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1. 发明授权

US10854113B2 Solid freeform fabrication object, internal organ model, and method of manufacturing the same 有权
公开(公告)号：US10854113B2
公开(公告)日：2020-12-01
申请号：US15450720
申请日：2017-03-06
申请人： Yoshihiro Norikane , Tatsuya Niimi , Takashi Matsumura , Hiroshi Iwata , Hiroyuki Naito
发明人： Yoshihiro Norikane , Tatsuya Niimi , Takashi Matsumura , Hiroshi Iwata , Hiroyuki Naito
IPC分类号： G09B23/30 , B29C64/20 , B33Y70/00 , B29C64/112 , B33Y10/00 , B33Y30/00 , B33Y80/00 , B29L31/00 , B29K105/00 , B29L31/40
摘要： A solid freeform fabrication object includes a hydrogel including a polymer, water, and a coloring material inclusion substance.

2. 发明授权

US10442181B2 Hydrogel object and method of manufacturing hydrogel object 有权
公开(公告)号：US10442181B2
公开(公告)日：2019-10-15
申请号：US15209268
申请日：2016-07-13
申请人： Hiroshi Iwata , Tatsuya Niimi , Yoshihiro Norikane , Takashi Matsumura
发明人： Hiroshi Iwata , Tatsuya Niimi , Yoshihiro Norikane , Takashi Matsumura
IPC分类号： B33Y70/00 , B29C64/112 , C08K5/053 , C08K5/05 , B29C64/40 , B33Y10/00 , B29L31/00
摘要： A hydrogel object includes a polymer and water, wherein the rate of mass loss is not greater than 20 percent by mass when the hydrogel object is left undone for one week at 25 degrees C. and relative humidity of 50 percent.

3. 发明授权

US09368374B2 Method of manufacturing semiconductor device 有权
标题翻译：制造半导体器件的方法
公开(公告)号：US09368374B2
公开(公告)日：2016-06-14
申请号：US13131427
申请日：2010-02-23
申请人： Kazunori Hamazaki , Takashi Matsumura , Daisuke Sato , Yasuhiro Suga
发明人： Kazunori Hamazaki , Takashi Matsumura , Daisuke Sato , Yasuhiro Suga
IPC分类号： H01L21/00 , H01L21/56 , H01L23/00
CPC分类号： H01L24/92 , H01L21/563 , H01L24/11 , H01L24/13 , H01L24/14 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/73 , H01L24/75 , H01L24/81 , H01L24/83 , H01L2224/1134 , H01L2224/13017 , H01L2224/13144 , H01L2224/14135 , H01L2224/16225 , H01L2224/16227 , H01L2224/1623 , H01L2224/16238 , H01L2224/27334 , H01L2224/29007 , H01L2224/2919 , H01L2224/32012 , H01L2224/32225 , H01L2224/3224 , H01L2224/73103 , H01L2224/73204 , H01L2224/81191 , H01L2224/81203 , H01L2224/81444 , H01L2224/83192 , H01L2224/83194 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/9211 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01078 , H01L2924/01079 , H01L2924/014 , H01L2924/07802 , H01L2924/07811 , H01L2924/364 , H01L2924/381 , H01L2924/00014 , H01L2924/00 , H01L2224/81 , H01L2224/83 , H01L2924/00012
摘要： A method of manufacturing a semiconductor device is provided. The method includes placing a semiconductor chip by flip-chip mounting on a substrate by using an insulating resin adhesive film (NCF) and preventing overflow of the NCF and the intervention of an insulating resin or an inorganic filler between a bump and an electrode during hot pressing. The method also includes temporarily affixing an NCF of a size that is substantially 60 to 100% the area of a region enclosed with a plurality of bumps of the semiconductor chip arranged in a peripheral alignment, and having a minimum melt viscosity of 2×102 to 1×105 Pa·s, to the region enclosed with a plurality of electrodes of the substrate corresponding to the bumps, and aligning the semiconductor chip and the substrate with each other such that the bumps and the electrodes corresponding thereto are opposed to each other.
摘要翻译：提供一种制造半导体器件的方法。该方法包括通过使用绝缘树脂粘合膜（NCF）将半导体芯片通过倒装芯片安装在基板上，并防止NCF的溢出以及在热处理期间凸块和电极之间的绝缘树脂或无机填料的介入紧迫。该方法还包括临时固定尺寸的NCF，其尺寸基本上为周边排列布置的半导体芯片的多个凸块所包围的区域的面积的60〜100％，并且具有最小熔体粘度为2×102〜 1×105Pa·s，与由凸块相对应的多个基板的电极所围成的区域，使半导体芯片和基板彼此对准，使凸块和与其对应的电极相互对置。

4. 发明授权

US08802776B2 Epoxy resin composition, method for producing composite unit using the epoxy resin composition, and composite unit 有权
标题翻译：环氧树脂组合物，使用该环氧树脂组合物的复合体的制造方法以及复合体
公开(公告)号：US08802776B2
公开(公告)日：2014-08-12
申请号：US13517415
申请日：2010-12-20
申请人： Taichi Koyama , Hironobu Moriyama , Takashi Matsumura , Takayuki Saito
发明人： Taichi Koyama , Hironobu Moriyama , Takashi Matsumura , Takayuki Saito
IPC分类号： C08L63/00 , C08L63/02 , C08L63/04 , H05K1/18 , H01L21/82
CPC分类号： H01L23/293 , C08G59/621 , C08L63/00 , H01L23/3121 , H01L24/13 , H01L24/16 , H01L24/27 , H01L24/29 , H01L24/32 , H01L24/75 , H01L24/81 , H01L24/83 , H01L24/92 , H01L24/94 , H01L2224/1134 , H01L2224/131 , H01L2224/13111 , H01L2224/13144 , H01L2224/13147 , H01L2224/16225 , H01L2224/27334 , H01L2224/2929 , H01L2224/32058 , H01L2224/32225 , H01L2224/73104 , H01L2224/73204 , H01L2224/75251 , H01L2224/75252 , H01L2224/75315 , H01L2224/75316 , H01L2224/81132 , H01L2224/81191 , H01L2224/81203 , H01L2224/83132 , H01L2224/83191 , H01L2224/83192 , H01L2224/83203 , H01L2224/8385 , H01L2224/83862 , H01L2224/83907 , H01L2224/9211 , H01L2224/94 , H01L2924/01012 , H01L2924/01029 , H01L2924/07802 , H01L2924/15788 , H05K1/0269 , H05K3/305 , H05K2201/0133 , H05K2201/0209 , H05K2201/09918 , H05K2201/10674 , H05K2203/0195 , H05K2203/0278 , Y02P70/613 , C08L33/068 , C08L61/06 , H01L2924/0635 , H01L2924/0665 , H01L2924/066 , H01L2924/014 , H01L2924/00014 , H01L2224/27 , H01L2924/01047 , H01L2224/81 , H01L2224/83 , H01L2924/00
摘要： An epoxy resin composition having excellent connection reliability and transparency, a method for manufacturing a composite unit using the epoxy resin composition, and the composite unit, are disclosed. The manufacturing method includes an attaching step of attaching an epoxy resin composition (2) containing a novolak phenolic curing agent, an acrylic elastomer composed of a copolymer containing dimethylacrylamide and hydroxylethyl methacrylate, an epoxy resin and not less than 5 parts by weight to not more than 20 parts by weight of an inorganic filler to 100 parts by weight of the epoxy resin, to a printed circuit board (1) in the form of a sheet. The manufacturing method also includes a temporary loading step of temporarily loading a semiconductor chip (3) and capacitors (4a) to (4d) on the epoxy resin composition (2) and an ultimate pressure bonding step of pressuring the semiconductor chip (3) and capacitors (4a) to (4d) by a thermal bonding head (20) in situ to ultimately pressure bond the semiconductor chip (3) and capacitors (4a) to (4d).
摘要翻译：公开了具有优异的连接可靠性和透明性的环氧树脂组合物，使用该环氧树脂组合物的复合单元的制造方法和复合单元。该制造方法包括将包含酚醛清漆型酚醛固化剂的环氧树脂组合物（2），由含有二甲基丙烯酰胺和甲基丙烯酸羟基乙酯的共聚物构成的丙烯酸类弹性体，环氧树脂和不小于5重量份的附着工序相对于100重量份的环氧树脂，不到20重量份的无机填料，以片状的印刷电路板（1）。该制造方法还包括临时加载环氧树脂组合物（2）上的半导体芯片（3）和电容器（4a）至（4d）的负载步骤以及加压半导体芯片（3）和电容器（4a）至（4d）通过热粘合头（20）原位以最终将半导体芯片（3）和电容器（4a）至（4d）压接。

5. 发明授权

US08441507B2 Exposure device, image forming apparatus, and image forming unit 有权
标题翻译：曝光装置，图像形成装置和图像形成单元
公开(公告)号：US08441507B2
公开(公告)日：2013-05-14
申请号：US12880525
申请日：2010-09-13
申请人： Yoshinori Yamaguchi , Hirohito Yoneyama , Yohei Nishino , Takashi Matsumura , Kiyokazu Mashimo , Katsuhiro Sato
发明人： Yoshinori Yamaguchi , Hirohito Yoneyama , Yohei Nishino , Takashi Matsumura , Kiyokazu Mashimo , Katsuhiro Sato
IPC分类号： G01D15/06
CPC分类号： B41J2/45 , G03G15/04045 , G03G15/326 , G03G2215/0409 , G03G2215/0412
摘要： The present invention provides an annular exposure device, including: plural light emitting members that are provided two-dimensionally along an outer circumferential surface of the annular exposure device, the annular exposure device rotating when the annular exposure device contacts a surface of an image holding member.
摘要翻译：本发明提供了一种环形曝光装置，包括：沿着环形曝光装置的外圆周表面二维设置的多个发光部件，环形曝光装置在环形曝光装置接触图像保持部件的表面时旋转。

6. 发明授权

US08421339B2 Organic electroluminescent device, exposure device, process cartridge, image forming apparatus, display apparatus, and method for driving organic electroluminescent device 有权
标题翻译：有机电致发光器件，曝光设备，处理盒，成像设备，显示设备和用于驱动有机电致发光器件的方法
公开(公告)号：US08421339B2
公开(公告)日：2013-04-16
申请号：US12620182
申请日：2009-11-17
申请人： Yohei Nishino , Hirohito Yoneyama , Yoshinori Yamaguchi , Takashi Matsumura , Kiyokazu Mashimo , Katsuhiro Sato
发明人： Yohei Nishino , Hirohito Yoneyama , Yoshinori Yamaguchi , Takashi Matsumura , Kiyokazu Mashimo , Katsuhiro Sato
IPC分类号： H01L51/52
CPC分类号： B41J2/451 , G03G15/04072 , G03G15/326 , G03G2215/0412 , H01L51/5012 , H01L2251/564
摘要： An organic electroluminescent device includes: a pair of electrodes; a first light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that one of the pair of electrodes serves as an anode; and a second light-emitting region that is disposed between the pair of electrodes, and that emits light when a voltage is applied between the pair of electrodes such that the other of the pair of electrodes serves as an anode.
摘要翻译：一种有机电致发光器件包括：一对电极; 第一发光区域，其设置在所述一对电极之间，并且当在所述一对电极之间施加电压时发光，使得所述一对电极中的一个用作阳极; 以及第二发光区域，其设置在所述一对电极之间，并且当在所述一对电极之间施加电压时发光，使得所述一对电极中的另一个用作阳极。

7. 发明授权

US08011407B2 Compression bonding device 有权
标题翻译：压接装置
公开(公告)号：US08011407B2
公开(公告)日：2011-09-06
申请号：US12461763
申请日：2009-08-24
申请人： Takashi Matsumura
发明人： Takashi Matsumura
IPC分类号： B29C65/02 , B29C65/48 , B32B37/10 , B30B5/02 , B30B15/34
CPC分类号： H05K3/303 , B30B5/02 , B30B15/024 , H01L21/568 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/753 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/75754 , H01L2224/75755 , H01L2224/7598 , H01L2224/81005 , H01L2224/83101 , H01L2224/838 , H01L2224/83907 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/19105 , H05K2201/0133 , H05K2203/0191 , H05K2203/0278 , Y02P70/613 , Y10T156/16 , H01L2924/00 , H01L2224/0401
摘要： A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.
摘要翻译：压接装置具有阻挡构件，使得当按压头被按压被按压物体时，接合部被堤坝构件包围。因此，即使接合部的表面通过按压而凸起，凸起部被阻挡构件阻止，接合部的表面也不会水平延伸。由于不存在接合部的水平延伸，所以被加压物的电气部件不会受到使电气部件水平移动并且电气部件被垂直向下压并连接到基板的端子的力。因此，获得了具有高连接可靠性的电气装置。

8. 发明授权

US07818021B2 Wireless communication terminal and control method thereof 有权
标题翻译：无线通信终端及其控制方法
公开(公告)号：US07818021B2
公开(公告)日：2010-10-19
申请号：US11572631
申请日：2005-07-28
申请人： Mitsuhiro Kitaji , Takashi Matsumura
发明人： Mitsuhiro Kitaji , Takashi Matsumura
IPC分类号： H04B7/00
CPC分类号： H04W52/36 , H04B1/3816
摘要： In a PC card communication terminal that operates supplied with power from a host device, problems such as malfunctions due to a supply voltage drop at the time of high transmission output are prevented from occurring. A baseband processor (1106) selects a transmission-power upper-limit measurement mode when a PC card terminal (1103) is to be controlled for the first time. A supply voltage drop is measured by a voltage measurement circuit (1114) while a load value of a load circuit (1112) is being changed. The load value of the load circuit (1112) when the supply voltage decreases to a permissible lowest supply voltage is obtained. Using a conversion table stored in a memory (1107), the load value is converted into a transmission output and is set as a transmission-output upper limit. In a normal communication mode, a maximum transmission output is restricted based on this transmission-output upper limit.
摘要翻译：在从主机装置供电的PC卡通信终端中，防止由于高传输输出时的电源电压下降而导致的故障等问题。当首次要控制PC卡终端（1103）时，基带处理器（1106）选择发送功率上限测量模式。当负载电路（1112）的负载值正在改变时，由电压测量电路（1114）测量电源电压降。获得当电源电压降低到允许的最低电源电压时负载电路（1112）的负载值。使用存储在存储器（1107）中的转换表，将负载值转换为发送输出，并将其设置为发送 - 输出上限。在正常通信模式中，基于该传输输出上限来限制最大传输输出。

9. 发明申请

US20090314437A1 Compression bonding device 有权
标题翻译：压接装置
公开(公告)号：US20090314437A1
公开(公告)日：2009-12-24
申请号：US12461763
申请日：2009-08-24
申请人： Takashi Matsumura
发明人： Takashi Matsumura
IPC分类号： B32B37/10
CPC分类号： H05K3/303 , B30B5/02 , B30B15/024 , H01L21/568 , H01L21/6835 , H01L24/75 , H01L24/83 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/753 , H01L2224/75314 , H01L2224/75315 , H01L2224/75317 , H01L2224/75754 , H01L2224/75755 , H01L2224/7598 , H01L2224/81005 , H01L2224/83101 , H01L2224/838 , H01L2224/83907 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/19105 , H05K2201/0133 , H05K2203/0191 , H05K2203/0278 , Y02P70/613 , Y10T156/16 , H01L2924/00 , H01L2224/0401
摘要： A compression bonding device has a dam member so that when a pressing head is pressed against an object to be pressed, the bonding part is surrounded by the dam member. Thus, even if the surface of the bonding part bulges by pressing, the bulging part is stopped by the dam member and the surface of the bonding part does not horizontally extend. As a result of the absence of horizontal extension of the bonding part, electric components of the object to be pressed are not subjected to a force that horizontally moves the electric components and the electric components are vertically pressed downward and connected to the terminals of the substrate. Thus, an electric device having high connection reliability is obtained.
摘要翻译：压接装置具有阻挡构件，使得当按压头被按压被按压物体时，接合部被堤坝构件包围。因此，即使接合部的表面通过按压而凸出，凸起部被阻挡构件阻止，接合部的表面也不会水平延伸。由于不存在接合部的水平延伸，所以被加压物的电气部件不会受到使电气部件水平移动并且电气部件被垂直向下压并连接到基板的端子的力。因此，获得了具有高连接可靠性的电气装置。

10. 发明申请

US20090038753A1 MOUNTING METHOD 有权
标题翻译：安装方法
公开(公告)号：US20090038753A1
公开(公告)日：2009-02-12
申请号：US12194796
申请日：2008-08-20
申请人： Takashi Matsumura
发明人： Takashi Matsumura
IPC分类号： B32B37/10
CPC分类号： H05K3/303 , B30B5/02 , B30B15/024 , B30B15/065 , H01L21/568 , H01L24/29 , H01L24/75 , H01L24/83 , H01L25/0657 , H01L25/50 , H01L2224/16225 , H01L2224/2919 , H01L2224/32225 , H01L2224/73204 , H01L2224/75251 , H01L2224/753 , H01L2224/75315 , H01L2224/75317 , H01L2224/75756 , H01L2224/7598 , H01L2224/75988 , H01L2224/81001 , H01L2224/81005 , H01L2224/83192 , H01L2224/83209 , H01L2224/838 , H01L2225/06517 , H01L2225/06572 , H01L2924/00011 , H01L2924/00014 , H01L2924/01004 , H01L2924/01005 , H01L2924/01006 , H01L2924/01019 , H01L2924/01024 , H01L2924/01033 , H01L2924/01047 , H01L2924/01082 , H01L2924/0665 , H01L2924/0781 , H01L2924/07811 , H01L2924/19105 , H01L2924/19106 , H05K2201/0133 , H05K2203/0191 , H05K2203/0278 , H05K2203/1572 , Y02P70/613 , Y10T156/10 , H01L2924/00 , H01L2224/0401
摘要： A mounting method is provided for mounting electric components on both faces of a substrate. Because the electric components on a front face and a rear face of the substrate are simultaneously pressed with first and second pressing rubbers, the electric components can be connected to the front face and the rear face of the substrate at a time. Because the peripheries of the first and second pressing rubbers are surrounded by a dam member when the first and second pressing rubbers deform, the first and second pressing rubbers are dammed by the dam member and not spread. Thus, positional slip of the electric components does not occur. Because the electric components are connected to the substrate at the same positions as at the time of temporary compression bonding, an electric component having high connection reliability is obtained.
摘要翻译：提供了一种用于在基板的两个面上安装电气部件的安装方法。由于用第一和第二按压橡胶同时按压基板前表面和后表面上的电气部件，因此可以一次将电气部件连接到基板的正面和背面。由于当第一和第二按压橡胶变形时，第一和第二按压橡胶的周边被堤坝构件包围，所以第一和第二按压橡胶被坝构件阻挡而不扩展。因此，不会发生电气部件的位置滑移。由于电气部件在与临时压接时相同的位置处连接到基板，因此获得了具有高连接可靠性的电气部件。

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