2014-01-02
申请号：US14003228
申请日：2012-01-13
申请人： Stefan Fries , Jörg Möck , Frank Weiblen , Carina Baier
发明人： Stefan Fries , Jörg Möck , Frank Weiblen , Carina Baier
IPC分类号： B21F1/00
CPC分类号： B21D7/024 , B21F1/00
摘要： In a bending head for bending rod-shaped and tubular workpieces, with a retainer that can be rotated about a rotational axis and that carries a bending mandrel at one axial end, and with at least two further tools, which each comprise a retaining body with, at its axial end facing the bending mandrel, a bending pin and which can each be rotated—in each case independently of the other tools—the retaining bodies of the tools are arranged concentrically to the retainer of the bending mandrel and pivotable about its rotational axis.
摘要翻译：在用于弯曲杆状和管状工件的弯曲头中，具有能够围绕旋转轴线旋转并且在一个轴向端部处承载弯曲心轴的保持器，以及至少两个另外的工具，每个工具包括保持体，在其朝向弯曲心轴的轴向端处具有弯曲销，并且每个都可以旋转 - 在每种情况下都独立于其他工具 - 工具的保持体同心地布置到弯曲心轴的保持器并且可围绕其旋转轴。

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