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1. 发明授权

US11139182B2 Substrate processing apparatus and substrate processing method 有权
公开(公告)号：US11139182B2
公开(公告)日：2021-10-05
申请号：US16214501
申请日：2018-12-10
申请人： Tokyo Electron Limited
发明人： Nobuhiko Mouri , Takanori Obaru , Yasushi Takiguchi , Teruhiko Kodama
IPC分类号： H01L21/67 , H01L21/687 , B08B1/04 , B08B1/00 , H01L21/304 , H01L21/677 , B24B37/30 , B24B37/10
摘要： A substrate processing apparatus includes a substrate holder, a first cleaning body, a first moving mechanism, a second cleaning body, a second moving mechanism, and a controller. The first cleaning body cleans one of the upper surface and the lower surface of the substrate held by the substrate holder by ejecting fluid thereto or by coming into contact therewith. The second cleaning body cleans the other one of the upper surface and the lower surface of the substrate held by the substrate holder by coming into contact therewith. The controller controls the first moving mechanism and the second moving mechanism to perform a both-surface cleaning processing in which the first cleaning body which ejects the fluid to one surface or is in contact with the upper surface and the second cleaning body which is in contact with the lower surface are horizontally moved in synchronization with each other.

2. 发明授权

US09947556B2 Substrate cleaning apparatus, substrate cleaning method, and storage medium 有权
公开(公告)号：US09947556B2
公开(公告)日：2018-04-17
申请号：US14321054
申请日：2014-07-01
申请人： TOKYO ELECTRON LIMITED
发明人： Yasushi Takiguchi , Taro Yamamoto , Hideharu Kyouda , Koshi Muta
IPC分类号： B08B1/04 , B08B3/04 , H01L21/67 , H01L21/687
CPC分类号： H01L21/67051 , H01L21/67046 , H01L21/68792
摘要： There are provided first and second cleaning members which are configured to clean a central zone in a rear surface of a wafer when the wafer held by an absorption pad is horizontally held, and configured to clean a peripheral zone in the rear surface of the wafer when the wafer is held by the spin chuck. Due to the provision of the first and second cleaning members, detergency can be improved as compared with a case in which only one cleaning member is used. The first and second cleaning members are configured to be horizontally turned by a common turning shaft. When the central zone in the rear surface of the wafer is cleaned, the turning shaft is located to be overlapped with the wafer. Since the turning shaft is located by using the moving area of the wafer, a size of an apparatus can be reduced.

3. 发明授权

US10289004B2 Developing apparatus, developing method and storage medium 有权
公开(公告)号：US10289004B2
公开(公告)日：2019-05-14
申请号：US15338638
申请日：2016-10-31
申请人： TOKYO ELECTRON LIMITED
发明人： Kousuke Yoshihara , Hideharu Kyouda , Koshi Muta , Taro Yamamoto , Yasushi Takiguchi
IPC分类号： G03F7/30 , B05D3/12 , B05C11/08 , B05D1/00 , H01L21/67 , B05C5/02 , B05D1/26
摘要： A developing apparatus includes: a substrate holder that hold a substrate horizontally; a developer nozzle that supplies a developer onto the substrate to form a liquid puddle; a turning flow generation mechanism including a rotary member that rotates about an axis perpendicular to the substrate while the rotary member is being in contact with the liquid puddle thereby to generate a turning flow in the liquid puddle of the developer formed on the substrate; and a moving mechanism for moving the turning flow generation mechanism along a surface of the substrate. The line-width uniformity of a pattern can be improved by forming turning flows in a desired region of the substrate and stirring the developer.

4. 发明申请

US20190049845A1 LIQUID PROCESSING APPARATUS 审中-公开
公开(公告)号：US20190049845A1
公开(公告)日：2019-02-14
申请号：US16100609
申请日：2018-08-10
申请人： Tokyo Electron Limited
发明人： Koki Yoshimura , Shogo Takahasi , Yasushi Takiguchi , Taro Yamamoto
IPC分类号： G03F7/16
摘要： Disclosed is a liquid processing apparatus for performing a liquid processing by supplying a processing liquid from a nozzle to a substrate. The apparatus includes: a cup body provided to surround a substrate holding unit; a nozzle arm provided with a nozzle and supported by a support unit; a moving mechanism configured to move the nozzle arm via the support unit between a stand-by position and a processing position; an elevating mechanism configured to move up and down the support unit; a cover member including a top plate portion provided above a driving region and configured to partition the driving region from a region where the substrate is held within the cup body; an opening formed in a portion corresponding to a moving path of the support unit in the top plate portion; and an exhaust mechanism configured to evacuate the driving region.

5. 发明授权

US10014190B2 Liquid processing apparatus 有权
公开(公告)号：US10014190B2
公开(公告)日：2018-07-03
申请号：US14339539
申请日：2014-07-24
申请人： TOKYO ELECTRON LIMITED
发明人： Yasushi Takiguchi , Koki Yoshimura , Taro Yamamoto , Hideharu Kyouda , Koshi Muta
IPC分类号： H01L21/67
CPC分类号： H01L21/67051 , H01L21/6715
摘要： A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

6. 发明授权

US09716002B2 Substrate cleaning method 有权
公开(公告)号：US09716002B2
公开(公告)日：2017-07-25
申请号：US15204068
申请日：2016-07-07
申请人： TOKYO ELECTRON LIMITED
发明人： Yasushi Takiguchi , Taro Yamamoto , Akihiro Fujimoto , Shuuichi Nishikido , Dai Kumagai , Naoto Yoshitaka , Takahiro Kitano , Yoichi Tokunaga
IPC分类号： H01L21/02 , B08B3/02 , H01L21/67 , B08B1/00 , B08B1/04 , B08B5/02 , B08B7/00 , H01L21/687
CPC分类号： H01L21/0209 , B08B1/002 , B08B1/04 , B08B3/02 , B08B5/02 , B08B7/0057 , H01L21/67028 , H01L21/67046 , H01L21/67051 , H01L21/68742 , H01L21/68764
摘要： A disclosed substrate cleaning apparatus for cleaning a back surface of a substrate includes a first substrate supporting portion configured to support the substrate at a first area of a back surface of the substrate, the back surface facing down; a second substrate supporting portion configured to support the substrate at a second area of the back surface of the substrate, the second area being separated from the first area; a cleaning liquid supplying portion configured to supply cleaning liquid to the back surface of the substrate; a drying portion configured to dry the second area of the back surface of the substrate; and a cleaning portion configured to clean a third area of the back surface of the substrate when the substrate is supported by the first substrate supporting portion, the third area including the second area, and a fourth area of the back surface of the substrate when the substrate is supported by the second substrate supporting portion, the fourth area excluding the second area of the back surface.

7. 发明授权

US09568829B2 Developing method, developing apparatus and storage medium 有权
标题翻译：显影方法，显影装置和存储介质
公开(公告)号：US09568829B2
公开(公告)日：2017-02-14
申请号：US14449419
申请日：2014-08-01
申请人： TOKYO ELECTRON LIMITED
发明人： Kousuke Yoshihara , Hideharu Kyouda , Koshi Muta , Taro Yamamoto , Yasushi Takiguchi , Masahiro Fukuda
IPC分类号： B05D3/12 , G03F7/30 , B05C5/02 , B05D1/00 , B05C11/08 , B05D1/26 , H01L21/67
CPC分类号： G03F7/3021 , B05C5/02 , B05C5/027 , B05C11/08 , B05D1/005 , B05D1/26 , G03F7/30 , H01L21/6715
摘要： A developing method includes: horizontally holding an exposed substrate by a substrate holder; forming a liquid puddle on a part of the substrate, by supplying a developer from a developer nozzle; rotating the substrate; spreading the liquid puddle on a whole surface of the substrate, by moving the developer nozzle such that a supply position of the developer on the rotating substrate is moved in a radial direction of the substrate; bringing, simultaneously with the spreading of the liquid puddle on the whole surface of the substrate, a contact part into contact with the liquid puddle, the contact part being configured to be moved together with the developer nozzle and having a surface opposed to the substrate which is smaller than the surface of the substrate. According to this method, an amount of liquid falling down to the outside of the substrate can be inhibited. In addition, since the rotating speed of the substrate can be decreased, spattering of the developer can be inhibited. Further, a throughput can be improved by stirring the developer.
摘要翻译：显影方法包括：通过基板保持器水平保持曝光的基板; 通过从显影剂喷嘴提供显影剂，在基底的一部分上形成液体熔池; 旋转基板; 通过使显影剂喷嘴移动使得旋转基板上的显影剂的供给位置沿基板的径向方向移动，将液体熔池分散在基板的整个表面上; 使液体熔池在基板的整个表面上的扩展同时与接触部分与液体熔池接触，接触部分被构造成与显影剂喷嘴一起移动并且具有与基板相对的表面，小于衬底的表面。根据该方法，能够抑制向基板外侧落下的液体的量。此外，由于可以降低基板的旋转速度，可以抑制显影剂的飞溅。此外，可以通过搅拌显影剂来提高生产量。

8. 发明授权

US11059145B2 Dressing apparatus and dressing method for substrate rear surface polishing member 有权
公开(公告)号：US11059145B2
公开(公告)日：2021-07-13
申请号：US16059344
申请日：2018-08-09
申请人： Tokyo Electron Limited
发明人： Yoshiki Okamoto , Yasushi Takiguchi , Akihiro Kubo , Hayato Hosaka , Ryuto Ozasa
IPC分类号： B24B53/017 , B24B37/20 , B24B37/04 , B24B53/14 , B24B37/10 , B24B27/00 , B24B49/12 , B24B53/007 , B24B53/095
摘要： A dressing apparatus 200 includes a bus member 203 which is equipped with a ceiling plate 201 and a circular or polygonal cylindrical skirt portion 202 provided at a bottom surface of the ceiling plate 201 and which is configured to accommodate a polishing pad 131 from thereabove. The bus member 203 includes a dual fluid nozzle 204 configured to jet a cleaning liquid and a gas onto a polishing surface of the polishing pad 131; a dress board 205 configured to come into contact with the polishing surface of the polishing pad 131; and a rinse nozzle 206 configured to supply a rinse liquid onto a contact surface between the polishing surface of the polishing pad 131 and the dress board 205. A cleaning liquid, a fragment of a grindstone or a sludge is suppressed from being scattered around by the skirt portion 202.

9. 发明授权

US11031261B2 Liquid processing apparatus 有权
公开(公告)号：US11031261B2
公开(公告)日：2021-06-08
申请号：US16014308
申请日：2018-06-21
申请人： TOKYO ELECTRON LIMITED
发明人： Yasushi Takiguchi , Koki Yoshimura , Taro Yamamoto , Hideharu Kyouda , Koshi Muta
IPC分类号： H01L21/67
摘要： A liquid processing apparatus for performing liquid processing with respect to a substrate using processing fluid, includes: a plurality of substrate holding units arranged side by side in a left-right direction; a nozzle configured to supply the processing fluid to the substrate held in each of the substrate holding units; and a nozzle moving mechanism configured to move the nozzle forward and backward in a front-rear direction intersecting an arrangement direction of the substrate holding units between a supplying position in which the processing fluid is supplied to a region including a central portion of the substrate and a waiting position which is defined at a rear side of a row of the substrate holding units opposite to a front side of the row of the substrate holding units at which the substrate is loaded and unloaded.

10. 发明授权

US10168618B2 Liquid processing method and storage medium 有权
公开(公告)号：US10168618B2
公开(公告)日：2019-01-01
申请号：US14919869
申请日：2015-10-22
申请人： Tokyo Electron Limited
发明人： Norihiko Sasagawa , Hiroichi Inada , Yasushi Takiguchi
IPC分类号： B05D3/12 , G03F7/16 , H01L21/67 , G03F7/30 , B05D1/00 , G06F19/00
摘要： A liquid processing method includes: accommodating a substrate horizontally in each of a first processing region and a second processing region, for performing therein a process on the substrate by a processing solution from a nozzle; rotating a rotary body about a vertical axis; keeping a plurality of processing nozzles provided at the rotary body; supplying different kinds of processing solutions to the substrate from the plurality of processing nozzles; holding a processing nozzle selected from the plurality of processing nozzles by a nozzle holder provided at the rotary body; transferring the nozzle holder into selected one of the first and the second processing regions by a nozzle transfer device; and rotating the rotary body by a rotation driving unit so as to allow a front of the nozzle holder in a forward/backward direction thereof to face the selected one of the first and the second processing regions.

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